Renesas R5F5671EHGNE#30

Overview

R5F5671EHGNE#30 from Renesas is a 120-MHz 32-bit RXv3 microcontroller with double-precision IEEE-754 FPU, 2-MB on-chip code flash (dual-bank), 384-KB SRAM, and integrated capacitive touch sensing unit (CTSU) supporting up to 64 keys via mutual capacitance. It serves as a secure, low-power main controller in industrial HMI, smart metering, and connected appliance applications requiring IEC60730 compliance, USB 2.0 FS host/function, CAN 2.0B, and SD host interface.

For engineers reviewing the R5F5671EHGNE#30 datasheet, R5F5671EHGNE#30 pinout, R5F5671EHGNE#30 application, or R5F5671EHGNE#30 equivalent, key selection considerations include its 145-pin TFLGA (0.65-mm pitch) package, -40°C to +105°C operating range (G-version), TSIP-based AES256/SHA256/TRNG security engine, and real-time clock with battery-backed operation - all validated for functional safety and high-integration embedded control.

Technical Context

The R5F5671EHGNE#30 implements the RXv3 CPU core with 113 instructions, including 21 double-precision floating-point operations and DSP extensions, enabling deterministic real-time execution at 120 MHz (707 CoreMark). Its memory subsystem integrates dual-bank flash for safe firmware updates, 8-KB data flash rated for 100,000 erase/write cycles, and 4-KB standby RAM backed by VBATT.

Peripheral architecture features three independent clock domains (ICLK up to 120 MHz, PCLKA up to 120 MHz, PCLKB up to 60 MHz), enabling concurrent high-speed operation of QSPIX, MTU3a PWM, and S12AD converters while maintaining low-power modes. The ELC (Event Link Controller) enables hardware-triggered inter-module coordination without CPU intervention - critical for time-sensitive motor control and touch response.

Key Specifications

Pinout & Package

Package: TFLGA-145 (PTLG0145JC-A), 9 × 9 mm body, 0.65-mm pitch, 145-terminal land grid array with exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit MCU applications.

Compared with R5F5671EHGNE#30, the R5F5670EHGNE#30 sacrifices security and flash density for lower BOM cost, while the R5F566TEHGFP#30 trades HMI peripherals for enhanced motor-control timing resolution - making R5F5671EHGNE#30 uniquely balanced for secure, connected, touch-enabled industrial edge devices.

Availability

R5F5671EHGNE#30 is available at Aetrix Electronics and suitable for industrial HMI, smart metering, home appliance control, and USB-C enabled tooling requiring stable component supply across extended temperature and long product lifecycles.

Supply support for R5F5671EHGNE#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX671 Group targets high-integrity embedded applications demanding functional safety, cryptographic security, and rich human-machine interface capabilities - with R5F5671EHGNE#30 representing its highest integration variant in the 145-pin TFLGA package.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F5671EHGNE#30?

The R5F5671EHGNE#30 operates at a maximum frequency of 120 MHz and achieves 707 CoreMark under benchmark conditions. This performance stems from its RXv3 CPU core with dual-issue pipeline, on-chip 8-KB ROM cache, and zero-wait-state access to 384-KB SRAM - enabling deterministic real-time execution in demanding control applications. The R5F5671EHGNE#30 maintains this speed across its full industrial temperature range (-40°C to +105°C).

Does the R5F5671EHGNE#30 support secure firmware updates and cryptographic operations?

Yes, the R5F5671EHGNE#30 integrates Renesas' Trusted Secure IP (TSIP) engine, providing hardware-accelerated AES128/192/256, SHA256, TRNG, and RSA/ECC support. It enables secure boot verification, encrypted firmware storage in dual-bank flash, and runtime key protection - all validated for IEC60730 Class B compliance. The R5F5671EHGNE#30 uses TSIP to prevent unauthorized firmware modification during field updates.

What package type and pin count does the R5F5671EHGNE#30 use?

The R5F5671EHGNE#30 uses a 145-pin TFLGA package (PTLG0145JC-A), measuring 9 × 9 mm with 0.65-mm pitch and an exposed thermal pad. It provides 111 general-purpose I/O pins, including 20 with 5-V tolerance, full SWD/FINE debug support, and dedicated signals for USB 2.0 FS, SDHI, CAN, and QSPIX interfaces - all mapped to validated land patterns per Renesas' hardware design guidelines.

Can the R5F5671EHGNE#30 operate with battery backup for real-time clock functionality?

Yes, the R5F5671EHGNE#30 supports battery-backed RTC operation via the VBATT pin, maintaining timekeeping, calendar functions, and 4-KB standby RAM contents during main power loss. The sub-clock oscillator connects to a 32.768-kHz crystal on RTCIN/RTCOUT, and the backup domain includes low-voltage detection to flag brownout conditions - ensuring reliable timestamping in smart meters and industrial loggers using the R5F5671EHGNE#30.

Which communication interfaces are integrated into the R5F5671EHGNE#30?

The R5F5671EHGNE#30 integrates USB 2.0 FS host/function/OTG (with on-chip PHY), two CAN 2.0B channels (32 mailboxes each), SD host interface (25 MB/s), Quad-SPI (QSPIX) for serial flash boot, three I²C channels (including RIICHS at 3.4 Mbps), and 13 SCI channels supporting UART, SPI, I²C, and LIN protocols. These interfaces are fully routable to dedicated pins in the R5F5671EHGNE#30's TFLGA-145 package without multiplexing conflicts.