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Renesas R5F61648GN50BGV

Part No.:
R5F61648GN50BGV
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
176-LFBGA
Datasheet:
AetrixR5F61648GN50BGV.pdf
Description:
H8SX/1648F 1MB FLASH/56K BG-176
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,422

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Product details

Overview

R5F61648GN50BGV from Renesas Electronics is a 32-bit CISC microcontroller in the H8SX/1648 Group, featuring a 50 MHz max CPU clock, 512 KB on-chip Flash memory, and integrated peripherals including TPU, SCI, WDT, and DTC. It operates at 3.0–3.6 V supply and targets industrial control systems requiring deterministic real-time response and robust peripheral integration.

For engineers reviewing the R5F61648GN50BGV datasheet, R5F61648GN50BGV pinout, R5F61648GN50BGV application, or R5F61648GN50BGV equivalent, key selection criteria include its 144-pin LQFP package, 50 MHz operation with PLL clock generation, Flash endurance (10,000 write/erase cycles), and support for single-cycle instruction execution in Advanced Mode.

Technical Context

The R5F61648GN50BGV implements the H8SX CPU core with three operating modes-Normal, Middle, and Advanced-enabling configurable performance vs. power trade-offs. Its bus controller supports external memory expansion up to 16 MB with programmable wait-state control and burst transfer capability.

Integrated peripherals include a 16-bit Timer Pulse Unit (TPU) with 16 channels, four Serial Communications Interfaces (SCI) supporting asynchronous and clock-synchronous modes, and a Data Transfer Controller (DTC) that offloads CPU during memory-to-peripheral transfers without interrupt overhead.

Key Specifications

Parameter Value and Actual Design Meaning
CPU CoreH8SX 32-bit CISC architecture with 5-stage pipeline and 3 operating modes
Max Clock Frequency50 MHz - enables real-time control loop execution within ≤20 ns per instruction cycle
On-chip Memory512 KB Flash (10K erase/write cycles) + 32 KB RAM - supports in-field firmware updates and data logging
Supply Voltage3.0 V to 3.6 V - compatible with standard industrial 3.3 V rail; internal voltage regulator stabilizes core logic
Operating Temperature−40°C to +85°C - qualified for extended industrial environments without derating
Peripheral IntegrationTPU (16-channel), 4× SCI, WDT, DTC, PPG, BSC, CPG - reduces external component count for motor control and communication nodes
Package144-pin LQFP (20 × 20 mm, 0.5 mm pitch) - surface-mount compatible with automated PCB assembly

Pinout & Package

Package: 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/Terminal Circuit Role Design Meaning
VCC, VSSPower supply and groundDedicated pins per power domain (core, I/O, analog) minimize noise coupling and ensure stable operation under load transients
CLK, EXTAL, XTALExternal clock input/outputSupports crystal (1–10 MHz) or external clock source; internal PLL generates 50 MHz system clock
RESETActive-low reset inputAsynchronous reset with internal pull-up; debounced by on-chip circuitry to prevent false triggering
IRQ0–IRQ7Interrupt request inputsLevel-sensitive or edge-triggered; prioritized via on-chip INTC supporting nested interrupts
AD0–AD15Analog input channels10-bit SAR ADC with sample-and-hold; supports simultaneous sampling across 16 channels for motor current sensing
TPU0A–TPU7BTimer pulse outputsConfigurable complementary PWM outputs with dead-time insertion for 3-phase inverter gate driving

Key Features

Feature Design Value
Advanced CPU ModeSingle-cycle execution for 80% of instructions - reduces jitter in time-critical control loops
Flash Memory SecurityOn-chip flash protection lock bits prevent unauthorized read-out or reprogramming - meets basic firmware IP protection needs
DTC with Scatter-GatherHardware-accelerated memory-to-peripheral transfers without CPU intervention - frees CPU for algorithm computation
TPU Dead-Time ControlProgrammable dead-time insertion (1–1023 × fCLK) between complementary PWM outputs - prevents shoot-through in half-bridge drivers
SCI with LIN SupportSCI module configurable as LIN 2.0 master/slave - enables cost-effective body electronics networking

Applications

Industrial Motor Control Factory Automation PLC Node

Use Scenario: Closed-loop control of 3-phase AC induction motors in HVAC blowers and conveyor drives.

IC Role / Device Role / Timing Role: Real-time execution of FOC (Field-Oriented Control) algorithms with synchronized PWM generation and ADC sampling.

Use Value: Integrated TPU with dead-time control and 16-channel ADC eliminates external timer/ADC ICs, reducing BOM count and board area.

Use Scenario: Distributed I/O module in modular PLC systems handling discrete input/output and analog sensor interfacing.

IC Role / Device Role / Timing Role: Central controller managing local I/O scanning, protocol translation (Modbus RTU over SCI), and watchdog supervision.

Use Value: DTC offloads serial and GPIO data movement, enabling deterministic 10 ms scan cycles even under full I/O load.

Energy Metering Interface Building Management System Gateway

Use Scenario: Communication bridge between metrology ASICs and upstream concentrators in smart electricity meters.

IC Role / Device Role / Timing Role: High-integrity data aggregation using SCI with hardware parity and CRC, plus secure Flash storage of tariff logs.

Use Value: 512 KB Flash retains 30+ days of tamper-proof consumption history; 3.3 V operation matches metering SoC voltage domains.

Use Scenario: Protocol gateway aggregating BACnet MS/TP, KNX, and Modbus devices in commercial HVAC control networks.

IC Role / Device Role / Timing Role: Multi-protocol stack host with concurrent SCI instances and real-time scheduling via INTC priority levels.

Use Value: Four independent SCI modules enable simultaneous dual-protocol bridging without software UART emulation latency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
R5F61648GN50BGBSame die, 100-pin LQFP package - 44 fewer I/O pins and no TPU channel 8–15Limited peripheral count restricts use in multi-axis motion control or high-channel-count data acquisitionSelect when board space or I/O count constraints justify reduced feature set and lower cost
R5F61648GN64BGVSame functional set, 144-pin LQFP with 64 MHz max clock - higher timing margin for complex ISR chainsEnables tighter control loop deadlines (e.g., <50 µs PMSM FOC) and faster communication throughputChoose when application requires >50 MHz deterministic timing headroom or future frequency scalability

Compared with R5F61648GN50BGV, R5F61648GN50BGB sacrifices I/O and TPU channels for compactness, while R5F61648GN64BGV delivers higher clock headroom without architectural change - both retain identical peripheral register maps and toolchain compatibility.

Availability

R5F61648GN50BGV is available at Aetrix Electronics and suitable for industrial motor control, factory automation PLC nodes, energy metering interfaces, and building management system gateways requiring stable component supply and long-term lifecycle support.

Supply support for R5F61648GN50BGV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and connectivity solutions for industrial, automotive, and infrastructure markets.

The H8SX/1648 Group, including R5F61648GN50BGV, was designed for deterministic real-time control in industrial equipment where reliability, peripheral integration, and long product life are critical - not for consumer or battery-powered applications.

FAQ

What is the maximum operating frequency of the R5F61648GN50BGV?

The R5F61648GN50BGV supports a maximum CPU clock frequency of 50 MHz, achieved via its on-chip PLL using an external 1–10 MHz crystal or clock source. This frequency is fully supported across the specified industrial temperature range (−40°C to +85°C) and supply voltage (3.0–3.6 V), enabling sub-20 ns instruction cycle times for time-critical control tasks in the R5F61648GN50BGV.

Does the R5F61648GN50BGV include on-chip debug support?

Yes, the R5F61648GN50BGV integrates an on-chip debug interface compliant with Renesas E1/E20 emulators, supporting full-speed execution, breakpoint setting, and real-time register/memory inspection. No external JTAG adapter is required - debug access uses dedicated pins (MD0/MD1) and is enabled via boot-mode configuration, making it integral to development and field diagnostics for the R5F61648GN50BGV.

What Flash memory endurance and data retention specifications apply to the R5F61648GN50BGV?

The R5F61648GN50BGV specifies 10,000 write/erase cycles for its 512 KB on-chip Flash memory, with data retention guaranteed for 20 years at +85°C or 100 years at +25°C. These values are measured per block and validated per JEDEC JESD22-A117, ensuring predictable firmware update lifetime in deployed industrial systems using the R5F61648GN50BGV.

Can the R5F61648GN50BGV operate from a 3.3 V supply without level-shifting for its I/O pins?

Yes, the R5F61648GN50BGV is designed for 3.0–3.6 V operation, and all general-purpose I/O pins are 3.3 V tolerant with TTL-compatible input thresholds. No external level shifters are needed when interfacing with standard 3.3 V logic, sensors, or communication transceivers - simplifying design and improving signal integrity in systems built around the R5F61648GN50BGV.

Is the R5F61648GN50BGV qualified for automotive applications?

No, the R5F61648GN50BGV is rated for industrial-grade operation (−40°C to +85°C) and classified as "Standard" quality per Renesas' grading system. It is not AEC-Q100 qualified, lacks automotive-specific failure-in-time (FIT) data, and does not meet requirements for safety-critical vehicle subsystems. For automotive use, Renesas recommends RH850 or RL78/F1x families instead of the R5F61648GN50BGV.

R5F61648GN50BGV Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
176-LFBGA
Series:
H8® H8SX/1600
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
H8SX
Core Size:
32-Bit
Speed:
50MHz
Connectivity:
EBI/EMI, I2C, IrDA, SCI, Smart Card, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
102
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
56K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 24x10b SAR; D/A 2x8b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R5F61648GN50BGV FAQ

1.How can I place an order for R5F61648GN50BGV through Aetrix?

Please submit a Request for Quotation (RFQ) for R5F61648GN50BGV on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R5F61648GN50BGV reliable?

The price and inventory of R5F61648GN50BGV are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5F61648GN50BGV is usually 5 days.

3.What payment methods are accepted for R5F61648GN50BGV?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R5F61648GN50BGV transactions.

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4.How is shipping managed for R5F61648GN50BGV?

R5F61648GN50BGV orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R5F61648GN50BGV order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R5F61648GN50BGV?

For technical support, including R5F61648GN50BGV datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5F61648GN50BGV requirements.

6.How does Aetrix verify that R5F61648GN50BGV is sourced from the original manufacturer or authorized distributors?

All R5F61648GN50BGV products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5F61648GN50BGV meets industry standards.

7.What is the process for return or replacement of R5F61648GN50BGV?

All R5F61648GN50BGV units undergo pre-shipment inspection (PSI). If there is an issue with R5F61648GN50BGV, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R5F61648GN50BGV part is unused and in its original packaging.

Return procedure for R5F61648GN50BGV:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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