Renesas R5F5671EHGLJ#20

Overview

R5F5671EHGLJ#20 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SDHI, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart metering systems requiring real-time control, secure firmware updates, and low-power operation.

For engineers reviewing the R5F5671EHGLJ#20 datasheet, R5F5671EHGLJ#20 pinout, R5F5671EHGLJ#20 application, or R5F5671EHGLJ#20 equivalent, this page delivers verified technical context, package-specific I/O mapping, functional alternatives, and design-critical timing, security, and interface specifications directly traceable to Renesas R01DS0373EJ0120 Rev.1.20.

Technical Context

The R5F5671EHGLJ#20 implements the RXv3 CPU core with 113 instructions, 16 general-purpose 32-bit registers, and dual-precision floating-point coprocessor supporting 21 FP64 instructions. It integrates a memory protection unit (MPU) with eight configurable regions and supports little-endian or big-endian data arrangement.

Its clock system combines external crystal (8–24 MHz), sub-clock (32.768 kHz), and internal oscillators (LOCO at 240 kHz, HOCO at 16/18/20 MHz), with independent PLL for 120-MHz ICLK generation. Peripheral clocks are domain-separated: PCLKA (up to 120 MHz for MTU/RSPI), PCLKB (up to 60 MHz for most modules), and ADCLK (up to 60 MHz per A/D unit).

Key Specifications

Pinout & Package

PTLG0145KB-A is a 7 mm × 7 mm, 0.50-mm pitch, 145-ball TFLGA package with 113 user I/O pins, 1 dedicated reset (RES#), 12 power/ground balls (VCC, AVCC0/1, VSS, AVSS0/1, VBATT, VREFH/L0/1), and dedicated clock inputs (EXTAL, XTAL, SUBCLK). Ball pitch and layout comply with JEDEC MO-220DA.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F5671EHGLJ#20, the R5F5670EHGLJ#20 offers identical real-time performance and peripheral set but halves flash capacity - suitable for cost-sensitive deployments with static firmware. The R5F566TEHDFP#30 trades security and storage for higher PWM resolution and motor-control acceleration, making it incompatible for secure edge logging use cases.

Availability

R5F5671EHGLJ#20 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, home energy gateways, and factory automation edge nodes requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for R5F5671EHGLJ#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power management ICs for industrial, automotive, and IoT applications.

The RX671 Group targets high-integrity embedded systems demanding real-time determinism, functional safety (IEC60730), and hardware-accelerated cryptography - designed specifically for smart infrastructure and human-machine interface applications.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F5671EHGLJ#20?

The R5F5671EHGLJ#20 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark under benchmark conditions. This performance stems from the RXv3 CPU core's optimized pipeline, dual-precision FPU, and zero-wait-state access to 384 KB SRAM. The R5F5671EHGLJ#20 maintains deterministic execution across all supported voltage (2.7–3.6 V) and temperature (–40°C to +105°C) ranges.

Does the R5F5671EHGLJ#20 support secure firmware updates and cryptographic operations?

Yes, the R5F5671EHGLJ#20 integrates Trusted Secure IP (TSIP) with hardware-accelerated AES128/192/256, RSA, ECC, SHA256, and a true random number generator (TRNG). It supports secure boot, encrypted firmware updates via dual-bank flash, and key protection against illicit copying - all compliant with IEC60730 Class B requirements. These features are implemented in the R5F5671EHGLJ#20 silicon and require no external security co-processor.

What package type and pin count does the R5F5671EHGLJ#20 use?

The R5F5671EHGLJ#20 uses the PTLG0145KB-A package: a 7 mm × 7 mm, 0.50-mm pitch, 145-ball TFLGA with 113 user I/O pins. It includes dedicated RES#, EXTAL/XTAL, SUBCLK, VBATT, and multiple power/ground balls. Pin compatibility is confirmed per Renesas R01DS0373EJ0120 Rev.1.20 Table 1.2 for the 145-pin variant.

Which communication interfaces are integrated into the R5F5671EHGLJ#20?

The R5F5671EHGLJ#20 integrates CAN (2 channels, ISO11898-1), USB 2.0 FS (host/function/OTG), SD host interface (SDHI), Quad-SPI (QSPIX), three I²C variants (RIIC/RIICHS), up to 13 SCI channels, two RSCI with Manchester encoding, and RSPI/RSPIA. All interfaces are fully documented in the R5F5671EHGLJ#20 datasheet and support concurrent operation via DMA and ELC-triggered transfers.

How does the R5F5671EHGLJ#20 support low-power operation in battery-backed applications?

The R5F5671EHGLJ#20 supports four low-power modes - sleep, all-module clock stop, software standby, and deep software standby - with VBATT-powered retention of RTC, backup registers, and sub-clock oscillator. In deep software standby, only the 32.768-kHz sub-clock remains active, enabling calendar timekeeping and wake-on-event while consuming <1 µA. This capability is validated in the R5F5671EHGLJ#20 electrical characteristics table.