Renesas R5F571MFGDLK#20

Overview

R5F571MFGDLK#20 from Renesas is a 32-bit RXv2 core microcontroller operating at up to 240 MHz (480 DMIPS), featuring 4 MB on-chip code flash, 512 KB SRAM (including 32 KB ECC RAM), IEEE 1588-compliant dual Ethernet MAC, high-speed USB 2.0 with battery charging, CAN v2.0B (3 channels), and dual 12-bit A/D converters (29 total channels). It targets industrial automation controllers requiring deterministic real-time networking, secure firmware updates, and mixed-signal I/O.

For engineers reviewing the R5F571MFGDLK#20 datasheet, R5F571MFGDLK#20 pinout, R5F571MFGDLK#20 application, or R5F571MFGDLK#20 equivalent, key selection criteria include IEEE 1588 timestamping accuracy, dual Ethernet channel isolation, 240-MHz real-time interrupt latency, hardware AES/SHA encryption support, and 177-pin TFLGA package compatibility with industrial PCB thermal management requirements.

Technical Context

The R5F571MFGDLK#20 implements the RXv2 CPU core with CISC Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates dual independent Ethernet controllers (ETHERC) each with dedicated EDMAC channels and EPTPC blocks compliant with IEEE 1588-2008 for hardware timestamping and PTP synchronization.

Its clock system supports simultaneous operation at multiple domains: ICLK up to 240 MHz for CPU execution, PCLKA up to 120 MHz for Ethernet/USB/AES peripherals, and PCLKB up to 60 MHz for timers/ADCs. The device includes three independent A/D units (S12AD0: 8ch, S12AD1: 21ch), each with configurable resolution (8/10/12-bit), sample-and-hold, and self-diagnostic capability per IEC 60730 Class B requirements.

Key Specifications

Pinout & Package

PTLG0177KA-A is a 177-pin thin fine-pitch land grid array (TFLGA) package measuring 8 mm × 8 mm with 0.5 mm pitch, optimized for high-density industrial PCB layouts and thermal dissipation in sealed enclosures. Pin assignments follow Renesas standard RX71M 177-pin mapping with dedicated VCC/AVCC/GND groups, dual Ethernet PHY interface pins (MDIO/MDC, RMII signals), and segregated analog/digital power domains.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F571MFGDLK#20, the R5F571MLGDFP#30 reduces networking capability but lowers BOM cost through LQFP packaging and flash reduction, while the R5F572MFHDFP#30 shifts focus toward graphical UI rendering at the expense of redundant industrial networking-making R5F571MFGDLK#20 uniquely suited for applications demanding both IEEE 1588-synchronized dual Ethernet and hardware crypto acceleration in a compact TFLGA form factor.

Availability

R5F571MFGDLK#20 is available at Aetrix Electronics and suitable for industrial PLC controllers, smart grid RTUs, medical infusion pumps, building automation gateways, and IEC 60730-certified embedded systems requiring stable component supply across extended product lifecycles.

Supply support for R5F571MFGDLK#20 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.

The RX71M Group is designed specifically for industrial automation and networking applications requiring real-time determinism, functional safety compliance, and integrated secure communication-exemplified by the R5F571MFGDLK#20's dual IEEE 1588 Ethernet and hardware crypto acceleration.

FAQ

What is the maximum operating frequency and DMIPS rating of the R5F571MFGDLK#20?

The R5F571MFGDLK#20 operates at a maximum frequency of 240 MHz and delivers 480 DMIPS performance. This is achieved through the RXv2 CPU core's 5-stage pipeline, variable-length instruction set, and dual multiply-accumulate units. The R5F571MFGDLK#20 sustains this performance with zero wait states on code flash up to 120 MHz and efficient branch prediction, making it suitable for hard real-time control tasks in industrial environments.

Does the R5F571MFGDLK#20 support IEEE 1588 Precision Time Protocol hardware timestamping?

Yes, the R5F571MFGDLK#20 includes a dedicated EPTPC (Precision Time Protocol Controller) block connected to each of its two Ethernet MACs, providing hardware timestamping compliant with IEEE 1588-2008. This enables sub-100 ns timestamp resolution for PTP grandmaster and slave operation, critical for synchronized motion control and power grid phasor measurement applications using the R5F571MFGDLK#20.

How many analog input channels does the R5F571MFGDLK#20 provide, and what A/D resolution options are supported?

The R5F571MFGDLK#20 integrates two 12-bit A/D converter units: S12AD0 with 8 channels and S12AD1 with 21 channels, totaling 29 analog inputs. Each unit supports selectable resolution of 8-bit, 10-bit, or 12-bit, with conversion times of 0.42 µs, 0.45 µs, and 0.48 µs respectively. The R5F571MFGDLK#20 also includes sample-and-hold circuitry and self-diagnostic functions required for IEC 60730 Class B compliance.

What cryptographic algorithms are accelerated in hardware by the R5F571MFGDLK#20?

The R5F571MFGDLK#20 includes a dedicated hardware crypto engine supporting AES with 128-, 192-, and 256-bit keys; DES and triple-DES; and SHA-1, SHA-224, SHA-256, and HMAC variants. These accelerators operate independently of the CPU, enabling secure firmware updates, TLS handshake offload, and encrypted data logging without impacting real-time task scheduling on the R5F571MFGDLK#20.

What is the package type and thermal specification of the R5F571MFGDLK#20?

The R5F571MFGDLK#20 uses the PTLG0177KA-A package: a 177-pin thin fine-pitch land grid array measuring 8 mm × 8 mm with 0.5 mm pitch and an exposed thermal pad. It is rated for operation from –40°C to +105°C (G-version), with a typical junction-to-board thermal resistance of ≤25°C/W-enabling reliable deployment in sealed industrial enclosures without active cooling when used with appropriate PCB copper pour design for the R5F571MFGDLK#20.