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Renesas R5F572MDHGFP#10

Part No.:
R5F572MDHGFP#10
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixR5F572MDHGFP#10.pdf
Description:
IC MCU 32BIT 2MB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,000

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Product details

Overview

R5F572MDHGFP#10 from Renesas is a 32-bit RXv3 microcontroller operating at up to 240 MHz, featuring double-precision IEEE-754 FPU, 4 MB on-chip code flash, 1 MB SRAM (including 32 KB ECC RAM), EtherCAT slave controller, IEEE 1588-compliant Ethernet MAC, and integrated CAN, USB FS, SDHI, and QSPI interfaces - deployed in industrial motion control, PLCs, and robotics where deterministic real-time performance and functional safety compliance are critical.

For engineers reviewing the R5F572MDHGFP#10 datasheet, R5F572MDHGFP#10 pinout, R5F572MDHGFP#10 application, or R5F572MDHGFP#10 equivalent, key selection considerations include its 176-pin LFBGA package (PLQP0176KB-C), dual-bank flash for safe firmware updates, 136 GPIOs with 5-V tolerance, IEC60730-ready self-test features, and hardware-accelerated trigonometric and encryption functions.

Technical Context

The R5F572MDHGFP#10 implements the RXv3 CPU core with 16 general-purpose 32-bit registers, double-precision FPU (16×64-bit data registers), and collective register bank save for fast context switching. It supports little-endian or big-endian data arrangement and executes 113 instructions including DSP and floating-point operations.

Its clock architecture includes dual PLLs, selectable HOCO (16/18/20 MHz), LOCO (240 kHz), and IWDT-dedicated oscillator, enabling independent domain clocks: ICLK up to 240 MHz, PCLKA up to 120 MHz (for MTU/ETHERC/GLCDC), PCLKB up to 60 MHz (for TMR/CMT), and BCLK up to 80 MHz for external bus access.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core RXv3 32-bit, 240 MHz max - delivers 1396 CoreMark; enables real-time deterministic execution in motion control loops.
Memory 4 MB code flash (dual-bank), 1 MB SRAM (512 KB no-wait ≤120 MHz), 32 KB ECC RAM - supports safe background programming and error-resilient operation.
Real-time Peripherals EtherCAT slave controller (2-port), IEEE 1588 Ethernet MAC (2 ch), CAN (3 ch, 32 mailboxes/ch) - enables synchronized distributed drive systems with sub-microsecond jitter.
Analog & Timing Two 12-bit ADCs (8 + 21 ch), 2×12-bit DAC, RTC with battery backup, IWDT with window function - meets IEC60730 Class B requirements for self-diagnosis.
Package & I/O PLQP0176KB-C (176-pin LFBGA, 24×24 mm, 0.5-mm pitch), 136 GPIOs with 5-V tolerance, open-drain, pull-up - supports industrial-level noise immunity and flexible peripheral routing.
Security & Acceleration Optional TSIP + AES-128/192/256, trigonometric unit (sine/cosine/arctan), delta-sigma modulator interface (6 ch) - accelerates motor control algorithms and secure firmware updates.

Pinout & Package

Package: PLQP0176KB-C - 176-pin low-profile quad flat package (LFBGA), 24 mm × 24 mm, 0.5 mm pitch, RoHS-compliant, designed for high-density industrial PCB layouts with thermal and EMI robustness.

Pin/Terminal Circuit Role Design Meaning
VCC, AVCC0, AVCC1 Power supply inputs Separate digital/analog domains (2.7–3.6 V); AVCC0/AVCC1 power analog peripherals including ADC/DAC/RTC.
RES#, RESET Reset input Active-low asynchronous reset; supports power-on, voltage-monitoring, watchdog, and software-initiated reset sources.
XTAL, EXTAL Main crystal oscillator Supports 8–24 MHz external crystal; enables precise timing for EtherCAT synchronization and IEEE 1588 timestamping.
ETH_MDC, ETH_MDIO PHY management interface IEEE 802.3u-compliant MII/RMII control lines for auto-negotiation and PHY register access without CPU overhead.
ECAT_TXD0/1, ECAT_RXD0/1 EtherCAT physical layer Dedicated differential pairs for two-port EtherCAT slave operation; supports full-duplex 100 Mbps with hardware frame processing.
USB_DP, USB_DM USB 2.0 full-speed interface Integrated transceiver; supports host/function/OTG modes - eliminates need for external PHY in embedded HMI or configuration tools.

Key Features

Feature Design Value
IEC60730 Class B Support Hardware CRC, oscillation-stop detection, A/D self-diagnostic, register write protection - reduces certification effort for safety-critical industrial equipment.
Dual-Bank Flash Architecture Enables seamless firmware update via bank swap during runtime - eliminates system downtime in field-deployed PLCs and drives.
Event Link Controller (ELC) 137 internal event signals routed without CPU intervention - synchronizes timer triggers, ADC starts, and PWM outputs for jitter-free motor commutation.
Hardware Trigonometric Unit (TFU) Single-cycle sine/cosine/arctan computation - accelerates field-oriented control (FOC) algorithms without floating-point library overhead.
Delta-Sigma Modulator Interface (DSMIF) Direct connection to 6 external ΔΣ modulators - enables high-resolution current sensing for servo drives with minimal external components.

Applications

Industrial PLCs Motion Controllers

Use Scenario: Compact, modular programmable logic controllers requiring deterministic I/O scanning, EtherCAT master/slave interoperability, and local HMI integration.

IC Role / Device Role / Timing Role: Main application processor executing ladder logic, managing EtherCAT distributed I/O, and driving GLCDC-based operator panels.

Use Value: Dual-bank flash allows hot firmware updates; 136 GPIOs support mixed digital/analog I/O expansion; IEEE 1588 timestamping ensures synchronized task scheduling across networked modules.

Use Scenario: High-precision multi-axis servo drives needing real-time current loop control, position feedback processing, and safety monitoring.

IC Role / Device Role / Timing Role: Real-time motion engine performing FOC calculations, generating PWM via GPTW/MTU3, and acquiring current/voltage via 12-bit ADCs and DSMIF.

Use Value: Hardware TFU cuts FOC latency by >60% vs. software math; 6-channel DSMIF enables direct connection to isolated current sensors; IWDT with window function satisfies SIL2 functional safety requirements.

Robotics Control Units Smart Power Inverters

Use Scenario: Embedded robot joint controllers requiring low-latency torque control, sensor fusion (IMU, encoders), and real-time communication over EtherCAT or CANopen.

IC Role / Device Role / Timing Role: Central motion co-processor interfacing with motor drivers, reading quadrature encoders via MTU3 phase-counting mode, and running safety monitors.

Use Value: 240 MHz RXv3 core sustains 20 kHz current loop bandwidth; ELC links encoder edges to ADC triggers for precise timing; 32 KB ECC RAM protects critical state variables from bit flips.

Use Scenario: Grid-tied solar inverters and UPS systems demanding high-efficiency power conversion, grid synchronization, and anti-islanding protection.

IC Role / Device Role / Timing Role: System controller managing MPPT, PWM generation, grid sync via IEEE 1588, and isolation barrier communication (SCIi/USB).

Use Value: IEEE 1588 PTP module enables sub-1 μs grid-phase alignment; dual CAN channels support redundant communication with string optimizers and energy meters; SDHI allows firmware logging to removable media.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance industrial MCU applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F572MDHGBD#10 Same RX72M core, identical peripherals, but in 144-pin LFQFP (PLQP0144KA-B) package - smaller footprint, lower I/O count (111 GPIOs), no 5-V tolerant pins. Better suited for space-constrained designs where EtherCAT port count or analog channel density is reduced. Select when board area is critical and full 136-GPIO capability is unnecessary; verify thermal derating in sealed enclosures.
R5F572NDDHFP#10 Higher memory variant: 4 MB flash + 2 MB SRAM (vs. 1 MB), same 176-pin LFBGA; adds second SDHI channel and enhanced security (TSIP-Lite). Targeted at edge gateway applications requiring local data aggregation, secure OTA updates, and dual-storage redundancy. Choose when extended buffer memory for protocol stacks (e.g., OPC UA) or dual SD card logging is required; higher cost justified by enhanced security certification path.

Compared with R5F572MDHGFP#10, the R5F572MDHGBD#10 trades I/O and ruggedness for compactness, while the R5F572NDDHFP#10 extends memory and security for edge intelligence - neither is pin-compatible, but all share identical peripheral register maps and toolchain support.

Availability

R5F572MDHGFP#10 is available at Aetrix Electronics and suitable for industrial automation, motion control, and robotics applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for safety-certified designs.

Supply support for R5F572MDHGFP#10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets - delivering high-reliability, energy-efficient silicon with comprehensive development ecosystems.

The RX72M Group is engineered for real-time industrial control, integrating EtherCAT, IEEE 1588, and functional safety features to replace FPGA+MCU combinations in PLCs, servo drives, and collaborative robots.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F572MDHGFP#10?

The R5F572MDHGFP#10 operates at a maximum frequency of 240 MHz and achieves 1396 CoreMark - measured under standard conditions per EEMBC methodology. This performance stems from the RXv3 CPU's 113-instruction set, zero-wait-state access to ROM cache at ≤120 MHz, and dual-issue capable pipeline. The R5F572MDHGFP#10 maintains this throughput while executing double-precision floating-point and DSP operations concurrently.

Does the R5F572MDHGFP#10 support EtherCAT slave functionality, and how is it implemented?

Yes, the R5F572MDHGFP#10 integrates a Beckhoff EtherCAT Slave Controller (ESC) IP core supporting two physical ports - enabling daisy-chain topology and hot-connect capability. It handles frame processing, distributed clocks synchronization, and process data exchange in hardware, offloading the RXv3 CPU. The R5F572MDHGFP#10 requires no external ESC ASIC and supports standard EtherCAT configuration via EEPROM or flash-based ESI files.

What flash and RAM configurations does the R5F572MDHGFP#10 provide, and how do they impact real-time operation?

The R5F572MDHGFP#10 includes 4 MB of dual-bank code flash (enabling background programming and bank-swapped boot) and 1 MB of SRAM - split into 512 KB high-speed SRAM, 32 KB ECC RAM, and 8 KB standby RAM. This configuration allows concurrent execution and firmware update, SEC-DED error correction for safety-critical variables, and RTC-backed state retention during deep sleep - all essential for uninterrupted real-time operation in the R5F572MDHGFP#10.

How does the R5F572MDHGFP#10 meet IEC60730 Class B requirements for functional safety?

The R5F572MDHGFP#10 provides hardware-assisted IEC60730 Class B compliance via oscillation-stop detection, CRC calculation unit (CRCA), independent watchdog timer (IWDT) with window function, A/D converter self-diagnostic, and register write protection. These features are documented in Renesas' Functional Safety Manual (R01UM0137EJ0200) and validated for use in safety-related control functions - reducing software validation burden for the R5F572MDHGFP#10 in certified industrial equipment.

What package type and pin count does the R5F572MDHGFP#10 use, and what are its key mechanical attributes?

The R5F572MDHGFP#10 uses the PLQP0176KB-C package: a 176-pin low-profile fine-pitch ball grid array measuring 24 mm × 24 mm with 0.5 mm pitch. It features 136 general-purpose I/Os - 19 of which are 5-V tolerant - and supports industrial temperature range (−40°C to +105°C). This package balances high I/O density, thermal performance, and PCB assembly reliability for the R5F572MDHGFP#10 in harsh environments.

R5F572MDHGFP#10 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
100-LQFP
Series:
RX
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RXv3
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F572MDHGFP#10 FAQ

1.How can I place an order for R5F572MDHGFP#10 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F572MDHGFP#10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F572MDHGFP#10 reliable?

The price and inventory of R5F572MDHGFP#10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F572MDHGFP#10 is usually 5 days.

3.What payment methods are accepted for R5F572MDHGFP#10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F572MDHGFP#10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F572MDHGFP#10?

R5F572MDHGFP#10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F572MDHGFP#10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F572MDHGFP#10?

For technical support, including R5F572MDHGFP#10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F572MDHGFP#10 requirements.

6.How does Aetrix verify that R5F572MDHGFP#10 is sourced from the original manufacturer or authorized distributors?

All R5F572MDHGFP#10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F572MDHGFP#10 meets industry standards.

7.What is the process for return or replacement of R5F572MDHGFP#10?

All R5F572MDHGFP#10 units undergo pre-shipment inspection (PSI). If there is an issue with R5F572MDHGFP#10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F572MDHGFP#10 part is unused and in its original packaging.

Return procedure for R5F572MDHGFP#10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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