Renesas R5F5671EHGFP#30

Overview

R5F5671EHGFP#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI, smart metering, and motor control systems requiring real-time performance and functional safety.

For engineers reviewing the R5F5671EHGFP#30 datasheet, R5F5671EHGFP#30 pinout, R5F5671EHGFP#30 application, or R5F5671EHGFP#30 equivalent, key selection criteria include its 145-pin TFLGA (0.65-mm pitch) package, IEC60730-compliant self-test features (CRC, IWDTa, A/D self-diagnostic), TSIP-based AES256/SHA256 encryption, and RTC with battery-backed time capture across three pins.

Technical Context

The R5F5671EHGFP#30 implements the RXv3 CPU core with collective register bank save, memory protection unit (MPU), and JTAG/FINE debug interfaces. Its clock system integrates PLL, sub-clock oscillator (32.768 kHz), and dedicated 120-kHz IWDTa oscillator - enabling independent watchdog operation during deep software standby.

Peripheral architecture includes EXDMACa (2-channel extended DMA), DTCb (1-channel data transfer controller), and ELC (event link controller) for CPU-free inter-module triggering. The MCU supports dual-bank flash programming during execution and background data flash erase (100,000 cycles), with PCLKA/PCLKB domain separation allowing peripheral clocks up to 120 MHz (MTU, RSPI) and 60 MHz (S12AD, RIIC) independently of ICLK.

Key Specifications

Pinout & Package

Package: TFLGA-145 (PTLG0145JC-A), 9 × 9 mm body, 0.65-mm pitch, 145-terminal land grid array with exposed thermal pad. Pin mapping validated per Renesas R01DS0373EJ0120 Rev.1.20, Table 1.2 (Function Comparison by Package) and Figure 1.1 (Pin Assignment).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F5671EHGFP#30, the R5F5670EHGFP#30 offers identical real-time capability and package compatibility at lower memory cost, while the R5F566TEHGFP#30 trades connectivity and security for superior motor-control timing precision - making R5F5671EHGFP#30 the balanced choice for connected, secure, and feature-rich industrial edge nodes.

Availability

R5F5671EHGFP#30 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, and motor control applications requiring stable component supply, long-term lifecycle assurance, and compliance-ready security features.

Supply support for R5F5671EHGFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The RX671 Group targets high-integrity industrial edge devices - integrating functional safety (IEC60730), security (TSIP), and rich connectivity (USB, SDHI, CAN, QSPIX) into a single 120-MHz 32-bit MCU platform.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F5671EHGFP#30?

The R5F5671EHGFP#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under benchmark conditions. This performance stems from the RXv3 CPU core's optimized pipeline, collective register bank save, and zero-wait-state access to 384 KB SRAM. The R5F5671EHGFP#30 sustains this speed across full-voltage range (2.7–3.6 V) and temperature (–40°C to +105°C), making it suitable for deterministic real-time tasks in demanding environments.

Does the R5F5671EHGFP#30 support secure firmware updates and cryptographic acceleration?

Yes, the R5F5671EHGFP#30 integrates Trusted Secure IP (TSIP) hardware acceleration for AES128/192/256, SHA256, RSA, ECC, and TRNG - enabling fast, low-power secure boot and OTA firmware validation. Its dual-bank flash allows background programming of new firmware while executing from the active bank, and TSIP offloads crypto operations from the CPU. These capabilities are fully leveraged in the R5F5671EHGFP#30 to meet IEC60730 Class B requirements without software-only compromises.

What package type and pin count does the R5F5671EHGFP#30 use?

The R5F5671EHGFP#30 uses a 145-pin TFLGA package (PTLG0145JC-A), measuring 9 × 9 mm with 0.65-mm pitch and an exposed thermal pad. It provides 111 general-purpose I/O pins - 20 of which are 5-V tolerant - along with dedicated signals for USB, SDHI, QSPIX, CAN, and capacitive touch. This package is validated in Renesas documentation R01DS0373EJ0120 and matches the pinout of other RX671 Group variants in the same footprint.

Can the R5F5671EHGFP#30 operate in low-power modes while retaining RTC and backup register functionality?

Yes, the R5F5671EHGFP#30 supports four low-power modes, including deep software standby where only the sub-clock oscillator, RTC, and backup registers remain active - powered optionally via VBATT. In this mode, current consumption drops below 1 µA while preserving timekeeping and critical state. The R5F5671EHGFP#30 maintains full RTC functionality (alarm, periodic interrupt, time capture) and retains 4 KB of standby RAM, enabling rapid wake-up with context restoration.

Which communication interfaces are supported by the R5F5671EHGFP#30 for industrial connectivity?

The R5F5671EHGFP#30 supports CAN (2 channels, 32 mailboxes), USB 2.0 FS (host/function/OTG), SD host interface (25 MB/s), QSPIX (serial flash fetch), RIICHS (3.4 Mbps), and multiple SCI/SCIm/RSCI channels (13 total). These interfaces enable direct integration with industrial networks (CANopen), removable media (SD cards), secure boot from flash, high-speed sensor hubs (I²C), and protocol gateways - all within a single R5F5671EHGFP#30 device without external bridges.