Renesas R5F5671EHDFM#30
- Part No.:
- R5F5671EHDFM#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
R5F5671EHDFM#30.pdf
- Description:
- RX671, 2MB FLASH MEMORY, TRUSTED
- Quantity:
- Payment:

- Shipping:

Inventory:320
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Product details
Overview
R5F5671EHDFM#30 from Renesas is a 32-bit RXv3 microcontroller with 120 MHz maximum operating frequency, double-precision IEEE-754 FPU, 2 Mbyte on-chip code flash, 384 Kbyte SRAM, and integrated CAN, USB 2.0 FS, QSPIX, SDHI, and capacitive touch sensing - deployed in industrial HMI, smart metering, and secure IoT edge nodes.
For engineers reviewing the R5F5671EHDFM#30 datasheet, R5F5671EHDFM#30 pinout, R5F5671EHDFM#30 application, or R5F5671EHDFM#30 equivalent, key selection considerations include dual-bank flash for safe firmware updates, TSIP-based AES256/SHA256 encryption, 114 GPIO with 5-V tolerance, IEC60730-compliant self-test features, and RTC with battery-backed operation.
Technical Context
The R5F5671EHDFM#30 implements the RXv3 CPU core with 113 instructions, including 21 double-precision floating-point operations and DSP extensions. It supports little-endian or big-endian data arrangement and executes instructions at one per cycle up to 120 MHz.
Its clock system integrates PLL, sub-clock oscillator (32.768 kHz), HOCO (16/18/20 MHz), LOCO (240 kHz), and IWDT-dedicated 120 kHz oscillator - enabling independent domain clocking: ICLK up to 120 MHz, PCLKA up to 120 MHz (for MTU/RSPI/SCIm), PCLKB up to 60 MHz (for most peripherals), and ADCLK up to 60 MHz per A/D unit.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv3 32-bit, 120 MHz max, 707 CoreMark score - enables real-time deterministic control with high computational throughput. |
| Memory | 2 Mbyte dual-bank code flash (no-wait ≤60 MHz, 1-wait ≤120 MHz), 8 Kbyte data flash (100k write cycles), 384 Kbyte SRAM (no-wait), 4 Kbyte standby RAM - supports background programming and fail-safe firmware updates. |
| FPU & Security | IEEE-754 double-precision FPU + Trusted Secure IP (TSIP) with AES128/192/256, RSA, ECC, SHA256, TRNG - delivers cryptographic acceleration and tamper-resistant key management. |
| Peripherals | 2× CAN (ISO11898-1, 32 mailboxes/channel), 1× USB 2.0 FS host/function/OTG, 1× SDHI (25 MB/s), 1× QSPIX (fetch from serial flash), 2× 12-bit S12AD (8+12 ch), CTSU (17-key self-capacitance) - enables rich connectivity and sensor fusion. |
| Power & Temp | 2.7–3.6 V supply, four low-power modes (deep software standby with VBATT backup), –40°C to +105°C (G-version) - suitable for extended-temperature industrial deployments. |
| Package & I/O | PLQP0144KA-B (144-pin LFQFP, 20 × 20 mm, 0.50 mm pitch), 114 general-purpose I/O pins with 5-V tolerance, open-drain, pull-up - provides robust board-level interfacing and layout flexibility. |
Pinout & Package
Package: PLQP0144KA-B - 144-pin Low-Profile Quad Flat Package, 20 × 20 mm body, 0.50 mm pitch, exposed thermal pad, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, AVCC0, AVCC1 | Core & analog power supply | 2.7–3.6 V main supply; separate analog domains ensure noise isolation for ADC and RTC. |
| VBATT | Backup power input | Supplies RTC, sub-clock oscillator, and backup registers during main power loss - enables continuous timekeeping. |
| XTAL/EXTAL | Main crystal oscillator interface | Supports 8–24 MHz external crystal; enables precise timing and PLL reference for system clock generation. |
| RES# | Active-low reset input | Hardware reset assertion; synchronous release ensures reliable initialization under noisy conditions. |
| USB_DP / USB_DM | USB 2.0 full-speed differential pair | Integrated transceiver eliminates external PHY; supports host, function, and OTG roles without external resistors. |
| SD0_CMD / SD0_CLK / SD0_DAT[0:3] | SD host interface signals | Direct 4-bit SD bus interface compliant with SD Physical Layer Spec v3.01 - enables local storage and firmware loading. |
| QSPIX_IO0–IO3 | Quad-SPI memory interface | Enables XIP (execute-in-place) from external quad-SPI flash - reduces boot latency and external memory footprint. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Allows background programming of one bank while executing from the other - essential for zero-downtime field firmware updates. |
| Trusted Secure IP (TSIP) | Hardware-accelerated AES256/SHA256/RSA/ECC with key protection and TRNG - meets IEC62443-3-3 SL2 requirements for secure boot and OTA integrity. |
| IEC60730 Class B support | Includes oscillation-stop detection, CRC-A for flash, IWDTa windowing, A/D self-diagnostic, and register write protection - simplifies functional safety certification. |
| Capacitive Touch Sensing Unit (CTSU) | Supports 17-key self-capacitance or 64-key mutual-capacitance matrix - enables robust, low-power touch HMI without external controllers. |
| Event Link Controller (ELC) | 99 internal event signals routed without CPU intervention - enables deterministic peripheral chaining (e.g., timer-triggered ADC → DMA → UART). |
Applications
| Industrial HMI Panel | Smart Electricity Meter |
|---|---|
|
Use Scenario: Touch-enabled front-panel display with real-time energy monitoring, tariff switching, and secure firmware updates. IC Role / Device Role / Timing Role: Main application MCU handling GUI rendering, capacitive touch decoding, SDHI-based log storage, and TLS-secured cloud communication via CAN/USB. Use Value: Dual-bank flash enables silent over-the-air updates; TSIP accelerates TLS handshake; CTSU eliminates external touch controller BOM cost. |
Use Scenario: Revenue-grade meter with metrology ASIC interface, tamper detection, encrypted data logging, and PLC/RF communication stack. IC Role / Device Role / Timing Role: Secure application processor managing metrology data aggregation, AES-encrypted SD card logging, RTC-corrected time-stamping, and IEC60730 self-tests. Use Value: Built-in TSIP meets DLMS/COSEM security mandates; 12-bit dual A/D units interface metrology ADCs; VBATT-backed RTC ensures billing continuity during outages. |
| Secure Gateway Node | Motor Control Edge Node |
|
Use Scenario: Field gateway aggregating Modbus RTU, CANopen, and BLE devices, forwarding encrypted data to cloud via Ethernet/Wi-Fi. IC Role / Device Role / Timing Role: Protocol translation hub with CAN/USB/RSPI interfaces, TLS offload via TSIP, and secure boot enforcing chain-of-trust. Use Value: Hardware crypto engine reduces CPU load by >70% vs. software-only TLS; multiple serial interfaces eliminate protocol bridge ICs. |
Use Scenario: Compact BLDC drive with Hall/encoder feedback, current sensing, PWM generation, and fault reporting via CAN. IC Role / Device Role / Timing Role: Real-time motor controller using MTU3a complementary PWM with dead-time insertion, TPUa encoder capture, and S12AD current sampling. Use Value: 120 MHz CPU + hardware PWM timers achieve <1 µs loop jitter; integrated analog front-end reduces signal conditioning components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5670EHDFM#30 | Same RX671 Group, identical package and pinout, but 1.5 Mbyte code flash and 256 Kbyte SRAM - no dual-bank flash or TSIP. | Lacks dual-bank flash and TSIP; unsuitable for secure OTA or safety-critical firmware update scenarios. | Select only when cryptographic acceleration and fail-safe updates are not required - lower cost alternative for basic control tasks. |
| R7FA6M2AF3CFP#AA0 | RX671 successor (RA6M2), Arm Cortex-M4F @ 100 MHz, 1 Mbyte flash, 256 Kbyte SRAM, TrustZone, AES-GCM, but no QSPIX or SDHI. | Offers modern Arm ecosystem and TrustZone, but lacks native SD card and quad-SPI fetch - requires external memory controller for XIP. | Prefer for new designs targeting long-term Arm toolchain investment and PSA Certified security; avoid if SD/QSPIX dependency exists. |
Compared with R5F5670EHDFM#30, the R5F5671EHDFM#30 adds dual-bank flash and TSIP for secure field updates; compared with R7FA6M2AF3CFP#AA0, it retains legacy RX tooling and native SD/QSPIX while trading Arm compatibility for proven RXv3 real-time determinism.
Availability
R5F5671EHDFM#30 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, and secure gateway applications requiring stable component supply, long-lifecycle support, and traceable sourcing.
Supply support for R5F5671EHDFM#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX671 Group is designed for high-integrity industrial applications demanding real-time performance, functional safety compliance (IEC60730), and hardware security - targeting HMI, metering, and edge control where deterministic latency and trusted execution are critical.
FAQ
What is the maximum operating frequency and CoreMark score of the R5F5671EHDFM#30?
The R5F5671EHDFM#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark - measured under standard conditions with the RXv3 core, double-precision FPU enabled, and optimized compiler settings. This performance level supports demanding real-time control and signal processing tasks without external co-processors.
Does the R5F5671EHDFM#30 support secure firmware updates?
Yes, the R5F5671EHDFM#30 supports secure firmware updates via its dual-bank flash architecture and Trusted Secure IP (TSIP). The dual-bank configuration allows one bank to run active firmware while the other is reprogrammed in background; TSIP provides hardware-accelerated AES256 decryption and SHA256 signature verification to validate update integrity before installation.
What package type and pin count does the R5F5671EHDFM#30 use?
The R5F5671EHDFM#30 uses the PLQP0144KA-B package: a 144-pin Low-Profile Quad Flat Package with 20 × 20 mm body size, 0.50 mm pitch, and exposed thermal pad. It provides 114 general-purpose I/O pins, including 20 with 5-V tolerance, supporting flexible peripheral routing and robust industrial interfacing.
Which communication interfaces are integrated into the R5F5671EHDFM#30?
The R5F5671EHDFM#30 integrates CAN (2 channels, ISO11898-1), USB 2.0 FS host/function/OTG, SD host interface (SDHI), Quad-SPI (QSPIX), multiple SCI/RSPI channels, I²C (RIIC/RIICHS), and RSCI with Manchester encoding. These interfaces enable direct connectivity to sensors, displays, storage, fieldbuses, and wireless modules without external bridge ICs.
Is the R5F5671EHDFM#30 qualified for industrial temperature range?
Yes, the R5F5671EHDFM#30 is rated for the extended industrial temperature range of –40°C to +105°C (G-version), validated across full voltage (2.7–3.6 V) and frequency (up to 120 MHz) ranges. This qualification covers operation of all integrated peripherals including CAN, USB, SDHI, and TSIP - making it suitable for harsh environments like factory automation and outdoor metering.
R5F5671EHDFM#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LQFP
- Series:
- RX671
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RXv3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- I2C, LINbus, QSPI, SCI, SPI, USB
- Peripherals:
- Capacitive Touch, DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 44
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 10x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F5671EHDFM#30 FAQ
1.How can I place an order for R5F5671EHDFM#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F5671EHDFM#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F5671EHDFM#30 reliable?
The price and inventory of R5F5671EHDFM#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F5671EHDFM#30 is usually 5 days.
3.What payment methods are accepted for R5F5671EHDFM#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F5671EHDFM#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F5671EHDFM#30?
R5F5671EHDFM#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F5671EHDFM#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F5671EHDFM#30?
For technical support, including R5F5671EHDFM#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F5671EHDFM#30 requirements.
6.How does Aetrix verify that R5F5671EHDFM#30 is sourced from the original manufacturer or authorized distributors?
All R5F5671EHDFM#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F5671EHDFM#30 meets industry standards.
7.What is the process for return or replacement of R5F5671EHDFM#30?
All R5F5671EHDFM#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F5671EHDFM#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F5671EHDFM#30 part is unused and in its original packaging.
Return procedure for R5F5671EHDFM#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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