Renesas R5F571MFGDFP#30

Overview

R5F571MFGDFP#30 from Renesas is a 32-bit RXv2 core MCU operating at up to 240 MHz (480 DMIPS), featuring 4 MB on-chip code flash, 512 KB SRAM (including 32 KB ECC RAM), IEEE 1588-compliant dual Ethernet MAC, high-speed USB 2.0 with battery charging, and dual 12-bit A/D converters (29 total channels). It targets industrial control and networked embedded systems requiring real-time determinism, functional safety support (IEC60730), and secure connectivity.

For engineers reviewing the R5F571MFGDFP#30 datasheet, R5F571MFGDFP#30 pinout, R5F571MFGDFP#30 application, or R5F571MFGDFP#30 equivalent, this page delivers verified specifications, package mapping to PLQP0176KB-A (176-pin LFBGA, 24 × 24 mm, 0.5-mm pitch), confirmed peripheral channel counts (e.g., 3 CAN modules, 2 USB interfaces, 9 SCI channels), and validated alternative options for migration or second-sourcing.

Technical Context

The R5F571MFGDFP#30 implements the RXv2 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code. It integrates dual Ethernet controllers with IEEE 1588 PTP hardware timestamping and dedicated EDMAC channels (3 total), supporting deterministic industrial networking.

Its memory subsystem includes 4 MB code flash with background programming, 64 KB data flash rated for 100,000 erase/write cycles, and segmented SRAM: 256 KB with no-wait access at 240 MHz (0000_0000h–0003_FFFFh), plus 32 KB ECCRAM for safety-critical data storage. Clock domains are fully decoupled-ICLK up to 240 MHz, PCLKA up to 120 MHz for Ethernet/USB/AES, and PCLKB up to 60 MHz for timers and ADCs.

Key Specifications

Pinout & Package

Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 mm × 24 mm body, 0.5 mm ball pitch, RoHS compliant, moisture sensitivity level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F571MFGDFP#30, R5F571MLDFP#30 reduces memory capacity for lower BOM cost without altering pinout or peripheral set, while R5F572MDDFP#30 upgrades CPU performance, security, and CAN capability-but requires validation of timing-critical firmware on the faster core and updated CAN FD stack integration.

Availability

R5F571MFGDFP#30 is available at Aetrix Electronics and suitable for industrial automation, smart grid infrastructure, and building management systems requiring stable component supply, long lifecycle support, and functional safety certification readiness.

Supply support for R5F571MFGDFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, and power solutions for automotive, industrial, and IoT markets, with over 40 years of embedded systems expertise.

The RX71M Group is designed for high-performance industrial applications demanding real-time determinism, functional safety (IEC60730), and integrated connectivity-including dual Ethernet, USB HS, and CAN-targeting PLCs, HMIs, and energy infrastructure.

FAQ

What is the maximum operating frequency and DMIPS rating of the R5F571MFGDFP#30?

The R5F571MFGDFP#30 operates at a maximum system clock frequency of 240 MHz and delivers 480 DMIPS (Dhrystone MIPS) performance. This is achieved through its optimized RXv2 CPU core with 5-stage pipeline, single-cycle 32-bit multiply, and integrated single-precision IEEE-754 floating-point unit-enabling real-time control loops and signal processing in industrial applications.

Does the R5F571MFGDFP#30 support IEEE 1588 Precision Time Protocol?

Yes, the R5F571MFGDFP#30 includes a dedicated PTP controller (EPTPCa) tightly coupled to both Ethernet MACs, providing hardware timestamping with sub-microsecond resolution. This enables precise time synchronization for industrial Ethernet protocols like EtherCAT and PROFINET IRT, without CPU intervention during packet transmission or reception.

What are the flash and RAM capacities of the R5F571MFGDFP#30?

The R5F571MFGDFP#30 integrates 4 MB of on-chip code flash memory (with background programming/erasing), 64 KB of reprogrammable data flash (rated for 100,000 cycles), 512 KB of general-purpose SRAM (256 KB with no-wait access at 240 MHz), and 32 KB of ECC-protected RAM for safety-critical data storage-making it suitable for complex firmware with real-time data buffering.

Which package type and pin count does the R5F571MFGDFP#30 use?

The R5F571MFGDFP#30 uses the PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA) with 24 mm × 24 mm body size and 0.5 mm ball pitch. This package supports 127 general-purpose I/O pins, 19 of which are 5-V tolerant, and provides full access to all peripherals including dual Ethernet, USB HS, and 3 CAN interfaces.

Does the R5F571MFGDFP#30 include hardware encryption acceleration?

Yes, the R5F571MFGDFP#30 includes optional hardware acceleration for AES (128/192/256-bit keys), DES/T-DES, and SHA (SHA-1, SHA-224/256, HMAC) cryptographic functions. These accelerators offload compute-intensive operations from the CPU, enabling secure firmware updates, encrypted communications, and data-at-rest protection in compliance-critical applications.

What low-power modes are supported by the R5F571MFGDFP#30?

The R5F571MFGDFP#30 supports four low-power modes: Sleep mode (CPU clock stopped), All-module clock stop mode (all clocks halted except RTC), Software standby mode (core powered down, SRAM retained), and Deep software standby mode (VBATT-powered RTC + 8 KB standby RAM only). These enable <0.2 mA/MHz typical active current and microamp-level standby consumption for battery-backed applications.