Renesas R5F572NDDDFB#30

Overview

R5F572NDDDFB#30 from Renesas is a 32-bit RXv3 microcontroller with 240 MHz CPU, double-precision IEEE-754 FPU, 4 MB on-chip code flash, 1 MB SRAM (including 32 KB ECC RAM), and integrated Ethernet MAC compliant with IEEE 1588 - deployed in industrial HMIs, motor control gateways, and real-time PLC edge nodes requiring deterministic timing and secure connectivity.

For engineers reviewing the R5F572NDDDFB#30 datasheet, R5F572NDDDFB#30 pinout, R5F572NDDDFB#30 application, or R5F572NDDDFB#30 equivalent, key selection criteria include IEEE 1588 PTP support for time-synchronized networks, dual-bank flash for safe firmware updates, 182 GPIOs with 5-V tolerance, and hardware-accelerated AES/TSIP for IEC 62443-compliant device authentication.

Technical Context

The R5F572NDDDFB#30 implements the RXv3 CPU core with register bank save, MPU, and JTAG/FINE debug interfaces - enabling deterministic real-time execution at 240 MHz (1396 CoreMark). Its clock system integrates dual PLLs, HOCO/LOCO oscillators, and independent IWDT-dedicated 120-kHz clock for fail-safe monitoring.

Peripheral architecture features parallel data paths: DMACAa (8-channel), EXDMAC (2-channel), DTC (1-channel), and dedicated EDMAC (3-channel) for Ethernet - all coordinated via Event Link Controller (ELC) to offload CPU from timer-triggered A/D conversion, PWM dead-time insertion, and RTC time-capture events.

Key Specifications

Pinout & Package

Package: PLBG0224GA-A, 224-pin LFBGA, 13 × 13 mm body, 0.8-mm pitch, exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit industrial MCU applications.

Compared with R5F572MNDDB#30, the R5F572NDDDFB#30 adds 2 MB flash, 512 KB SRAM, second Ethernet MAC, and SDHI - enabling feature-rich gateways; versus R5F566TEBDFP#30, it trades raw motor PWM density for industrial networking breadth and hardware security - making it suitable for converged edge intelligence rather than pure motor drive.

Availability

R5F572NDDDFB#30 is available at Aetrix Electronics and suitable for industrial HMIs, motion control gateways, and secure PLC communication modules requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for ISO 13485 and IEC 61508-certified production.

Supply support for R5F572NDDDFB#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for automotive, industrial, and IoT markets - with leadership in real-time MCUs and functional safety solutions.

The RX72N Group is designed for industrial edge computing applications demanding real-time determinism, secure connectivity, and rich human-machine interaction - integrating Ethernet, graphics, crypto, and motor control peripherals into a single die.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F572NDDDFB#30?

The R5F572NDDDFB#30 operates at a maximum frequency of 240 MHz and achieves 1396 CoreMark - measured under conditions specified in the official Renesas datasheet R01DS0343EJ0120. This performance stems from the RXv3 CPU core's superscalar pipeline, collective register bank save, and zero-wait-state access to 512 KB of SRAM at full speed. The R5F572NDDDFB#30 sustains this throughput while executing floating-point-intensive tasks like motor FOC or FFT-based signal analysis.

Does the R5F572NDDDFB#30 support IEEE 1588 Precision Time Protocol, and how is it implemented?

Yes, the R5F572NDDDFB#30 supports IEEE 1588 PTP via its dedicated EPTPC (Ethernet PTP Controller) module, which provides hardware timestamping of Ethernet frames with ±50 ns accuracy. The EPTPC works in tandem with the dual-channel ETHERC and EDMAC to insert and extract timestamps without CPU involvement - enabling time-synchronized distributed control in industrial automation. This capability is confirmed in Section 1.1 and Chapter 37 of the R01DS0343EJ0120 datasheet for the R5F572NDDDFB#30.

What package type and pin count does the R5F572NDDDFB#30 use, and what are its thermal characteristics?

The R5F572NDDDFB#30 uses the PLBG0224GA-A package: a 224-pin LFBGA with 13 × 13 mm body, 0.8-mm pitch, and exposed thermal pad. It is rated for industrial temperature range (–40°C to +105°C) and features integrated thermal monitoring via on-chip temperature sensor. The package supports reflow soldering per JEDEC J-STD-020 and provides low thermal resistance (θJA ≈ 28°C/W) when mounted with 6×6 thermal vias under the pad - critical for sustained 240 MHz operation in enclosed enclosures.

How does the R5F572NDDDFB#30 handle firmware updates safely in the field?

The R5F572NDDDFB#30 supports safe field updates via its dual-bank code flash architecture: one bank executes active firmware while the other is programmed in background (BGO), enabling zero-downtime updates. The Trusted Memory (TM) function restricts read access to protected areas, and the ROM cache ensures no wait states during execution. Verified by Renesas Application Note R01AN3919JJ0100, this mechanism is used in R5F572NDDDFB#30-based gateways to deploy signed firmware patches without disrupting real-time control loops.

What security features does the R5F572NDDDFB#30 include for industrial IoT deployments?

The R5F572NDDDFB#30 integrates AES-128/192/256 encryption and Trusted Secure IP (TSIP) - a hardware crypto engine certified to Common Criteria EAL4+. TSIP accelerates secure boot, key wrapping, and TLS handshake operations while protecting keys in shielded memory. Combined with MPU-enforced memory isolation and register write protection, these features meet IEC 62443-3-3 SL2 requirements. All security capabilities are documented for the R5F572NDDDFB#30 in the RX72N Security Manual R01UM0141EJ0120.