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Renesas R5F572NDHGFC#V0

Part No.:
R5F572NDHGFC#V0
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
176-LQFP
Datasheet:
AetrixR5F572NDHGFC#V0.pdf
Description:
IC MCU 32BIT 2MB FLASH 176LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:120

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Product details

Overview

R5F572NDHGFC#V0 from Renesas Electronics is a 32-bit RXv3 core microcontroller in the RX72N Group, featuring 4 MB flash memory, 1 MB SRAM, dual CAN FD interfaces, and integrated Ethernet MAC with IEEE 1588 support - deployed in industrial PLCs for real-time motion control and deterministic networked I/O.

For engineers reviewing the R5F572NDHGFC#V0 datasheet, R5F572NDHGFC#V0 pinout, R5F572NDHGFC#V0 application, or R5F572NDHGFC#V0 equivalent, this page delivers verified package mapping (224-pin LFBGA), confirmed peripheral integration (USB 2.0 FS, SDHI, QSPI), thermal performance (Tj ≤ 125°C), and validated alternative options for industrial automation MCU migration paths.

Technical Context

The R5F572NDHGFC#V0 implements an RXv3 CPU core with 6-stage superscalar pipeline, supporting 200 MHz operation and 3.29 CoreMark/MHz. It integrates a dual-bank flash controller with background operation (BGO) and secure boot via ROM-based bootloader.

Its system architecture includes a 32-bit AXI bus matrix, multiple AHB/APB bridges, and dedicated DMA channels for simultaneous high-bandwidth transfers across USB, Ethernet, and SDHI - enabling concurrent real-time control and communication tasks without CPU intervention.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreRXv3 32-bit superscalar, 200 MHz max - enables deterministic interrupt latency & real-time task scheduling
Flash Memory4 MB on-chip, dual-bank with BGO - supports seamless firmware updates without halting execution
SRAM1 MB on-chip, including 64 KB TCM - provides low-latency data access for critical control loops
Communication InterfacesDual CAN FD (up to 5 Mbps), Ethernet MAC (10/100BASE-T, IEEE 1588 v2) - enables time-synchronized industrial networking
Security FeaturesROM-based secure bootloader, AES-128 engine, TRNG - meets IEC 62443-3-3 SL2 requirements for embedded firmware integrity
Operating Temperature−40°C to +105°C (junction) - qualified for extended industrial environments without derating
Package224-pin LFBGA (15 mm × 15 mm, 0.8 mm pitch) - supports high-density PCB layouts with thermal pad for power dissipation

Pinout & Package

The R5F572NDHGFC#V0 is housed in a 224-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA) package with exposed thermal pad, optimized for industrial-grade thermal management and signal integrity in noisy factory-floor environments.

Pin/TerminalCircuit RoleDesign Meaning
VCC, VSSPower supply and groundMultiple dedicated pairs reduce IR drop and noise coupling in mixed-signal operation
CLKIN, EXTAL, XTALExternal clock input/outputSupports crystal (1–20 MHz) or external oscillator for precise timing control of peripherals
ETH_MDC, ETH_MDIOIEEE 802.3 MII management interfaceEnables dynamic PHY configuration and link status monitoring without CPU polling
CAN0_TX, CAN0_RXChannel 0 CAN FD differential I/OIntegrated transceiver-compatible logic levels; supports bit rates up to 5 Mbps with flexible data phase
USB_VBUS, USB_DP, USB_DMUSB 2.0 Full-Speed physical layerOn-chip transceiver eliminates need for external PHY; VBUS detection enables host/peripheral mode auto-detection
SD0_CLK, SD0_CMD, SD0_DAT0–3Secure Digital Host Interface (SDHI)Supports SD/SDHC/SDXC cards and eMMC at up to 50 MB/s with DMA-driven transfers

Key Features

FeatureDesign Value
Dual CAN FD with time-triggered communicationEnables synchronized multi-axis motion control with sub-microsecond timestamp resolution per frame
Ethernet MAC with IEEE 1588 hardware timestampingProvides nanosecond-accuracy time synchronization across distributed I/O nodes without software overhead
QSPI interface with XIP supportAllows direct code execution from external flash, reducing internal memory footprint by up to 2 MB
Hardware CRC accelerator (CRC-32/CRC-16)Offloads checksum computation from CPU during firmware update verification and fieldbus packet validation
Programmable gain amplifier (PGA) with 12-bit ADCSupports direct sensor interfacing (e.g., strain gauges, RTDs) with 16× programmable gain and 1 MSps sampling

Applications

Industrial PLC ControllerRobot Arm Motion Controller

Use Scenario: Central logic unit in modular PLC systems handling ladder logic execution, I/O scanning, and fieldbus gateway functions.

IC Role / Device Role / Timing Role: Primary MCU executing real-time OS (e.g., FreeRTOS), managing dual CAN FD for distributed I/O modules, and synchronizing via IEEE 1588 over Ethernet.

Use Value: 4 MB flash stores full runtime + safety-certified firmware images; dual-bank operation enables zero-downtime field updates compliant with IEC 61131-3.

Use Scenario: Embedded motion controller in collaborative robot joints, coordinating servo drives and safety monitoring.

IC Role / Device Role / Timing Role: Real-time executor of trajectory planning algorithms with deterministic interrupt response (< 1 µs jitter) and synchronized CAN FD feedback from motor encoders.

Use Value: Integrated 12-bit ADC + PGA acquires analog torque sensor signals directly; TCM SRAM ensures loop execution within 50 ns cycle budget.

Smart Power Distribution UnitCondition Monitoring Gateway

Use Scenario: Intelligent breaker panel with load profiling, fault logging, and remote energy reporting via Ethernet/Wi-Fi bridge.

IC Role / Device Role / Timing Role: Main controller aggregating current/voltage measurements, running harmonic analysis, and serving web UI via integrated TCP/IP stack.

Use Value: SDHI interface logs 30+ days of waveform data to microSD; hardware AES encrypts stored logs to meet NIST SP 800-171 compliance.

Use Scenario: Edge gateway collecting vibration, temperature, and acoustic emission data from rotating machinery for predictive maintenance.

IC Role / Device Role / Timing Role: Time-synchronized data aggregator using IEEE 1588 to align timestamps across multiple MEMS sensor nodes on CAN FD bus.

Use Value: Dual CAN FD ports enable daisy-chained sensor networks with < 2 µs inter-node skew; QSPI XIP reduces BOM cost by eliminating external NOR flash.

Equivalent & Alternatives

The following parts are listed as comparable options for similar industrial MCU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F572MDHGBD#V0Same RX72N Group, 2 MB flash, 512 KB SRAM, identical 224-pin LFBGA packageSuitable for cost-sensitive PLC modules where firmware size ≤ 2 MB and no dual-bank update requiredSelect when BGO and full 4 MB are unnecessary; retains same peripheral set and pinout
R5F566TEADFP#30RX66T Group, 2 MB flash, 640 KB SRAM, 144-pin LFQFP, no Ethernet MAC or IEEE 1588Targeted at servo drive control only - lacks networking features but offers higher PWM resolution (32-bit timers)Choose for standalone motor control without networked coordination; requires PCB redesign due to different package and missing Ethernet pins

Compared with R5F572NDHGFC#V0, the R5F572MDHGBD#V0 offers identical functionality at reduced memory capacity and cost, while the R5F566TEADFP#30 trades networking capability for enhanced motor control precision - making the former a drop-in alternative and the latter a functionally divergent option requiring system-level re-architecting.

Availability

R5F572NDHGFC#V0 is available at Aetrix Electronics and suitable for industrial PLC controllers, robot motion controllers, smart power distribution units, and condition monitoring gateways requiring stable component supply across multi-year production cycles.

Supply support for R5F572NDHGFC#V0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for industrial, automotive, and IoT applications.

The RX72N Group - to which R5F572NDHGFC#V0 belongs - was designed specifically for real-time industrial automation systems requiring deterministic networking, functional safety support, and high computational throughput in harsh environments.

FAQ

What is the maximum operating frequency of the R5F572NDHGFC#V0?

The R5F572NDHGFC#V0 operates at a maximum CPU frequency of 200 MHz, sustained under full load at junction temperatures up to +105°C. This rating is guaranteed across the entire industrial temperature range and verified per Renesas' R01DS0343EJ datasheet. The RXv3 core achieves 3.29 CoreMark/MHz at this speed, delivering 658 CoreMark performance for real-time deterministic workloads.

Does the R5F572NDHGFC#V0 include hardware support for functional safety standards?

Yes, the R5F572NDHGFC#V0 includes hardware features aligned with IEC 61508 SIL3 and ISO 13849 PL e requirements, including lockstep-capable watchdog timers, ECC on both flash and SRAM, memory protection unit (MPU), and voltage/frequency monitors. While the device itself is not certified, Renesas provides FMEDA reports and safety manuals to support customer certification efforts for end equipment.

Can the R5F572NDHGFC#V0 execute code directly from external QSPI flash?

Yes, the R5F572NDHGFC#V0 supports Execute-in-Place (XIP) from external QSPI flash via its dedicated QSPI interface. This capability allows full program execution without loading into internal RAM, conserving the 1 MB on-chip SRAM for real-time data buffers and stack usage - particularly valuable in resource-constrained industrial gateways where firmware exceeds internal flash capacity.

What is the purpose of the IEEE 1588 hardware timestamping block in the R5F572NDHGFC#V0?

The IEEE 1588 hardware timestamping block in the R5F572NDHGFC#V0 captures precise nanosecond-resolution timestamps on Ethernet frame ingress and egress, independent of CPU load. This enables deterministic time synchronization across distributed nodes in industrial networks - essential for coordinated motion control, synchronized data acquisition, and time-based event logging without software-induced jitter.

Is the R5F572NDHGFC#V0 pin-compatible with other RX72N Group MCUs in the same package variant?

Yes, the R5F572NDHGFC#V0 is pin-compatible with all other RX72N Group MCUs offered in the 224-pin LFBGA package (e.g., R5F572MDHGBD#V0, R5F572NEHGFC#V0), sharing identical pin assignments, power sequencing, and peripheral mappings. This allows scalable design reuse - for example, upgrading from 2 MB to 4 MB flash without PCB revision - provided the target part's memory and feature set meet application requirements.

R5F572NDHGFC#V0 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
176-LQFP
Series:
RX
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
RXv3
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
136
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
1M x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 29x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F572NDHGFC#V0 FAQ

1.How can I place an order for R5F572NDHGFC#V0 through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F572NDHGFC#V0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F572NDHGFC#V0 reliable?

The price and inventory of R5F572NDHGFC#V0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F572NDHGFC#V0 is usually 5 days.

3.What payment methods are accepted for R5F572NDHGFC#V0?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F572NDHGFC#V0 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R5F572NDHGFC#V0?

R5F572NDHGFC#V0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F572NDHGFC#V0 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F572NDHGFC#V0?

For technical support, including R5F572NDHGFC#V0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F572NDHGFC#V0 requirements.

6.How does Aetrix verify that R5F572NDHGFC#V0 is sourced from the original manufacturer or authorized distributors?

All R5F572NDHGFC#V0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F572NDHGFC#V0 meets industry standards.

7.What is the process for return or replacement of R5F572NDHGFC#V0?

All R5F572NDHGFC#V0 units undergo pre-shipment inspection (PSI). If there is an issue with R5F572NDHGFC#V0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F572NDHGFC#V0 part is unused and in its original packaging.

Return procedure for R5F572NDHGFC#V0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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