Renesas R5F572TFBDFP#30

Overview

R5F572TFBDFP#30 from Renesas is a 32-bit RXv3 microcontroller optimized for industrial motor control, featuring a 200 MHz CPU core delivering 1160 CoreMark, 1 MB on-chip code flash, 128 KB SRAM (no wait states), and integrated high-resolution PWM with 195 ps timing resolution. It integrates dual 12-bit A/D converters (30 channels total), 6-channel analog comparators, 2-channel 12-bit D/A, CAN 2.0B, full-speed USB 2.0, and TSIP-Lite encryption - deployed in servo drives and inverters requiring IEC 60730 Class B compliance.

For engineers reviewing the R5F572TFBDFP#30 datasheet, R5F572TFBDFP#30 pinout, R5F572TFBDFP#30 application, or R5F572TFBDFP#30 equivalent, key selection criteria include its 144-pin LFQFP package, 200 MHz GPTW/HRPWM timing precision, simultaneous sampling across three A/D units, 5-V-tolerant I/O (4 pins), and support for 3-phase/5-phase complementary PWM generation without external gate drivers.

Technical Context

The R5F572TFBDFP#30 implements the RXv3 CPU core with single-cycle instruction execution, IEEE 754-compliant FPU, and register bank save for fast context switching. Its clock system combines PLL-synthesized 200 MHz ICLK with independent PCLKA (120 MHz), PCLKC (200 MHz for timers), and PCLKD (60 MHz for A/D), enabling concurrent high-speed peripheral operation without CPU bottlenecks.

Motor control is enabled by tightly coupled peripherals: GPTW (10 channels) and MTU3d (9 channels) provide synchronized PWM outputs with dead-time insertion and phase-counting; HRPWM (4 channels) overlays sub-200 ps edge timing control onto GPTW outputs; ELC links A/D triggers, comparator events, and timer actions without interrupt latency - all operating in deep software standby mode.

Key Specifications

Pinout & Package

Package: PLQP0144KA-B - 144-pin Low-profile Quad Flat Package, 20 × 20 mm body, 0.5 mm pitch, exposed thermal pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar motor control MCU applications.

Compared with R5F572MFDDFP#30, the R5F572TFBDFP#30 offers double code flash capacity for complex motion profiles and safety-certified bootloader storage; versus R5F566TEBDFP#30, it delivers higher PWM timing precision, expanded A/D concurrency, and full IEC 60730 Class B hardware support - critical for high-reliability industrial inverters.

Availability

R5F572TFBDFP#30 is available at Aetrix Electronics and suitable for industrial servo drives, AC inverter systems, programmable logic controllers, and electric vehicle onboard chargers requiring stable component supply and long-term production continuity.

Supply support for R5F572TFBDFP#30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, and power solutions for automotive, industrial, and IoT markets.

The RX72T Group is designed specifically for high-performance motor control applications, integrating advanced PWM, analog sensing, and functional safety features to replace discrete gate drivers and external timing ICs in servo and inverter systems.

FAQ

What is the maximum operating frequency and CoreMark score of the R5F572TFBDFP#30?

The R5F572TFBDFP#30 operates at a maximum frequency of 200 MHz and achieves 1160 CoreMark in benchmark testing. This performance level enables real-time execution of complex motor control algorithms such as field-oriented control (FOC) and model predictive control (MPC) within tight timing constraints. The RXv3 CPU core's single-cycle instruction execution and integrated FPU further enhance computational throughput for floating-point-intensive calculations required in modern drive systems.

Does the R5F572TFBDFP#30 support simultaneous sampling across multiple A/D units?

Yes, the R5F572TFBDFP#30 supports simultaneous sampling across three independent 12-bit S12ADH units (totaling 30 channels). Unit 0 and Unit 1 each include three sample-and-hold circuits for pseudo-differential inputs, while Unit 2 provides 14 additional channels. This capability allows synchronized acquisition of phase currents and DC-link voltage - essential for accurate vector control in 3-phase motor drives - without software coordination or timing skew between conversions.

What PWM resolution and channel count does the R5F572TFBDFP#30 provide for motor control?

The R5F572TFBDFP#30 provides 10-channel 32-bit GPTW timers plus 4-channel HRPWM with a minimum timing resolution of 195 ps at 160 MHz. It supports single-phase complementary (10 outputs), 3-phase complementary (3 outputs), and 5-phase complementary (2 outputs) PWM modes. The HRPWM overlays ultra-fine edge positioning onto GPTW outputs, enabling precise dead-time control critical for SiC and GaN-based inverter designs where nanosecond-level timing accuracy prevents shoot-through.

Is the R5F572TFBDFP#30 qualified for IEC 60730 Class B compliance?

Yes, the R5F572TFBDFP#30 includes dedicated hardware features for IEC 60730 Class B compliance: oscillation-stop detection, RAM test assist (DOC), CRC calculator (CRCA), independent watchdog timer (IWDT), low-voltage detection (LVDA), and register write protection. These functions are implemented in silicon and documented in Renesas' Functional Safety Manual (R01UM0145EJ0100), enabling certified motor control systems to meet self-test and fault-detection requirements without external components.

What package type and thermal rating does the R5F572TFBDFP#30 use?

The R5F572TFBDFP#30 uses the PLQP0144KA-B package: a 144-pin Low-profile Quad Flat Package measuring 20 × 20 mm with 0.5 mm pitch and an exposed thermal pad. It is rated for operation from –40°C to +105°C (G-version), making it suitable for industrial environments with elevated ambient temperatures and high-power density PCB layouts requiring efficient heat dissipation through the thermal pad.