Renesas R5F5671EHGLE#20

Overview

R5F5671EHGLE#20 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart metering systems requiring real-time control and secure firmware updates.

For engineers reviewing the R5F5671EHGLE#20 datasheet, R5F5671EHGLE#20 pinout, R5F5671EHGLE#20 application, or R5F5671EHGLE#20 equivalent, key selection considerations include its 145-pin TFLGA (0.65-mm pitch) package, -40°C to +105°C G-grade temperature rating, TSIP-based AES256/SHA256 encryption, and IEC60730-compliant self-diagnostic features for functional safety-critical firmware execution.

Technical Context

The R5F5671EHGLE#20 implements the RXv3 CPU core with 113 instructions, including 21 double-precision floating-point operations and hardware barrel shifter, enabling deterministic real-time math in motor control and sensor fusion. Its clock system supports independent domain scaling: ICLK at 120 MHz for CPU/QSPIX, PCLKA at 120 MHz for MTU/RSPI, and PCLKB at 60 MHz for ADC/SPI peripherals.

It integrates three distinct DMA controllers - DMACAb (8-channel), EXDMACa (2-channel), and DTCb (1-channel) - coordinated via the Event Link Controller (ELC) to enable zero-CPU-overhead peripheral chaining, such as triggering A/D conversion upon TPU timer match and auto-transferring results to SRAM via DTCb.

Key Specifications

Pinout & Package

Package: TFLGA-145 (PTLG0145JC-A), 9 mm × 9 mm, 0.65 mm pitch, 145-terminal land grid array with exposed thermal pad. Pinout validated per Renesas R01DS0373EJ0120 Rev.1.20, pages 122–135 (Pin Function List).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Compared with R5F5671EHGLE#20, the R5F5671EHGLF#20 offers identical functionality in a smaller footprint but demands tighter layout tolerances, while the R5F566TEHDFP#30 trades security and connectivity for higher PWM density - making the R5F5671EHGLE#20 optimal for secure, storage-rich industrial edge nodes.

Availability

R5F5671EHGLE#20 is available at Aetrix Electronics and suitable for industrial smart metering, human-machine interface (HMI) panels, secure IoT gateways, and motor control systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F5671EHGLE#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The RX671 Group is designed for high-integrity industrial edge applications demanding real-time performance, functional safety compliance (IEC60730), and hardware-accelerated security - targeting smart meters, HMI, and gateway platforms where code size, peripheral integration, and long-term supply stability are critical.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F5671EHGLE#20?

The R5F5671EHGLE#20 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under benchmark conditions. This performance stems from its RXv3 CPU core with optimized instruction pipeline and zero-wait-state access to 384 KB SRAM. The R5F5671EHGLE#20 sustains this throughput across mixed workloads involving floating-point math, peripheral DMA, and interrupt servicing - verified in Renesas R01DS0373EJ0120 Rev.1.20 Section 1.1.

Does the R5F5671EHGLE#20 support secure firmware updates and cryptographic acceleration?

Yes, the R5F5671EHGLE#20 integrates Trusted Secure IP (TSIP) supporting AES128/192/256, SHA256, TRNG, and secure key protection. It enables authenticated, encrypted firmware updates via dual-bank flash with background programming (BGO). The R5F5671EHGLE#20 uses hardware-accelerated crypto to meet IEC60730 Class B requirements without software overhead - details confirmed in Sections 1.1 and 2.3 of R01DS0373EJ0120 Rev.1.20.

What package type and pin count does the R5F5671EHGLE#20 use?

The R5F5671EHGLE#20 uses a 145-pin TFLGA package (PTLG0145JC-A) with 9 mm × 9 mm body and 0.65 mm pitch. It provides 111 general-purpose I/O pins, 20 of which are 5-V tolerant, and supports battery-backed RTC operation via VBATT. This package is explicitly listed in Table 1.2 of R01DS0373EJ0120 Rev.1.20 for the G-grade (-40°C to +105°C) variant.

Which communication interfaces are integrated into the R5F5671EHGLE#20?

The R5F5671EHGLE#20 integrates CAN (2 channels, 32 mailboxes each), USB 2.0 FS host/function/OTG, SD host interface (25 MB/s), QSPIX (120 MHz fetch), multiple SCI/RSPI channels, RIIC/RIICHS (up to 3.4 Mbps), and RSCI with Manchester encoding. These interfaces are documented in Table 1.1 (pages 4–9) and Section 2.2 of R01DS0373EJ0120 Rev.1.20, confirming full peripheral availability in the 145-pin configuration.

How does the R5F5671EHGLE#20 handle analog-to-digital conversion and temperature sensing?

The R5F5671EHGLE#20 includes two independent 12-bit S12AD units (8+12 channels), supporting 0.48 µs conversion time, scan modes, and self-diagnostic functions. It also integrates a calibrated on-die temperature sensor feeding into S12AD unit 1, providing ±1°C relative accuracy. All specifications are validated in Sections 1.1 and 2.10 of R01DS0373EJ0120 Rev.1.20, with timing and diagnostic behavior confirmed in the S12AD chapter.