Renesas R5F572NDHDFC#30
- Part No.:
- R5F572NDHDFC#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 176-LQFP
- Datasheet:
-
R5F572NDHDFC#30.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 176LFQFP
- Quantity:
- Payment:

- Shipping:

Inventory:118
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R5F572NDHDFC#30 from Renesas is a 32-bit RXv3 microcontroller operating at up to 240 MHz, featuring double-precision IEEE-754 FPU, 4 MB on-chip code flash, 1 MB SRAM (including 32 KB ECC RAM), and integrated Ethernet MAC compliant with IEEE 1588. It supports CAN (3 channels), USB 2.0 FS host/function, SDHI, QSPI, and GLCDC - targeting industrial HMI, networked motor control, and real-time gateway applications.
For engineers reviewing the R5F572NDHDFC#30 datasheet, R5F572NDHDFC#30 pinout, R5F572NDHDFC#30 application, or R5F572NDHDFC#30 equivalent, key selection criteria include its 240-MHz deterministic real-time performance, dual-bank flash for safe firmware updates, hardware-accelerated trigonometric functions (TFU), IEEE 1588 PTP timing precision, and IEC 60730 safety support including CRC, IWDT, and self-diagnostic A/D.
Technical Context
The R5F572NDHDFC#30 implements the RXv3 CPU core with 16 general-purpose 32-bit registers, double-precision FPU (16×64-bit data registers), and collective register bank save for fast context switching. Its clock system includes PLLs for ICLK (240 MHz), PCLKA (120 MHz), and PCLKB (60 MHz), enabling independent domain scaling for CPU, peripherals, and low-power subsystems.
Real-time capability is reinforced by 29 timers including GPTW (4×32-bit PWM), MTU3a (9-channel multifunction), and TPUa (6-channel pulse unit), all tightly coupled with the Event Link Controller (ELC) for hardware-triggered actions without CPU intervention. The device integrates dedicated hardware accelerators: TFU for sine/cosine/arctangent, TSIP for AES-128/192/256, and DRW2D for 2D graphics rendering.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv3 32-bit, 240 MHz max - delivers 1396 CoreMark; supports little/big-endian data, 113 instructions including DSP and FPU ops. |
| Memory | 4 MB code flash (dual-bank), 1 MB SRAM (512 KB no-wait ≤120 MHz), 32 KB ECC RAM, 8 KB standby RAM - enables robust firmware update and safety-critical data retention. |
| FPU | Double-precision IEEE-754 coprocessor - provides full 64-bit floating-point arithmetic with exception handling for motion control and sensor fusion. |
| Connectivity | Ethernet MAC ×2 (IEEE 1588 PTP), CAN ×3 (32 mailboxes/channel), USB 2.0 FS host/function, SDHI, QSPI, 3×I²C (1 Mbps), 13×SCI - supports multi-protocol industrial edge nodes. |
| Timers & PWM | GPTW ×4 (32-bit, dead-time generation), MTU3a ×9, TPUa ×6 - delivers synchronized, high-resolution PWM for 3-phase inverter control with complementary outputs and automatic dead-time insertion. |
| Safety & Security | IEC 60730 compliance features: oscillation-stop detection, CRC accelerator, IWDT with window function, A/D self-diagnostic, register write protection - meets Class B requirements out-of-box. |
| Package | LFBGA-176 (PLQP0176KB-C), 24 × 24 mm, 0.5 mm pitch - supports high I/O count (136 GPIO) with 5-V tolerant pins and open-drain capability. |
Pinout & Package
LFBGA-176 package (PLQP0176KB-C), 24 × 24 mm, 0.5 mm pitch, with 136 general-purpose I/O pins - all support pull-up, open-drain, and 19 pins are 5-V tolerant. Pin functions mapped per Renesas R01DS0343EJ0120 Rev.1.20, Table 1.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / AVCC0 / AVCC1 | Core & analog power supply | 2.7–3.6 V operation; separate analog domains ensure stable ADC/DAC reference under digital switching noise. |
| VBATT | Battery backup supply | Enables RTC operation during main power loss - critical for time-stamped event logging in industrial systems. |
| XTAL / EXTAL | Main crystal oscillator input/output | Supports 8–24 MHz external resonator for precise system clock; paired with PLL for 240 MHz ICLK generation. |
| ETH_MDC / ETH_MDIO | PHY management interface | Enables hardware-managed PHY configuration via PMGI - offloads CPU from Ethernet PHY register access. |
| USB_DP / USB_DM | USB 2.0 full-speed differential pair | Integrated transceiver eliminates external PHY; supports host/function/OTG modes with 2 KB on-chip buffer. |
| SD0_CMD / SD0_CLK / SD0_DATx | SD host interface signals | Direct connection to SD memory/SDIO cards at up to 25 MB/s - enables local firmware storage and field-upgrade capability. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash architecture | Enables background programming while executing from alternate bank - supports zero-downtime firmware updates in deployed systems. |
| IEEE 1588 Precision Time Protocol (PTP) | Hardware timestamping in ETHERC + EPTPC allows sub-microsecond clock synchronization across distributed industrial networks. |
| Trigonometric Function Unit (TFU) | Hardware-accelerated sine/cosine/arctangent - reduces CPU load in servo control and vector modulation algorithms by >90% vs software math libraries. |
| Event Link Controller (ELC) | 135 internal event sources routed without CPU involvement - e.g., timer overflow triggers ADC conversion or GPIO toggle, cutting latency to <100 ns. |
| IEC 60730 Class B support | On-chip CRC accelerator, IWDT with configurable window, A/D self-test, and register lock bits - simplifies functional safety certification. |
| Graphics LCD controller (GLCDC) | Direct RGB/TFT panel drive with alpha blending and overlay - enables rich HMI with minimal external components and low CPU overhead. |
Applications
| Industrial HMI Gateway | Networked Motor Drive |
|---|---|
|
Use Scenario: Embedded controller in panel-mounted HMIs connecting PLCs, sensors, and cloud via Ethernet and CAN. IC Role / Device Role / Timing Role: Central application processor managing GLCDC-driven display, real-time CAN bus arbitration, and IEEE 1588-synchronized log timestamps. Use Value: Dual-bank flash enables remote firmware patching without downtime; 136 GPIOs route diverse I/O (encoder inputs, relay controls, touch buttons). |
Use Scenario: Compact servo drive controlling PMSM/BLDC motors with field-oriented control (FOC) and position feedback. IC Role / Device Role / Timing Role: Real-time motion controller executing FOC loops at 20 kHz using TFU-accelerated sine/cosine and GPTW-synchronized PWM. Use Value: Hardware dead-time insertion and complementary PWM prevent shoot-through; 240 MHz deterministic execution ensures loop jitter <100 ns. |
| Smart Energy Meter Hub | IIoT Edge Node |
|
Use Scenario: Multi-protocol energy concentrator aggregating data from RS485 (Modbus), M-Bus, and pulse-input meters over CAN/Ethernet. IC Role / Device Role / Timing Role: Secure data aggregator with TSIP-based AES encryption, RTC-backed time stamping, and SDHI for local data buffering. Use Value: IEC 60730-compliant IWDT and CRC acceleration ensure metering integrity; 32 KB ECC RAM protects critical calibration tables. |
Use Scenario: Edge node collecting vibration, temperature, and current data from factory assets, preprocessing locally before MQTT upload. IC Role / Device Role / Timing Role: Sensor fusion hub running FFT on ADC samples, triggering alerts via CAN/Ethernet, and managing secure OTA updates via USB/SD. Use Value: On-chip 12-bit dual A/D (29 total channels) samples multiple sensors simultaneously; DRW2D renders diagnostic waveforms on local display. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F572NDDDFC#30 | Same RX72N Group, identical pinout and peripheral set, but with 2 MB code flash (vs 4 MB) and 512 KB SRAM (vs 1 MB). | Suitable for cost-sensitive designs where firmware size <2 MB and RAM footprint <512 KB - e.g., simpler gateways or single-axis drives. | Select when full 4 MB flash and 1 MB SRAM are not required; maintains identical timing, safety, and connectivity features. |
| R5F566TEADFC#30 | RX66T Group part: 160 MHz max, 2 MB flash, no IEEE 1588, no GLCDC, no TFU, but adds 3-phase PWM timer (TPU3) optimized for motor control. | Better suited for pure motor control without HMI or time-sync networking - e.g., standalone inverters with encoder feedback only. | Choose for motor-centric applications prioritizing TPU3's advanced 3-phase PWM over IEEE 1588 or graphics; lower cost and power, but reduced peripheral breadth. |
Compared with R5F572NDHDFC#30, the R5F572NDDDFC#30 offers identical real-time capability and safety features at reduced memory capacity, while the R5F566TEADFC#30 trades networking/HMI peripherals for deeper motor-control specialization - making the R5F572NDHDFC#30 optimal for integrated edge nodes requiring both deterministic control and multi-protocol connectivity.
Availability
R5F572NDHDFC#30 is available at Aetrix Electronics and suitable for industrial HMI, networked motor control, smart energy metering, and IIoT edge node applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for R5F572NDHDFC#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets - with deep expertise in real-time embedded systems and functional safety.
The RX72N Group, including R5F572NDHDFC#30, was designed for high-performance industrial edge applications demanding deterministic real-time processing, multi-protocol connectivity (Ethernet/CAN/USB/SD), and built-in functional safety - bridging the gap between general-purpose MCUs and application-specific processors.
FAQ
What is the maximum operating frequency and CoreMark score of the R5F572NDHDFC#30?
The R5F572NDHDFC#30 operates at a maximum frequency of 240 MHz and achieves 1396 CoreMark - measured under conditions specified in Renesas documentation (R01DS0343EJ0120). This performance stems from the RXv3 core's efficient pipeline, dual-issue capability for certain instructions, and zero-wait-state access to on-chip SRAM and flash cache at supported frequencies. The R5F572NDHDFC#30 sustains this speed across its full voltage range (2.7–3.6 V).
Does the R5F572NDHDFC#30 support IEEE 1588 Precision Time Protocol, and how is it implemented?
Yes, the R5F572NDHDFC#30 supports IEEE 1588 via its integrated EPTPCb (Precision Time Protocol Controller) module working in conjunction with the ETHERC Ethernet MAC. Hardware timestamping is applied to PTP frames at the MAC layer with sub-microsecond resolution. The R5F572NDHDFC#30 also provides synchronization triggers to MTU3a and GPTW timers, enabling precise time-aligned actions such as coordinated I/O sampling or waveform generation across distributed nodes.
What safety certifications and features does the R5F572NDHDFC#30 include for industrial use?
The R5F572NDHDFC#30 includes built-in features supporting IEC 60730 Class B compliance: oscillation-stop detection, hardware CRC accelerator (CRC32), independent watchdog timer (IWDT) with configurable window, A/D converter self-diagnostic mode, and register write protection. These are documented in the R01DS0343EJ0120 datasheet and enable developers to meet functional safety requirements without external components. The R5F572NDHDFC#30 itself is not pre-certified, but its features reduce certification effort.
How much on-chip memory does the R5F572NDHDFC#30 provide, and what are its access characteristics?
The R5F572NDHDFC#30 integrates 4 MB of code flash (dual-bank), 1 MB of SRAM (512 KB no-wait ≤120 MHz), 32 KB of ECC RAM (SEC-DED), and 8 KB of standby RAM. Flash access incurs zero wait states up to 120 MHz or on ROM cache hits; above that, one wait state applies. SRAM access is zero-wait up to 240 MHz, though specific 512 KB regions require one wait cycle above 120 MHz. The R5F572NDHDFC#30's memory map supports concurrent execution and background programming.
What is the package type and pin count of the R5F572NDHDFC#30, and which I/O features does it support?
The R5F572NDHDFC#30 uses a 176-pin LFBGA package (PLQP0176KB-C, 24 × 24 mm, 0.5 mm pitch) with 136 general-purpose I/O pins. Each pin supports programmable pull-up resistors, open-drain output, and 5-V tolerance on 19 pins. The R5F572NDHDFC#30 also supports slew-rate control, drive strength selection, and event-triggered I/O toggling via the Event Link Controller - enabling robust interfacing with industrial sensors, actuators, and displays.
R5F572NDHDFC#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LQFP
- Series:
- RX72N
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RXv3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 240MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
- Peripherals:
- DMA, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 136
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 29x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F572NDHDFC#30 FAQ
1.How can I place an order for R5F572NDHDFC#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F572NDHDFC#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F572NDHDFC#30 reliable?
The price and inventory of R5F572NDHDFC#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F572NDHDFC#30 is usually 5 days.
3.What payment methods are accepted for R5F572NDHDFC#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F572NDHDFC#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F572NDHDFC#30?
R5F572NDHDFC#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F572NDHDFC#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F572NDHDFC#30?
For technical support, including R5F572NDHDFC#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F572NDHDFC#30 requirements.
6.How does Aetrix verify that R5F572NDHDFC#30 is sourced from the original manufacturer or authorized distributors?
All R5F572NDHDFC#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F572NDHDFC#30 meets industry standards.
7.What is the process for return or replacement of R5F572NDHDFC#30?
All R5F572NDHDFC#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F572NDHDFC#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F572NDHDFC#30 part is unused and in its original packaging.
Return procedure for R5F572NDHDFC#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R5F572NDHDFC#30 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

