Renesas R5F571MJHDFC#30

Overview

R5F571MJHDFC#30 from Renesas is a 32-bit RXv2 microcontroller operating at up to 240 MHz, delivering 480 DMIPS with integrated single-precision IEEE-754 FPU, 4 MB on-chip code flash, 512 KB SRAM (including 32 KB ECC RAM), and IEEE 1588-compliant dual Ethernet MAC - deployed in industrial gateways requiring deterministic real-time networking, secure firmware updates, and multi-protocol fieldbus coexistence.

For engineers reviewing the R5F571MJHDFC#30 datasheet, R5F571MJHDFC#30 pinout, R5F571MJHDFC#30 application, or R5F571MJHDFC#30 equivalent, this MCU supports high-speed USB 2.0 HS with battery charging, CAN FD-capable ISO 11898-1 interfaces, quad SPI for secure boot flash, SD host interface for edge data logging, and hardware AES/SHA encryption - all within a 176-pin LFBGA package rated for –40°C to +85°C operation.

Technical Context

The R5F571MJHDFC#30 implements the RXv2 CPU core with Harvard architecture, 5-stage pipeline, and variable-length instructions enabling ultra-compact code density. It integrates dual Ethernet controllers (ETHERC) with dedicated PTP timing engines (EPTPC) and three-channel EDMAC for zero-copy frame processing - supporting IEEE 1588-2008 timestamping accuracy down to ±50 ns in hardware.

Its clock system combines external crystal oscillation (8–24 MHz), internal HOCO (16/18/20 MHz), and PLL-based ICLK generation up to 240 MHz, while peripheral clocks are independently configurable: PCLKA (up to 120 MHz) for Ethernet/USB/AES, PCLKB (up to 60 MHz) for timers/ADC/SCI, and PCLKC/PCLKD (60 MHz) for dual 12-bit S12ADC units with simultaneous sampling capability.

Key Specifications

Pinout & Package

Package: PLBG0176GA-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (13 × 13 mm, 0.8 mm pitch), RoHS-compliant, lead-free, moisture sensitivity level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance industrial MCU applications.

Compared with R5F571MLHDFC#30, the R5F571MJHDFC#30 provides 1.5 MB additional flash and 128 KB more SRAM for complex protocol stacks and edge AI inference buffers; versus R5F566TEHDFP#30, it adds IEEE 1588 time synchronization, dual Ethernet, and hardware crypto - making it uniquely suited for time-critical industrial IoT edge nodes.

Availability

R5F571MJHDFC#30 is available at Aetrix Electronics and suitable for industrial gateways, smart energy meters, programmable logic controllers, and medical infusion pumps requiring stable component supply across extended product lifecycles.

Supply support for R5F571MJHDFC#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power management ICs for automotive, industrial, and IoT markets.

The RX71M Group is designed for real-time industrial connectivity applications demanding deterministic Ethernet timing, multi-protocol support, and hardware security - targeting next-generation edge intelligence nodes.

FAQ

What is the maximum operating frequency and DMIPS rating of the R5F571MJHDFC#30?

The R5F571MJHDFC#30 operates at a maximum frequency of 240 MHz and delivers 480 DMIPS performance. This is achieved through the RXv2 CPU core's 5-stage pipeline, single-cycle 32-bit multiply, and integrated single-precision IEEE-754 floating-point unit - enabling real-time signal processing and control loop execution within sub-microsecond deadlines in applications like servo motor control and power converter regulation.

Does the R5F571MJHDFC#30 support IEEE 1588 Precision Time Protocol hardware timestamping?

Yes, the R5F571MJHDFC#30 includes a dedicated PTP controller (EPTPCa) tightly coupled to its dual Ethernet MAC (ETHERC), providing hardware timestamping with ±50 ns resolution. This eliminates software-induced jitter and enables precise time synchronization across distributed industrial devices - critical for coordinated motion control, substation automation, and TSN-aware network bridges.

What package type and pin count does the R5F571MJHDFC#30 use?

The R5F571MJHDFC#30 uses the PLBG0176GA-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 13 × 13 mm with 0.8 mm pitch. This package supports full peripheral access including dual Ethernet PHY interfaces, USB 2.0 HS transceiver, and 127 general-purpose I/O pins - all while maintaining compatibility with standard industrial PCB assembly processes.

How much on-chip memory does the R5F571MJHDFC#30 include, and what are its key attributes?

The R5F571MJHDFC#30 integrates 4 MB of code flash memory (with no wait states up to 120 MHz), 64 KB of reprogrammable data flash (rated for 100,000 erase cycles), 512 KB of SRAM (256 KB zero-wait at 240 MHz), 32 KB of ECC-protected RAM (SEC-DED), and 8 KB of battery-backed standby RAM. These memory resources enable secure boot, firmware-over-the-air updates, real-time data buffering, and tamper-resistant logging in mission-critical industrial systems.

Which communication interfaces are supported by the R5F571MJHDFC#30 for industrial networking?

The R5F571MJHDFC#30 supports dual IEEE 802.3-compliant Ethernet MACs with MII/RMII physical layer support, USB 2.0 High-Speed (480 Mbps) with battery charging, three independent CAN 2.0B modules (ISO 11898-1), nine SCI channels, four SCIFA interfaces with 16-byte FIFOs, two I²C buses (up to 1 Mbps), quad SPI, SD host interface, and MMCIF - enabling converged wired fieldbus, time-sensitive networking, and local storage in a single-chip solution.