Renesas R5F5671EHDLE#20

Overview

R5F5671EHDLE#20 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank capability, 384 KB SRAM (no wait states), and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart metering systems requiring real-time control and secure firmware updates.

For engineers reviewing the R5F5671EHDLE#20 datasheet, R5F5671EHDLE#20 pinout, R5F5671EHDLE#20 application, or R5F5671EHDLE#20 equivalent, key selection criteria include its 145-pin TFLGA (0.65-mm pitch) package, IEC60730-compliant safety features (TSIP, CRC, self-diagnostic A/D), RTC with battery backup, and support for background programming of both code and data flash memory.

Technical Context

The R5F5671EHDLE#20 implements the RXv3 CPU core with 113 instructions, including DSP and floating-point extensions, and supports little-endian or big-endian data arrangement. Its clock system integrates PLL, HOCO (16/18/20 MHz), LOCO (240 kHz), and sub-clock oscillator (32.768 kHz), enabling independent domain clocks: ICLK up to 120 MHz for CPU/QSPIX, PCLKA up to 120 MHz for MTU/RSPI, and PCLKB up to 60 MHz for most peripherals including A/D converters.

It features three DMA controllers - DMACAb (8 channels), EXDMACa (2 channels), and DTCb (1 channel) - coordinated via Event Link Controller (ELC) for hardware-triggered transfers without CPU intervention. The MCU includes two 12-bit A/D units (S12ADFa) with per-channel sampling time control, self-diagnostic voltage generation, and analog input disconnection detection - all synchronized to dedicated ADCLK domains (PCLKC/PCLKD).

Key Specifications

Pinout & Package

Package: PTLG0145JC-A - 145-pin Thin Fine-Pitch Land Grid Array, 9 × 9 mm body, 0.65-mm pitch, 0.75-mm height, RoHS-compliant, lead-free matte tin finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F5670EHDFP#30 and R5F566TEHDFP#30, the R5F5671EHDLE#20 delivers unique integration of SDHI + QSPIX + TSIP + CTSU in a 145-pin package - enabling secure, touch-enabled, data-logging edge nodes where peripheral density and cryptographic agility are critical.

Availability

R5F5671EHDLE#20 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, home automation gateways, and portable medical devices requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F5671EHDLE#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX671 Group is designed for secure, real-time industrial edge applications - combining high-performance RXv3 core, functional safety features (IEC60730), and rich connectivity (CAN, USB, SD, QSPIX) in compact packages.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F5671EHDLE#20?

The R5F5671EHDLE#20 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark under benchmark conditions. This performance stems from the RXv3 CPU core's efficient instruction pipeline, double-precision FPU, and zero-wait-state access to 384 KB SRAM - making it suitable for deterministic real-time tasks in industrial control and HMI applications where computational throughput matters.

Does the R5F5671EHDLE#20 support secure firmware updates and cryptographic operations?

Yes, the R5F5671EHDLE#20 integrates Trusted Secure IP (TSIP) supporting AES-128/192/256, RSA, ECC, SHA256, MD5, GHASH, and a true random number generator. It enables secure boot verification, encrypted OTA updates, and key protection - all accelerated in hardware to avoid software bottlenecks. These capabilities are validated for IEC60730 Class B compliance and used in R5F5671EHDLE#20-based smart meters and medical devices requiring data integrity.

What package type and pin count does the R5F5671EHDLE#20 use?

The R5F5671EHDLE#20 uses the PTLG0145JC-A package: a 145-pin Thin Fine-Pitch Land Grid Array measuring 9 × 9 mm with 0.65-mm pitch. It provides 111 general-purpose I/O pins - including 20 that are 5-V tolerant and support open-drain operation - along with dedicated pins for USB, SD, QSPIX, CAN, and RTC backup. This package enables high peripheral density in space-constrained industrial modules.

Can the R5F5671EHDLE#20 execute code directly from external serial flash memory?

Yes, the R5F5671EHDLE#20 includes a Quad-SPI memory interface (QSPIX) supporting extended SPI, dual-SPI, and quad-SPI protocols. It allows direct XIP (execute-in-place) from compatible serial flash devices - eliminating the need to copy firmware into internal RAM. This feature reduces boot latency and memory pressure, and is commonly used in R5F5671EHDLE#20-based gateways and edge nodes where fast, secure firmware loading is essential.

What analog and timing peripherals are integrated into the R5F5671EHDLE#20?

The R5F5671EHDLE#20 integrates two independent 12-bit A/D converters (S12ADFa) - one with 8 channels, the other with 12 - each supporting self-diagnostic voltage generation and analog input disconnection detection. It also includes a precision RTC with battery backup (VBATT), a ±1°C internal temperature sensor digitized by the A/D unit, and 25 timers including MTU3a (for 3-phase PWM), TPUa, CMTW, and IWDTa with windowing - all synchronized to domain-specific clocks (PCLKC/PCLKD/ICLK).