Renesas R5F572NDDDFC#30

Overview

R5F572NDDDFC#30 from Renesas is a 32-bit RXv3 microcontroller with 240 MHz CPU, 4 MB on-chip code flash, 1 MB SRAM (including 32 KB ECC RAM), IEEE-754 double-precision FPU, and integrated Ethernet MAC compliant with IEEE 1588. It serves as a high-performance industrial control and networked HMI host in factory automation gateways requiring real-time deterministic response, secure firmware updates, and multi-protocol connectivity.

For engineers reviewing the R5F572NDDDFC#30 datasheet, R5F572NDDDFC#30 pinout, R5F572NDDDFC#30 application, or R5F572NDDDFC#30 equivalent, key selection considerations include its 176-pin LFBGA package, dual-bank flash for safe OTA updates, hardware-accelerated AES-256/TSIP security, and simultaneous support for CAN FD-capable ISO 11898-1 (3 channels), USB 2.0 FS OTG, and SDHI/MMCIF interfaces.

Technical Context

The R5F572NDDDFC#30 implements the RXv3 CPU core with 16 general-purpose 32-bit registers, double-precision FPU (16×64-bit data registers), and collective register bank save for fast interrupt handling. Its clock system integrates dual PLLs, HOCO (16/18/20 MHz), LOCO (240 kHz), and IWDT-dedicated oscillator to drive ICLK up to 240 MHz while synchronizing PCLKA (120 MHz) for Ethernet/USB/GLCDC and PCLKB (60 MHz) for timers/ADC.

Memory architecture includes 4 MB dual-bank code flash (no-wait ≤120 MHz), 32 KB data flash (100k erase cycles), 1 MB SRAM split into 512 KB zero-wait main RAM and 512 KB expansion RAM (1-wait >120 MHz), plus 32 KB ECC RAM and 8 KB standby RAM. Peripheral interconnect uses ELC (135 event signals) and DMACAa (8-channel), EXDMAC (2-channel), DTC (1-channel) for zero-CPU-overhead data movement between Ethernet, SDHI, CAN, and ADC units.

Key Specifications

Pinout & Package

Package: PLQP0176KB-C, 176-pin Low-Profile Fine-Pitch Ball Grid Array (24 × 24 mm, 0.5 mm pitch), rated for –40°C to +105°C operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance industrial MCU applications.

Compared with R5F572MNDDEFC#30, the R5F572NDDDFC#30 adds 2 MB flash, 512 KB RAM, GLCDC/DRW2D, and IEEE 1588 - making it suitable for HMI-rich gateways; versus R5F566TKDDFC#30, it trades motor-specific timer depth for broader industrial connectivity and security, targeting edge node consolidation rather than dedicated motion control.

Availability

R5F572NDDDFC#30 is available at Aetrix Electronics and suitable for industrial PLC gateways, smart energy meter hubs, HMI display controllers, and factory automation edge nodes requiring stable component supply across extended product lifecycles.

Supply support for R5F572NDDDFC#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RX72N Group targets high-end industrial automation with integrated networking, graphics, and security - designed to replace multi-chip solutions in programmable logic controllers, HMIs, and edge gateways.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F572NDDDFC#30?

The R5F572NDDDFC#30 operates at a maximum frequency of 240 MHz and achieves 1396 CoreMark points under benchmark conditions. This performance stems from the RXv3 CPU core's optimized pipeline, double-precision FPU, and zero-wait-state access to 512 KB of on-chip SRAM at full speed. The R5F572NDDDFC#30 sustains this throughput across real-world industrial workloads including protocol stack processing and graphics rendering.

Does the R5F572NDDDFC#30 support IEEE 1588 Precision Time Protocol, and how is it implemented?

Yes, the R5F572NDDDFC#30 integrates a dedicated EPTPCb module compliant with IEEE 1588-2008, enabling hardware timestamping of Ethernet frames with sub-microsecond accuracy. It synchronizes with master clocks over standard 10/100 Mbps Ethernet links using PTP messages and supports transparent clock and boundary clock modes. The R5F572NDDDFC#30 uses this capability to coordinate distributed I/O modules in motion control systems without external timing hardware.

What security features does the R5F572NDDDFC#30 provide for firmware protection?

The R5F572NDDDFC#30 includes AES-128/192/256 encryption engines and the Trusted Secure IP (TSIP) module for secure key management, encrypted firmware storage, and tamper-resistant boot verification. TSIP supports secure boot with signature validation, runtime firmware decryption, and protected key storage resistant to side-channel attacks. These features ensure that only authenticated code executes on the R5F572NDDDFC#30, meeting IEC 62443-3-3 requirements.

How many CAN channels does the R5F572NDDDFC#30 support, and what protocol versions are compatible?

The R5F572NDDDFC#30 integrates three independent CAN modules compliant with ISO 11898-1, supporting both standard (11-bit) and extended (29-bit) frame formats at bit rates up to 1 Mbps. Each channel provides 32 configurable mailboxes for flexible message filtering and prioritization. While not CAN FD-capable, the R5F572NDDDFC#30's CAN implementation meets requirements for industrial automation networks where legacy CAN 2.0B interoperability is essential.

What is the package type and pin count of the R5F572NDDDFC#30, and what temperature range does it support?

The R5F572NDDDFC#30 uses the PLQP0176KB-C package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 24 × 24 mm with 0.5 mm pitch. It is rated for operation from –40°C to +105°C (G-version), making it suitable for harsh industrial environments such as factory floors and outdoor energy infrastructure. This package provides 136 general-purpose I/O pins with 5-V tolerance on 19 pins, supporting mixed-voltage system interfacing.