Renesas R5F5671EHGFM#30

Overview

R5F5671EHGFM#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI, smart metering, and motor control systems requiring real-time processing and functional safety.

For engineers reviewing the R5F5671EHGFM#30 datasheet, R5F5671EHGFM#30 pinout, R5F5671EHGFM#30 application, or R5F5671EHGFM#30 equivalent, key selection considerations include its 145-pin TFLGA (0.65-mm pitch) package, IEC60730-compliant self-test features, TSIP-based AES256/SHA256 encryption, and 12-bit dual A/D converter with analog input disconnection detection.

Technical Context

The R5F5671EHGFM#30 implements the RXv3 CPU core with 113 instructions, including DSP and floating-point extensions, and supports little-endian or big-endian data arrangement. Its clock system integrates PLL, HOCO (16/18/20 MHz), LOCO (240 kHz), and sub-clock oscillator (32.768 kHz), enabling independent domain clocks: ICLK up to 120 MHz for CPU/QSPIX, PCLKA up to 120 MHz for MTU/RSPI/RIICHS, and PCLKB up to 60 MHz for most peripherals and ADCLK.

It employs a modular low-power architecture with four modes (sleep, all-module clock stop, software standby, deep software standby), battery-backed RTC and registers via VBATT, and MPU with eight configurable protection areas (minimum 16-byte granularity). The ELC interlinks 99 internal event signals - e.g., timer overflow triggering A/D conversion - eliminating CPU intervention for deterministic timing-critical sequences.

Key Specifications

Pinout & Package

Package: PTLG0145JC-A - 145-pin Thin Fine-Pitch Land Grid Array, 9 × 9 mm body, 0.65-mm pitch, 0.75-mm height, RoHS-compliant, moisture sensitivity level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F5671EHGFM#30, the R5F5670EHGFM#30 trades flash capacity and QSPIX for lower cost, while the R5F566TEHGFM#30 shifts focus to motor-specific peripherals at the expense of security and storage interfaces - making R5F5671EHGFM#30 the balanced choice for secure, connected, storage-rich industrial edge nodes.

Availability

R5F5671EHGFM#30 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, and motor control applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing from Renesas-authorized channels.

Supply support for R5F5671EHGFM#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, infrastructure, and IoT markets.

The RX671 Group is designed for high-integrity industrial applications demanding real-time performance, functional safety (IEC60730), and secure connectivity - combining RXv3 CPU efficiency with integrated USB, SD, CAN, and hardware cryptography.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F5671EHGFM#30?

The R5F5671EHGFM#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark under benchmark conditions. This performance stems from the RXv3 CPU core's 113-instruction set, dual-issue capability for select operations, and zero-wait-state access to 384 KB SRAM at full speed - enabling deterministic real-time response in industrial control loops.

Does the R5F5671EHGFM#30 support secure boot and cryptographic acceleration?

Yes, the R5F5671EHGFM#30 integrates Trusted Secure IP (TSIP) providing hardware-accelerated AES128/192/256, SHA256, MD5, GHASH, RSA, ECC, and a true random number generator (TRNG). These features enable secure boot verification, encrypted firmware updates, and TLS offload - all critical for protecting R5F5671EHGFM#30-based devices against cloning and unauthorized firmware modification.

What package type and pin count does the R5F5671EHGFM#30 use?

The R5F5671EHGFM#30 uses the PTLG0145JC-A package: a 145-pin Thin Fine-Pitch Land Grid Array with 9 × 9 mm body size and 0.65-mm pitch. It provides 111 general-purpose I/O pins, of which 20 are 5-V tolerant and all support open-drain output and internal pull-up - ideal for interfacing with legacy industrial sensors and actuators.

How does the R5F5671EHGFM#30 handle analog-to-digital conversion?

The R5F5671EHGFM#30 integrates two independent 12-bit A/D converters (S12ADFa units): Unit 0 with 8 channels and Unit 1 with 12 channels. Each supports 8/10/12-bit resolution, 0.42–0.48 µs conversion time, self-diagnostic voltage generation, and analog input disconnection detection - ensuring reliable metrology in R5F5671EHGFM#30-based smart meters and sensor hubs.

Is the R5F5671EHGFM#30 qualified for extended temperature operation?

Yes, the R5F5671EHGFM#30 is rated for –40°C to +105°C operation (G-version), meeting industrial-grade thermal requirements. Its on-chip temperature sensor (±1°C relative precision) feeds into the Unit 1 A/D converter, enabling real-time thermal derating and fan control - a key capability for R5F5671EHGFM#30 deployments in unventilated enclosures or outdoor metering equipment.