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Renesas R5F572NNDDFP#30
- Part No.:
- R5F572NNDDFP#30
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
R5F572NNDDFP#30.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 100LFQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,170
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Product details
Overview
R5F572NNDDFP#30 from Renesas is a 32-bit RXv3 microcontroller with 240 MHz CPU, double-precision IEEE-754 FPU, 2 Mbytes on-chip code flash, 1 Mbyte SRAM (512 KB + 512 KB expansion), and integrated Ethernet MAC compliant with IEEE 1588 - deployed in industrial HMIs requiring deterministic real-time control, secure firmware updates, and dual-network redundancy.
For engineers reviewing the R5F572NNDDFP#30 datasheet, R5F572NNDDFP#30 pinout, R5F572NNDDFP#30 application, or R5F572NNDDFP#30 equivalent, key selection criteria include IEEE 1588 timestamping accuracy, dual-bank flash for safe OTA updates, TSIP-based AES-256 encryption, and 136-pin LFBGA package compatibility with industrial PCB thermal and EMI constraints.
Technical Context
The R5F572NNDDFP#30 implements the RXv3 CPU core with hardware-accelerated double-precision floating-point arithmetic (21 instructions) and collective register bank save for fast interrupt response. It integrates two independent Ethernet MAC channels (10/100 Mbps, MII/RMII) with dedicated PTP hardware (EPTPC) supporting sub-microsecond timestamp alignment.
Its memory subsystem includes 2 Mbytes of dual-bank code flash (enabling background programming and bank-swapped boot), 32 Kbytes data flash (100,000 write cycles), and ECC-protected 32 Kbytes RAM. Clock architecture features separate PLLs for system (ICLK up to 240 MHz), peripheral (PCLKA up to 120 MHz), and real-time (RTC, IWDT) domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RXv3 32-bit, 240 MHz max - delivers 1396 CoreMark; supports double-precision IEEE-754 FPU and trigonometric unit (TFU) for motor control math. |
| Memory | 2 Mbytes dual-bank code flash (BGO programming), 32 Kbytes data flash (100k cycles), 1 Mbyte SRAM (512 KB no-wait ≤120 MHz + 512 KB expansion), 32 KB ECC RAM. |
| Ethernet | Dual IEEE 802.3-compliant MACs with IEEE 1588-2008 hardware timestamping (EPTPC), MII/RMII interfaces, and 3-channel EDMAC for zero-copy packet handling. |
| Security | Trusted Secure IP (TSIP) with AES-128/192/256, CRC acceleration, and register write protection - certified for IEC 60730 Class B functional safety. |
| Timers & ADC | 29 timers including GPTW (32-bit ×4), MTU3a (16/32-bit ×9), TPUa (16-bit ×6); dual 12-bit S12AD (8+21 ch), 2×12-bit D/A, on-chip temperature sensor. |
| I/O & Package | 136 general-purpose I/O pins (5-V tolerant on 19 pins, open-drain, pull-up), PLBG0176GA-A 13×13 mm LFBGA, 0.8-mm pitch, –40°C to +105°C (G-version). |
Pinout & Package
Package: PLBG0176GA-A - 176-pin Low-Profile Fine-Pitch Ball Grid Array (LFBGA), 13 mm × 13 mm, 0.8 mm ball pitch, RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, AVCC0, AVCC1 | Power supply inputs | Separate analog/digital rails (2.7–3.6 V); AVCC0/AVCC1 power ADC, RTC, and analog peripherals - decoupling required per Renesas layout guidelines. |
| RES#, MODE0–MODE2 | Reset and boot configuration | Active-low reset pin; MODE pins select boot source (SCI/USB/FINE) and operating mode at power-on - critical for field firmware recovery paths. |
| ETXD0–7, ERXD0–7, ETX_EN, ERX_DV | Ethernet MAC physical interface | 8-bit MII data bus (dual-MAC shared); requires impedance-controlled 50-Ω traces and matched length routing for timing compliance at 25 MHz. |
| MDIO, MDC | PHY management interface | Shared PMGI interface for PHY register access across both Ethernet channels - enables single external PHY or dual independent PHYs. |
| USB_VBUS, USB_DP, USB_DM | USB 2.0 Full-Speed interface | Integrated transceiver supports host/function/OTG; VBUS sensing enables automatic role switching - no external PHY needed. |
Key Features
| Feature | Design Value |
|---|---|
| Dual IEEE 1588 Ethernet MAC | Hardware timestamping with <100 ns resolution enables precise time-synchronized control in distributed industrial automation systems. |
| Dual-bank code flash | Enables seamless firmware updates: new image programmed in inactive bank while active bank executes - zero-downtime OTA deployment. |
| Trusted Secure IP (TSIP) | On-die AES engine with key wrapping, RNG, and secure boot verification - eliminates need for external secure element in cost-sensitive designs. |
| IEC 60730 Class B support | Includes oscillation-stop detection, CRC accelerator, self-test A/D, register lock bits, and IWDT windowing - reduces certification effort for safety-critical appliances. |
| Graphic-LCD controller (GLCDC) | Direct RGB/TFT panel drive (up to 1024×768) with alpha blending and overlay layers - offloads GUI rendering from CPU in HMI applications. |
Applications
| Industrial HMI | Programmable Logic Controller (PLC) |
|---|---|
|
Use Scenario: Touch-enabled operator panel with real-time process visualization, alarm logging, and remote diagnostics over dual Ethernet ports. IC Role / Device Role / Timing Role: Main application processor executing RTOS, driving GLCDC for display, managing dual Ethernet for control network + IT network segregation. Use Value: Dual 1588 MACs enable synchronized clocking across PLC racks; TSIP secures firmware updates; 1 Mbyte SRAM buffers high-resolution UI assets. |
Use Scenario: Compact modular PLC base unit with motion control, I/O scanning, and EtherCAT master capability via external bridge. IC Role / Device Role / Timing Role: Central controller running IEC 61131-3 runtime, coordinating servo axes via GPTW PWM outputs and sampling analog I/O via dual S12AD units. Use Value: 240 MHz RXv3 core handles multi-axis interpolation; 29 timers provide precise I/O scheduling; ECC RAM ensures data integrity during extended operation. |
| Energy Management Gateway | Secure Edge IoT Node |
|
Use Scenario: Substation gateway aggregating Modbus RTU/TCP, CANopen, and DLMS meters, forwarding time-stamped data to SCADA via redundant Ethernet. IC Role / Device Role / Timing Role: Protocol translation hub with IEEE 1588 time stamping on all incoming frames, AES-256 encrypted TLS tunneling to cloud. Use Value: Dual MACs allow primary/backup WAN links; TSIP accelerates TLS handshake; dual-bank flash enables field-upgradable protocol stacks. |
Use Scenario: Tamper-resistant edge node for predictive maintenance, performing FFT-based vibration analysis and encrypted telemetry upload. IC Role / Device Role / Timing Role: Real-time signal processor using TFU for sine/cosine computation and double-precision FPU for spectral analysis algorithms. Use Value: On-chip TFU and FPU eliminate external DSP; 32 Kbytes data flash stores calibration coefficients; 136 GPIOs interface to diverse sensors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit industrial MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5F572MNDHFP#30 | Same RX72N family, identical 176-pin LFBGA package, but with 4 Mbytes code flash and 182 GPIOs - larger memory and I/O count. | Required when application needs >2 Mbytes flash for dual-image storage or additional peripheral drivers. | Select R5F572MNDHFP#30 only if full 4 Mbytes flash and 182 I/Os are needed; R5F572NNDDFP#30 offers optimal cost/performance for 2 Mbyte use cases. |
| R7FA6M2AF3CFP#AA0 | RX600-series successor with Arm Cortex-M4F core (200 MHz), 1 Mbyte flash, no IEEE 1588 hardware, single Ethernet MAC, no TSIP. | Suitable for non-time-critical connectivity where Arm ecosystem tooling is preferred over RX legacy toolchain. | Choose R7FA6M2AF3CFP#AA0 only for new Arm-based designs; R5F572NNDDFP#30 remains superior for IEEE 1588, TSIP, and deterministic real-time latency. |
Compared with R5F572MNDHFP#30, the R5F572NNDDFP#30 trades flash capacity and I/O count for lower unit cost and thermal footprint - ideal for space-constrained gateways. Against R7FA6M2AF3CFP#AA0, it retains hardware-level IEEE 1588 precision and on-die AES acceleration unavailable in the Arm variant.
Availability
R5F572NNDDFP#30 is available at Aetrix Electronics and suitable for industrial HMIs, programmable logic controllers, energy gateways, and secure edge IoT nodes requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for R5F572NNDDFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.
The RX72N Group targets high-performance industrial automation, combining real-time determinism, functional safety, and secure connectivity - with R5F572NNDDFP#30 optimized for compact, thermally constrained gateway and HMI designs.
FAQ
What is the maximum operating frequency and CoreMark score of the R5F572NNDDFP#30?
The R5F572NNDDFP#30 operates at a maximum frequency of 240 MHz and achieves 1396 CoreMark. This performance stems from the RXv3 CPU core's 113-instruction set, double-precision FPU, and optimized pipeline - enabling real-time execution of complex control algorithms without external coprocessors. The R5F572NNDDFP#30 sustains this speed across its full temperature range (–40°C to +105°C).
Does the R5F572NNDDFP#30 support IEEE 1588 Precision Time Protocol hardware timestamping?
Yes, the R5F572NNDDFP#30 integrates a dedicated EPTPC module compliant with IEEE 1588-2008, providing hardware timestamping for both Ethernet MAC channels with sub-100 ns resolution. This enables precise time synchronization across distributed industrial networks - essential for coordinated motion control and event-triggered data acquisition in the R5F572NNDDFP#30-based systems.
What security features does the R5F572NNDDFP#30 include for firmware protection?
The R5F572NNDDFP#30 includes Trusted Secure IP (TSIP) with AES-128/192/256 encryption, secure key storage, and hardware-accelerated CRC generation. It also supports register write protection, oscillation-stop detection, and IEC 60730 Class B self-test functions. These features collectively protect firmware integrity and enable secure boot in R5F572NNDDFP#30 deployments.
What is the package type and pin count of the R5F572NNDDFP#30?
The R5F572NNDDFP#30 uses the PLBG0176GA-A package: a 176-pin Low-Profile Fine-Pitch Ball Grid Array measuring 13 mm × 13 mm with 0.8 mm ball pitch. It provides 136 general-purpose I/O pins (19 of which are 5-V tolerant), matching the mechanical and thermal requirements of dense industrial PCB layouts where the R5F572NNDDFP#30 is commonly deployed.
Can the R5F572NNDDFP#30 execute firmware updates without interrupting operation?
Yes, the R5F572NNDDFP#30 supports seamless firmware updates via its dual-bank code flash architecture. While the active bank runs the current application, the inactive bank can be reprogrammed in the background (BGO). Upon completion, the R5F572NNDDFP#30 swaps banks at reset - enabling zero-downtime field updates critical for industrial R5F572NNDDFP#30 installations.
R5F572NNDDFP#30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-LQFP
- Series:
- RX700
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RXv3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 240MHz
- Connectivity:
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
- Peripherals:
- DMA, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 78
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 1M x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 8x12b, 14x12b; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5F572NNDDFP#30 FAQ
1.How can I place an order for R5F572NNDDFP#30 through Aetrix?
Please submit a Request for Quotation (RFQ) for R5F572NNDDFP#30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5F572NNDDFP#30 reliable?
The price and inventory of R5F572NNDDFP#30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F572NNDDFP#30 is usually 5 days.
3.What payment methods are accepted for R5F572NNDDFP#30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F572NNDDFP#30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R5F572NNDDFP#30?
R5F572NNDDFP#30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R5F572NNDDFP#30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5F572NNDDFP#30?
For technical support, including R5F572NNDDFP#30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F572NNDDFP#30 requirements.
6.How does Aetrix verify that R5F572NNDDFP#30 is sourced from the original manufacturer or authorized distributors?
All R5F572NNDDFP#30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F572NNDDFP#30 meets industry standards.
7.What is the process for return or replacement of R5F572NNDDFP#30?
All R5F572NNDDFP#30 units undergo pre-shipment inspection (PSI). If there is an issue with R5F572NNDDFP#30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5F572NNDDFP#30 part is unused and in its original packaging.
Return procedure for R5F572NNDDFP#30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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