Renesas R5F5671EHDNE#30
- Part No.:
- R5F5671EHDNE#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 48-WFQFN Exposed Pad
- Datasheet:
-
R5F5671EHDNE#30.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 48WFQFN
- Quantity:
- Payment:

- Shipping:

Inventory:386
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Product details
Overview
R5F5671EHDNE#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart metering systems requiring secure, low-power, real-time control.
For engineers reviewing the R5F5671EHDNE#30 datasheet, R5F5671EHDNE#30 pinout, R5F5671EHDNE#30 application, or R5F5671EHDNE#30 equivalent, key selection criteria include its 145-pin TFLGA (0.65-mm pitch) package, TSIP-based AES256/SHA256 encryption, IEC60730-compliant self-diagnostic features, and RTC with battery-backed operation for time-critical embedded deployments.
Technical Context
The R5F5671EHDNE#30 implements the RXv3 CPU core with collective register bank save, memory protection unit (MPU), and JTAG/FINE debug interfaces. Its clock system integrates PLL, sub-clock oscillator (32.768 kHz), and dedicated 120-kHz IWDT oscillator - enabling independent watchdog timing and precise RTC calibration.
Peripheral subsystems include dual 12-bit A/D converters (8+12 channels), MTU3a with complementary PWM for 3-phase inverter control, EXDMACa for high-throughput offload, and QSPIX supporting quad-SPI fetch from serial flash - all synchronized to domain-specific clocks (ICLK up to 120 MHz, PCLKA up to 120 MHz, PCLKB up to 60 MHz).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv3 32-bit, 120 MHz max - delivers 707 CoreMark; supports little/big-endian data and IEEE-754 double-precision FPU for deterministic math-intensive firmware. |
| Memory | 2 MB code flash (dual-bank, BGO programmable), 8 KB data flash (100k erase cycles), 384 KB SRAM (no-wait at 120 MHz), 4 KB standby RAM - enables robust firmware updates and deep-sleep retention. |
| Package & Pins | TFLGA-145 (9 × 9 mm, 0.65-mm pitch), 111 GPIOs with 5-V tolerance, open-drain, pull-up - supports compact PCB layout with mixed-voltage peripheral interfacing. |
| Security & Safety | Trusted Secure IP (TSIP) with AES128/192/256, SHA256, TRNG, and IEC60730-compliant diagnostics (CRC, oscillation detection, A/D self-test) - meets industrial functional safety requirements. |
| Connectivity | 2× CAN (ISO11898-1, 32 mailboxes/channel), USB 2.0 FS host/function/OTG, SDHI (25 MB/s), QSPIX, 13× SCI, 3× RSPId, RIICHS (3.4 Mbps) - enables multi-protocol edge node integration. |
| Timers & ADC | MTU3a (9-channel, complementary PWM), TPUa (6-channel), CMTW (32-bit), dual 12-bit S12AD (0.48 µs/ch, disconnection detection) - supports motor control, sensor fusion, and precise event-triggered sampling. |
Pinout & Package
Package: TFLGA-145 (PTLG0145JC-A), 9 × 9 mm, 0.65-mm pitch, 111 I/O pins, 5-V tolerant inputs, open-drain outputs, internal pull-ups.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Core & analog power supply | 2.7–3.6 V main supply; separate analog domains enable noise-isolated ADC operation. |
| VBATT | Backup power input | Enables RTC and backup registers during main power loss - critical for time-stamped logging and tamper detection. |
| XTAL / EXTAL | Main crystal oscillator terminals | Supports 8–24 MHz external resonator; paired with PLL for stable 120 MHz ICLK generation. |
| RTCIN / RTCOUT | Sub-clock oscillator interface | Connects 32.768 kHz crystal for battery-backed real-time clock with ±30 sec/year accuracy. |
| USB_DP / USB_DM | USB 2.0 full-speed differential pair | Integrated transceiver eliminates external PHY; supports host, device, and OTG modes without pull-up resistors. |
| QSPIX_IO0–IO3 | Quad-SPI data lines | Enable 4-line x1/x2/x4 read/write/fetch from serial NOR flash - accelerates boot and firmware overlay loading. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Allows background programming while executing from alternate bank - enables zero-downtime firmware updates in field-deployed devices. |
| Capacitive touch sensing (CTSUa) | Supports 17 self-capacitance keys or 64 mutual-capacitance keys - delivers robust, low-EMI HMI without external ICs or shielding. |
| IEC60730-compliant diagnostics | Includes oscillator stoppage detection, CRC calculation accelerator (CRCA), A/D self-test, and register write protection - satisfies Class B safety certification requirements. |
| Event Link Controller (ELC) | 99 internal event signals routed without CPU intervention - enables deterministic, low-latency peripheral chaining (e.g., timer trigger → ADC start → DMA transfer). |
| SD host interface (SDHI) | Complies with SD Physical Layer Spec v3.01 and SDIO v3.00 - supports 4-bit SD cards and SDIO Wi-Fi/BT modules at 25 MB/s high-speed mode. |
Applications
| Industrial HMI Panel | Smart Energy Meter |
|---|---|
Use Scenario: Touch-enabled display panel controlling PLCs and sensors in factory automation cabinets. IC Role / Device Role / Timing Role: Main application MCU handling GUI rendering, capacitive touch decoding, CAN bus communication with field devices, and RTC-synchronized data logging. Use Value: Integrated CTSUa eliminates external touch controller; dual CAN channels enable redundant fieldbus connectivity; TSIP ensures firmware integrity against tampering. | Use Scenario: Revenue-grade electricity meter with tariff switching, tamper detection, and remote firmware update via cellular modem. IC Role / Device Role / Timing Role: System-on-chip managing metrology ADC interface, secure key storage, SD card-based log storage, and time-of-use billing with battery-backed RTC. Use Value: IEC60730 diagnostics validate A/D converter health; 2 MB flash accommodates encrypted OTA update images; VBATT pin sustains RTC during mains outage. |
| Home Automation Gateway | Motor Drive Controller |
Use Scenario: Multi-protocol hub bridging Zigbee, BLE, and wired RS-485 devices to cloud platforms. IC Role / Device Role / Timing Role: Central protocol translator running concurrent stacks: USB CDC for PC configuration, SDHI for local config backup, QSPIX for fast boot image retrieval. Use Value: USB 2.0 FS + SDHI + QSPIX coexistence enables seamless provisioning; RIICHS (3.4 Mbps) supports high-bandwidth sensor fusion over I²C. | Use Scenario: Compact inverter for HVAC compressors using space-vector PWM and thermal monitoring. IC Role / Device Role / Timing Role: Real-time motion controller generating complementary PWM waveforms via MTU3a, sampling temperature sensor and current shunt ADCs synchronously. Use Value: MTU3a's dead-time compensation and automatic phase-shift prevent shoot-through; 12-bit S12AD unit 1 measures chip temperature with ±1°C precision. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F5670EDHFB#30 | Same RX671 Group, 100-pin LFQFP, 1 MB flash, 256 KB SRAM, no SDHI or QSPIX | Lacks SD host and quad-SPI interfaces; suitable for cost-sensitive CAN/USB-only nodes without local storage | Select when footprint and BOM cost constrain require smaller package and reduced peripheral count. |
| R5F566TEADFP#30 | RX66T Group, 100-pin LQFP, 120 MHz, 1 MB flash, 192 KB SRAM, no TSIP or CTSU | Optimized for motor control (3× MTU3) but lacks encryption, touch sensing, and SD/QSPIX - targets inverters without security or HMI needs | Choose for pure motor drive applications where advanced security and storage are unnecessary. |
Compared with R5F5671EHDNE#30, the R5F5670EDHFB#30 reduces package size and memory but sacrifices SD/QSPIX; the R5F566TEADFP#30 trades security and HMI features for enhanced PWM timing resolution - making R5F5671EHDNE#30 optimal for secure, storage-equipped, human-interfaced industrial edge nodes.
Availability
R5F5671EHDNE#30 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, home gateway, motor control, and secure IoT edge applications requiring stable component supply across long-lifecycle production programs.
Supply support for R5F5671EHDNE#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.
The RX671 Group targets high-integrity industrial applications demanding real-time performance, functional safety, and hardware-accelerated security - with R5F5671EHDNE#30 delivering the full feature set in a compact 9×9 mm TFLGA package.
FAQ
What is the maximum operating frequency and CoreMark score of the R5F5671EHDNE#30?
The R5F5671EHDNE#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under benchmark conditions. This performance stems from its RXv3 CPU core with optimized pipeline, double-precision FPU, and zero-wait-state access to 384 KB SRAM - enabling deterministic execution for real-time industrial firmware. The R5F5671EHDNE#30 maintains this throughput across voltage (2.7–3.6 V) and temperature (–40°C to +85°C) ranges specified for the D-version.
Does the R5F5671EHDNE#30 support secure firmware updates and cryptographic operations?
Yes, the R5F5671EHDNE#30 integrates Trusted Secure IP (TSIP) with hardware-accelerated AES128/192/256, SHA256, RSA, ECC, and a true-random number generator (TRNG). It supports secure boot, encrypted OTA updates, and key protection against illicit copying. These capabilities are validated per IEC60730 Class B requirements, and the R5F5671EHDNE#30 includes register write protection and CRC acceleration to ensure runtime integrity - making it suitable for certified industrial and energy applications.
What package type and pin count does the R5F5671EHDNE#30 use?
The R5F5671EHDNE#30 uses a 145-pin TFLGA package (PTLG0145JC-A), measuring 9 × 9 mm with 0.65-mm pitch. It provides 111 general-purpose I/O pins, including 20 with 5-V tolerance, configurable pull-ups, and open-drain outputs. This package is distinct from other RX671 variants (e.g., 144-pin LFQFP or 100-pin TFLGA) and is specifically designated for high-peripheral-count designs requiring SDHI, QSPIX, and dual CAN in minimal footprint.
Can the R5F5671EHDNE#30 operate with battery backup for RTC and registers?
Yes, the R5F5671EHDNE#30 supports battery backup via the VBATT pin, maintaining operation of the sub-clock oscillator, real-time clock (RTC), and backup registers during main power loss. The RTC retains timekeeping accuracy (±30 sec/year) and supports alarm, periodic, and carry interrupts - essential for timestamped logging, tamper detection, and scheduled wake-up in energy-metering and industrial monitoring systems using the R5F5671EHDNE#30.
Which communication interfaces are supported by the R5F5671EHDNE#30 for industrial networking?
The R5F5671EHDNE#30 supports CAN (2 channels, ISO11898-1 compliant, 32 mailboxes per channel), USB 2.0 Full-Speed host/function/OTG, SD host interface (25 MB/s), QSPIX for serial flash, and multiple UART/SPI/I²C variants (including RIICHS at 3.4 Mbps). These interfaces enable robust industrial networking - e.g., CAN for fieldbus connectivity, USB for configuration, SD for local data storage, and QSPIX for fast firmware loading - all integrated into a single R5F5671EHDNE#30 die without external transceivers.
R5F5671EHDNE#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 48-WFQFN Exposed Pad
- Series:
- RX671
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RXv3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- I2C, LINbus, QSPI, SCI, SPI, UART/USART
- Peripherals:
- Capacitive Touch, DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 33
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 384K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 8x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F5671EHDNE#30 FAQ
1.How can I place an order for R5F5671EHDNE#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F5671EHDNE#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F5671EHDNE#30 reliable?
The price and inventory of R5F5671EHDNE#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F5671EHDNE#30 is usually 5 days.
3.What payment methods are accepted for R5F5671EHDNE#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F5671EHDNE#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F5671EHDNE#30?
R5F5671EHDNE#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F5671EHDNE#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F5671EHDNE#30?
For technical support, including R5F5671EHDNE#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F5671EHDNE#30 requirements.
6.How does Aetrix verify that R5F5671EHDNE#30 is sourced from the original manufacturer or authorized distributors?
All R5F5671EHDNE#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F5671EHDNE#30 meets industry standards.
7.What is the process for return or replacement of R5F5671EHDNE#30?
All R5F5671EHDNE#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F5671EHDNE#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F5671EHDNE#30 part is unused and in its original packaging.
Return procedure for R5F5671EHDNE#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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