Renesas R5F5671EHGFB#30

Overview

R5F5671EHGFB#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SDHI, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart metering systems requiring real-time control and secure firmware updates.

For engineers reviewing the R5F5671EHGFB#30 datasheet, R5F5671EHGFB#30 pinout, R5F5671EHGFB#30 application, or R5F5671EHGFB#30 equivalent, key selection criteria include its 145-pin TFLGA (0.65-mm pitch) package, -40°C to +105°C G-grade temperature rating, TSIP-based AES256/SHA256 encryption, and IEC60730-compliant self-test features for functional safety-critical firmware.

Technical Context

The R5F5671EHGFB#30 implements the RXv3 CPU core with 113 instructions, including DSP and floating-point extensions, and supports little-endian or big-endian data arrangement. Its memory subsystem integrates 2 MB dual-bank flash (1-wait at 120 MHz), 384 KB zero-wait SRAM, and 8 KB data flash rated for 100,000 erase/write cycles.

Peripheral architecture includes three independent clock domains (ICLK up to 120 MHz, PCLKA up to 120 MHz, PCLKB up to 60 MHz), enabling concurrent high-speed execution and peripheral operation. The ELC (Event Link Controller) enables hardware-triggered inter-module coordination without CPU intervention - critical for deterministic timing in motor control and sensor fusion.

Key Specifications

Pinout & Package

Package: TFLGA-145 (PTLG0145JC-A), 9 × 9 mm body, 0.65-mm pitch, 145-terminal grid array with exposed thermal pad. Pinout validated per Renesas R01DS0373EJ0120 Rev.1.20, Table 1.2 and Section 5 "Pin Functions".

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F5671EHGFB#30, the R5F5670EHGFB#30 offers identical footprint and real-time performance but sacrifices secure boot and firmware encryption, while the R5F566TEHGFB#30 trades HMI/metering features for higher PWM resolution and motor-specific timers - neither is pin-compatible nor functionally interchangeable without firmware and layout changes.

Availability

R5F5671EHGFB#30 is available at Aetrix Electronics and suitable for industrial HMI panels, smart electricity meters, programmable logic controllers, and home energy gateways requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F5671EHGFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX671 Group is designed for high-integrity industrial applications demanding real-time responsiveness, functional safety compliance (IEC60730), and secure firmware execution - targeting HMI, metering, and gateway devices where reliability and cryptographic trust are mandatory.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F5671EHGFB#30?

The R5F5671EHGFB#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under benchmark conditions. This performance stems from the RXv3 CPU core's optimized pipeline, double-precision FPU, and zero-wait-state access to 384 KB SRAM - enabling deterministic real-time response in industrial control loops.

Does the R5F5671EHGFB#30 support secure firmware updates and IEC60730 compliance?

Yes, the R5F5671EHGFB#30 includes Trusted Secure IP (TSIP) with AES256, SHA256, and TRNG for authenticated firmware signing and decryption. It also provides built-in IEC60730 Class B support via oscillation-stop detection, CRC-A, IWDTa windowing, A/D self-diagnostic, and register write protection - all documented in R01DS0373EJ0120.

What package type and thermal characteristics does the R5F5671EHGFB#30 use?

The R5F5671EHGFB#30 uses the PTLG0145JC-A package: a 145-pin TFLGA with 9 × 9 mm body, 0.65-mm pitch, and exposed thermal pad. It is rated for the G-grade temperature range of –40°C to +105°C, validated for continuous operation in industrial enclosures with natural convection cooling.

Which communication interfaces are integrated into the R5F5671EHGFB#30 for industrial connectivity?

The R5F5671EHGFB#30 integrates CAN (2 channels, 32 mailboxes), USB 2.0 FS host/function/OTG, SD host interface (25 MB/s), Quad-SPI (QSPIX) for serial flash, and multiple SCI/RSPI/I2C variants - enabling robust fieldbus, removable media, secure boot, and wireless module interfacing in a single chip.

How does the R5F5671EHGFB#30 handle analog sensing and timing-critical functions?

The R5F5671EHGFB#30 includes two 12-bit ADC units (8+12 channels), a ±1°C on-die temperature sensor, and 25 timers - including MTU3a (9-channel PWM with dead-time control) and CMTW (32-bit). Its Event Link Controller (ELC) synchronizes ADC triggers to PWM edges or external events, ensuring precise timing for motor control or energy measurement.