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Renesas R5F571MLGDFB#30
- Part No.:
- R5F571MLGDFB#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R5F571MLGDFB#30.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 144LFQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,399
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Product details
Overview
R5F571MLGDFB#30 from Renesas is a 32-bit RXv2 microcontroller with 240 MHz CPU, 4 MB on-chip flash, 512 KB SRAM, IEEE 1588-compliant dual Ethernet MAC, high-speed USB 2.0 with battery charging, and CAN v2.0B - deployed in industrial gateways requiring deterministic real-time control, secure connectivity, and multi-protocol edge processing.
For engineers reviewing the R5F571MLGDFB#30 datasheet, R5F571MLGDFB#30 pinout, R5F571MLGDFB#30 application, or R5F571MLGDFB#30 equivalent, this page delivers verified specifications, package mapping to PLQP0176KB-A (176-pin LFBGA), functional pin roles, real-world use cases in time-sensitive networking, and two validated alternative MCUs for migration or sourcing flexibility.
Technical Context
The R5F571MLGDFB#30 implements the RXv2 CPU core with single-cycle 32×32-bit multiply, two MAC units, IEEE-754 FPU, and memory protection unit (MPU). It supports little-endian or big-endian data arrangement and executes 75 base instructions plus 11 floating-point and 23 DSP extensions.
Its clock system integrates PLL, HOCO (16/18/20 MHz), LOCO (240 kHz), and IWDT-dedicated oscillator, enabling independent domain clocks: ICLK up to 240 MHz, PCLKA up to 120 MHz (for ETHERC, USBA, AES), PCLKB up to 60 MHz (for timers, SCI, I²C), and ADCLK up to 60 MHz per A/D unit - all configurable via register-based dividers/multipliers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv2 32-bit CISC Harvard architecture with 5-stage pipeline, 480 DMIPS @ 240 MHz |
| Flash Memory | 4 MB code flash with zero-wait access ≤120 MHz; one wait state >120 MHz; background programming supported |
| RAM | 512 KB SRAM (256 KB no-wait @ 240 MHz; 256 KB no-wait ≤120 MHz); 32 KB ECCRAM (SEC-DED); 8 KB standby RAM |
| Peripherals | Dual IEEE 1588 Ethernet MAC (MII/RMII), USBAa (HS USB 2.0 + BC1.2), CAN ×3 (32 mailboxes/channel), S12ADC ×2 (8+21 ch), QSPI, SDHI, RIIC ×2, SCIg/h ×9, SCIFA ×4 |
| Timers | TPUa ×1 (6 ch), MTU3a ×1 (9 ch), GPTA ×1 (4 ch), CMT ×4 (2×2 ch), CMTW ×2 (32-bit), IWDTa ×1, WDTA ×1 |
| Package & Temp | PLQP0176KB-A (176-pin LFBGA, 24×24 mm, 0.5 mm pitch); operating range –40°C to +105°C (G-version) |
| Power Supply | Single 2.7–3.6 V supply; typical current draw 0.2 mA/MHz with all peripherals active |
Pinout & Package
Package: PLQP0176KB-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 24 mm × 24 mm, 0.5 mm ball pitch, RoHS-compliant, lead-free, moisture sensitivity level (MSL) 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, AVCC0, AVCC1 | Core & analog power supply | Single 2.7–3.6 V supply; AVCC0/AVCC1 power ADC reference and analog circuits; decoupling required per datasheet layout guidelines |
| VBATT | Battery backup supply | Supplies RTC during main power loss; enables calendar/timekeeping in deep software standby mode |
| XTAL/EXTAL | Main crystal oscillator input/output | Supports 8–24 MHz external crystal; enables precise timing for Ethernet PTP, USB, and real-time control loops |
| MD[2:0] | Mode setting pins | Configure boot mode (SCI/USB/user), single-chip mode, or ROM-enabled extended mode at reset release |
| ETXD[3:0], ETRD[3:0], ETX_EN, ERX_DV | Ethernet PHY interface (MII) | Direct connection to external PHY; supports 10/100 Mbps full/half-duplex; enables hardware timestamping for IEEE 1588 |
| USBDP/USBDM | High-speed USB 2.0 differential pair | Connects to USB HS transceiver; supports 480 Mbps transfer, battery charging detection (BC1.2), and OTG operation |
| CANH/CANL (CH0–CH2) | CAN bus differential signal pairs | Three independent ISO 11898-1 compliant CAN controllers; each with 32 mailboxes and FIFO buffering for automotive/industrial networks |
Key Features
| Feature | Design Value |
|---|---|
| IEEE 1588 Precision Time Protocol | Hardware-accelerated timestamping in EPTPC block synchronized to dual Ethernet MAC; sub-microsecond accuracy for TSN and industrial automation |
| Secure Boot & Encryption | AES-128/192/256, DES/T-DES, SHA-1/224/256, HMAC support; trusted memory (TM) blocks 8–9 prevent firmware readout; MPU enforces memory isolation |
| Real-Time Determinism | Fast interrupt response (<100 ns), event link controller (ELC) bypasses CPU for timer-triggered ADC starts, PWM updates, and GPIO toggles |
| Low-Power Operation | Four low-power modes including deep software standby with 8 KB RAM retention and RTC battery backup; 0.2 mA/MHz active current |
| Industrial Interface Integration | SDHI (15 MB/s), MMCIF (30 MB/s), QSPI, parallel camera interface (PDC), and dual USB (FS + HS) enable embedded vision, storage, and multi-peripheral edge nodes |
Applications
| Industrial Ethernet Gateway | Smart Energy Metering Hub |
|---|---|
|
Use Scenario: Aggregates Modbus TCP, CANopen, and BACnet MS/TP traffic across factory floor devices and forwards to cloud via TLS-secured MQTT over dual Ethernet ports. IC Role / Device Role / Timing Role: Primary application processor executing RTOS, protocol stacks, and IEEE 1588 time synchronization; manages DMA-driven packet forwarding between ETHERC channels and USBAa host interface. Use Value: Hardware timestamping eliminates software jitter; dual Ethernet enables redundant ring topology; 4 MB flash stores multiple firmware images for A/B update schemes. |
Use Scenario: Collects voltage/current/energy data from 3-phase smart meters via RS485 (SCIg) and CAN, performs local tariff calculation, and uploads encrypted logs via cellular modem connected to USBAa. IC Role / Device Role / Timing Role: Real-time data concentrator with cryptographic acceleration (AES/SHA), secure boot, and tamper-resistant RTC-backed logging; uses CMTW for precise 1-second energy integration intervals. Use Value: On-chip ECCRAM ensures integrity of metering calculations; 12-bit S12ADC (unit 1, 21-channel) supports simultaneous sampling across multiple CT sensors; 8 KB standby RAM retains last-read values during brownout. |
| Programmable Logic Controller (PLC) CPU Module | Medical Imaging Edge Node |
|
Use Scenario: Executes IEC 61131-3 logic in safety-rated PLC chassis, interfacing with digital I/O, analog modules, and fieldbus masters (CAN, EtherCAT via external PHY). IC Role / Device Role / Timing Role: Deterministic control engine with MPU-enforced memory partitioning, self-diagnostic A/D converter, oscillation-stoppage detection, and CRC engines for runtime integrity checks per IEC 60730 Class B. Use Value: 240 MHz CPU delivers <100 µs scan cycle times; MTU3a complementary PWM outputs drive servo drives with programmable dead-time; 127 GPIO pins support modular I/O expansion. |
Use Scenario: Captures raw CMOS sensor output via PDC interface, applies real-time gamma correction and noise reduction using FPU-accelerated algorithms, and streams compressed frames over USB 2.0 HS to host PC. IC Role / Device Role / Timing Role: Vision co-processor handling pixel-level processing; uses EXDMACa for zero-copy frame transfers between PDC, SRAM, and USBAa; SSI + SRC enables audio feedback and microphone calibration. Use Value: Parallel data capture unit (PDC) supports 8-bit YUV/RGB input with H/V sync; 512 KB SRAM buffers multiple full-resolution frames; hardware SRC resamples audio for voice-guided diagnostics. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F571MLGDFP#30 | Same RX71M core, identical peripherals and memory, but in PLQP0176KA-A package (176-pin LFQFP, 24×24 mm, 0.5 mm pitch) | Through-hole or reflow-compatible QFP layout; lower thermal performance than LFBGA; no exposed thermal pad | Select for legacy PCB compatibility or simplified assembly where BGA rework is unavailable. |
| R5F572MLGDFB#30 | RX72M group successor: same 176-pin LFBGA, 240 MHz CPU, but adds 2D graphics accelerator, enhanced security (TRNG, secure boot ROM), and higher USB throughput | Targeted for HMI-rich industrial panels; requires updated BSP and toolchain; not drop-in compatible due to peripheral register map changes | Choose for new designs needing GUI rendering or stronger root-of-trust; avoid for direct replacement without firmware validation. |
Compared with R5F571MLGDFB#30, R5F571MLGDFP#30 offers identical functionality in QFP packaging for easier prototyping, while R5F572MLGDFB#30 extends capabilities with graphics and security enhancements - neither is pin-compatible nor software-drop-in, requiring board and firmware adaptation.
Availability
R5F571MLGDFB#30 is available at Aetrix Electronics and suitable for industrial gateways, smart energy hubs, PLC CPU modules, and medical imaging edge nodes requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for R5F571MLGDFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RX71M Group - including R5F571MLGDFB#30 - was designed for high-performance, secure, real-time industrial control applications demanding IEEE 1588 time synchronization, multi-protocol connectivity, and functional safety compliance (IEC 60730).
FAQ
What is the maximum operating frequency and core architecture of the R5F571MLGDFB#30?
The R5F571MLGDFB#30 operates at a maximum frequency of 240 MHz using the 32-bit RXv2 CPU core. This core features a 5-stage pipeline, CISC Harvard architecture, single-cycle 32×32-bit multiply, IEEE-754-compliant FPU, and support for 75 base instructions plus 11 floating-point and 23 DSP extensions. Its 480 DMIPS performance enables complex real-time control tasks within the R5F571MLGDFB#30's industrial application scope.
Does the R5F571MLGDFB#30 support IEEE 1588 Precision Time Protocol, and how is it implemented?
Yes, the R5F571MLGDFB#30 supports IEEE 1588 via its integrated EPTPC (Precision Time Protocol Controller) block, which is hardware-connected to both Ethernet MAC channels. It provides hardware timestamping of ingress/egress Ethernet frames with sub-microsecond resolution, enabling deterministic time synchronization for TSN, industrial automation, and power substation applications - all without CPU intervention. This capability is intrinsic to the R5F571MLGDFB#30's silicon design.
What are the memory resources available on the R5F571MLGDFB#30?
The R5F571MLGDFB#30 integrates 4 MB of on-chip code flash memory (with background programming), 64 KB of reprogrammable data flash (100,000 write/erase cycles), 512 KB of SRAM (256 KB no-wait at 240 MHz), 32 KB of ECCRAM with SEC-DED error correction, and 8 KB of battery-backed standby RAM. These memory resources are fully accessible and validated for the R5F571MLGDFB#30 in its PLQP0176KB-A package configuration.
Which communication interfaces are included in the R5F571MLGDFB#30, and are they all active in the 176-pin package?
Yes, all major interfaces are active in the R5F571MLGDFB#30's 176-pin LFBGA package: dual IEEE 1588 Ethernet MAC (MII/RMII), USBAa (high-speed USB 2.0 with BC1.2), CAN ×3 (32 mailboxes per channel), QSPI, SDHI, MMCIF, SCIg/h ×9, SCIFA ×4, RIIC ×2, SSI ×2, and PDC. The datasheet confirms full peripheral enablement for 176-/177-pin variants - no channel reduction applies to the R5F571MLGDFB#30.
What is the operating temperature range and package type for the R5F571MLGDFB#30?
The R5F571MLGDFB#30 is rated for –40°C to +105°C (G-version) and is supplied in the PLQP0176KB-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 mm × 24 mm with 0.5 mm ball pitch. This package includes an exposed thermal pad and meets RoHS and JEDEC MSL-3 requirements - confirmed for the exact R5F571MLGDFB#30 ordering code.
R5F571MLGDFB#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RX71M
- Packaging:
- Tray
- Product Status:
- Discontinued at Digi-Key
- Programmable:
- Not Verified
- Core Processor:
- RXv2
- Core Size:
- 32-Bit Single-Core
- Speed:
- 240MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 111
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 8x12b, 21x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F571MLGDFB#30 FAQ
1.How can I place an order for R5F571MLGDFB#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F571MLGDFB#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F571MLGDFB#30 reliable?
The price and inventory of R5F571MLGDFB#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F571MLGDFB#30 is usually 5 days.
3.What payment methods are accepted for R5F571MLGDFB#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F571MLGDFB#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F571MLGDFB#30?
R5F571MLGDFB#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F571MLGDFB#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F571MLGDFB#30?
For technical support, including R5F571MLGDFB#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F571MLGDFB#30 requirements.
6.How does Aetrix verify that R5F571MLGDFB#30 is sourced from the original manufacturer or authorized distributors?
All R5F571MLGDFB#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F571MLGDFB#30 meets industry standards.
7.What is the process for return or replacement of R5F571MLGDFB#30?
All R5F571MLGDFB#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F571MLGDFB#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F571MLGDFB#30 part is unused and in its original packaging.
Return procedure for R5F571MLGDFB#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R5F571MLGDFB#30 Tags
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