Renesas R5S76700B200BG

Overview

R5S76700B200BG from Renesas Electronics is a 32-bit RISC microcontroller based on the SuperH™ SH-2A CPU core, featuring 2 MB of on-chip Flash memory, 192 KB of RAM, and integrated peripherals including CAN, USB, Ethernet MAC, and multiple timers. It operates at up to 200 MHz and targets industrial control and networked embedded systems requiring deterministic real-time performance.

For engineers reviewing the R5S76700B200BG datasheet, R5S76700B200BG pinout, R5S76700B200BG application, or R5S76700B200BG equivalent, key selection criteria include its SH-2A FPU support, 200 MHz max clock, 2 MB Flash/192 KB RAM memory map, CAN 2.0B + USB 2.0 OTG + 10/100 Ethernet MAC integration, and BGA-484 package with 3.3 V I/O compatibility.

Technical Context

The R5S76700B200BG implements the SH-2A CPU core with IEEE 754-compliant floating-point unit (FPU), supporting single-precision arithmetic and denormalized number handling. It integrates a 2-stage pipeline with branch prediction and supports both little-endian and big-endian data access modes.

Its system architecture includes a bus controller (BSC) with configurable wait-state logic, clock pulse generator (CPG) with PLL for frequency synthesis, and data transfer controller (DTC) for autonomous DMA operations. The interrupt controller (INTC) supports 128 vector sources with programmable priority levels and nesting capability.

Key Specifications

Pinout & Package

The R5S76700B200BG is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with exposed thermal pad (package code: B200BG). Pin assignments follow Renesas' standard SH7670 Group layout, supporting multiplexed functions across port groups P0–P15, with dedicated power/ground balls distributed per JEDEC MO-271AB standard.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with R5S76700B200BG, the R5S76700B160BG trades clock speed and Flash for lower power and cost, while the R5F72670B200BG extends security and computational capability without changing footprint-making it a forward-compatible upgrade path for secure industrial endpoints.

Availability

R5S76700B200BG is available at Aetrix Electronics and suitable for industrial automation, railway signaling, and smart energy metering requiring stable component supply across long-lifecycle production programs.

Supply support for R5S76700B200BG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for industrial, automotive, and infrastructure markets.

The SH7670 Series - including R5S76700B200BG - was designed for high-reliability embedded control in networked industrial equipment, emphasizing real-time determinism, multi-protocol connectivity, and functional safety readiness.

FAQ

What is the maximum operating frequency of the R5S76700B200BG?

The R5S76700B200BG operates at a maximum CPU frequency of 200 MHz, achieved via its on-chip PLL clock pulse generator (CPG) when driven by an external 10–20 MHz crystal or oscillator. This frequency is guaranteed across the full −40°C to +85°C industrial temperature range and 1.15–1.3 V core supply voltage. The R5S76700B200BG's SH-2A core delivers 200 MIPS at this rate with zero-wait-state Flash execution.

Does the R5S76700B200BG support secure boot functionality?

Yes, the R5S76700B200BG includes ROM-resident secure boot capability that validates the SHA-1 hash of the primary Flash image before execution. This feature prevents unauthorized firmware loading and ensures runtime integrity. The R5S76700B200BG's bootloader also supports user-configurable boot source selection (internal Flash, external bus, or ROM) via MD[2:0] pins at power-on reset.

What package type and pin count does the R5S76700B200BG use?

The R5S76700B200BG uses a 484-ball Fine-Pitch Ball Grid Array (FBGA) package with 0.8 mm pitch and 20 mm × 20 mm body size (package code: B200BG). It includes an exposed thermal pad on the bottom for enhanced heat dissipation. This package is mechanically and electrically compatible with other SH7670 Group devices like R5S76710B200BG and R5S76720B200BG.

Which communication interfaces are integrated into the R5S76700B200BG?

The R5S76700B200BG integrates CAN 2.0B (dual controllers), USB 2.0 Full-Speed OTG (with on-chip transceiver), and a 10/100 Mbps Ethernet MAC with MII/RMII support. It also includes multiple UARTs, SPI, I²C, and LIN-capable serial interfaces. These interfaces are accessible via multiplexed GPIO ports and support concurrent operation under DTC-managed DMA transfers.

Is the R5S76700B200BG qualified for automotive applications?

No, the R5S76700B200BG is specified for Standard quality grade per Renesas' classification, targeting industrial equipment, office automation, and communications systems-not automotive or safety-critical applications. For automotive use, Renesas offers AEC-Q100 qualified derivatives such as the R5F72670B200BG (Grade 2) with extended temperature and reliability validation. The R5S76700B200BG lacks automotive-grade screening and documentation.