Renesas R5F5671EHGLK#20

Overview

R5F5671EHGLK#20 from Renesas is a 32-bit RXv3 microcontroller operating at up to 120 MHz, featuring double-precision IEEE-754 FPU, 2 MB on-chip code flash with dual-bank support, 384 KB SRAM, and integrated CAN, USB 2.0 FS, SD host interface, QSPIX, and capacitive touch sensing - deployed in industrial HMI and smart metering systems requiring real-time control and secure firmware updates.

For engineers reviewing the R5F5671EHGLK#20 datasheet, R5F5671EHGLK#20 pinout, R5F5671EHGLK#20 application, or R5F5671EHGLK#20 equivalent, key selection criteria include its 145-pin TFLGA (0.65-mm pitch) package, IEC60730-compliant safety features (TSIP, CRC, IWDTa, self-diagnostic A/D), and support for background programming/erasing of 8 KB data flash with 100,000-cycle endurance.

Technical Context

The R5F5671EHGLK#20 implements the RXv3 CPU core with collective register bank save, memory protection unit (MPU), and JTAG/FINE debugging. Its clock system integrates PLL, sub-clock oscillator (32.768 kHz), and dedicated 120-kHz IWDTa oscillator - enabling precise timing isolation for safety-critical watchdog operation.

Peripheral architecture includes EXDMACa (2-channel extended DMA), DTCb (1-channel data transfer controller), and ELC (event link controller) for hardware-triggered timer-to-A/D or GPIO-to-peripheral interlinking - eliminating CPU intervention in time-sensitive signal chains such as motor control PWM generation and synchronized ADC sampling.

Key Specifications

Pinout & Package

Package: TFLGA-145 (PTLG0145JC-A), 9 × 9 mm, 0.65-mm pitch, 145-terminal land grid array with exposed thermal pad. Pin count and I/O configuration align with RX671 Group specification for 145-pin variants: 111 general-purpose I/O pins, 20 5-V tolerant inputs, 111 pull-up/resistive termination support, and 111 open-drain outputs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F5671EHGLK#20, the #30 variant offers identical functionality at lower temperature rating and cost, while the RX66T alternative trades security and touch integration for higher PWM channel count and CPU speed - making it unsuitable as a drop-in replacement in safety- or UI-critical applications.

Availability

R5F5671EHGLK#20 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, home energy gateways, and motor drive control applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for R5F5671EHGLK#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX671 Group - including R5F5671EHGLK#20 - is designed for industrial automation and smart infrastructure applications demanding real-time performance, functional safety compliance (IEC60730), and hardware security (TSIP) in compact packages.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F5671EHGLK#20?

The R5F5671EHGLK#20 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark points under benchmark conditions. This performance stems from the RXv3 CPU core's efficient instruction pipeline, double-precision FPU, and zero-wait-state access to 384 KB SRAM - enabling deterministic execution in real-time industrial control loops where R5F5671EHGLK#20 serves as the primary application processor.

Does the R5F5671EHGLK#20 support secure firmware updates and cryptographic operations?

Yes, the R5F5671EHGLK#20 integrates Trusted Secure IP (TSIP) supporting AES-128/192/256, RSA, ECC, SHA256, and a true random number generator. It enables secure boot, encrypted OTA updates, and runtime key protection - all verified against IEC60730 Class B requirements. These capabilities are intrinsic to R5F5671EHGLK#20's silicon and require no external security IC.

What package type and pin count does the R5F5671EHGLK#20 use?

The R5F5671EHGLK#20 uses a 145-pin TFLGA package (PTLG0145JC-A), measuring 9 × 9 mm with 0.65-mm pitch and an exposed thermal pad. It provides 111 general-purpose I/O pins, 20 of which are 5-V tolerant, and supports full peripheral mapping per the RX671 Group specification for this pin count - confirming R5F5671EHGLK#20's suitability for space-constrained industrial modules.

Can the R5F5671EHGLK#20 perform simultaneous analog measurements and motor control?

Yes, the R5F5671EHGLK#20 supports concurrent high-speed analog acquisition and real-time motor control. Its two 12-bit S12AD units (8+12 channels) achieve 0.48 µs conversion time, and the Event Link Controller (ELC) synchronizes MTU3a PWM edges to ADC triggers - ensuring sub-100 ns timing precision. This capability is validated in R5F5671EHGLK#20 reference designs for sensorless BLDC drives.

Is the R5F5671EHGLK#20 qualified for industrial temperature range operation?

Yes, the R5F5671EHGLK#20 is rated for –40°C to +105°C (G-version), meeting industrial-grade thermal specifications. This rating is confirmed in the official Renesas datasheet R01DS0373EJ0120 Rev.1.20 and applies across all operating modes, including deep software standby with VBATT-powered RTC retention - a key requirement for R5F5671EHGLK#20 deployments in outdoor or uncontrolled-environment equipment.