Renesas R5S77632AY266BGV
- Part No.:
- R5S77632AY266BGV
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 449-FBGA
- Datasheet:
-
R5S77632AY266BGV.pdf
- Description:
- IC MCU 32BIT ROMLESS 449FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
R5S77632AY266BGV from Renesas Electronics is a 32-bit RISC microcomputer based on the SH-4A CPU core, featuring integrated FPU, MMU, dual 16-KB instruction and operand caches, DDR-SDRAM interface, and SuperHyway bus master capability. It operates at 266 MHz with 1.8 V core voltage and supports real-time OS environments in industrial control and multimedia processing systems.
For engineers reviewing the R5S77632AY266BGV datasheet, R5S77632AY266BGV pinout, R5S77632AY266BGV application, or R5S77632AY266BGV equivalent, key selection criteria include its 266 MHz SH-4A execution speed, 1.8 V core supply, DDRIF timing compliance, 388-pin BGA package, and support for 32-bit address extended mode with PMB-based memory mapping.
Technical Context
The R5S77632AY266BGV implements the SH-4A superscalar architecture with dual-issue 5-stage pipelines, supporting simultaneous integer and floating-point operations. It integrates a Memory Management Unit (MMU) with unified TLB, 32-bit address extended mode via Privileged Space Mapping Buffer (PMB), and hardware-managed cache coherency between IC/OC and external memory.
Its on-chip peripherals include DDR-SDRAM Interface (DDRIF) compliant with JEDEC standards, Serial Sound Interface (SSI), Multimedia Card Interface (MMCIF), and multiple serial communication channels (SCIF, SIOF). The chip supports JTAG-based debugging via H-UDI and includes watchdog timer (WDT), real-time clock (RTC), and interrupt controller (INTC) with 128 vector entries.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | SH-4A superscalar RISC core with dual-issue pipeline and FPU; enables concurrent integer + FP execution for real-time signal processing. |
| Max Clock Frequency | 266 MHz; defines maximum instruction throughput and real-time response latency in deterministic embedded applications. |
| Core Supply Voltage | 1.8 V ±0.1 V; requires dedicated low-noise LDO regulation and impacts power integrity design of PCB decoupling network. |
| Cache Configuration | 16 KB instruction cache + 16 KB operand cache, both two-way set associative; reduces external memory access latency for code/data hotspots. |
| Memory Interface | DDR-SDRAM Interface (DDRIF) supporting DDR2-400 (200 MHz clock, 400 Mbps data rate); enables high-bandwidth frame buffer or streaming buffer access. |
| Address Space | 32-bit physical address space with PMB-enabled extended addressing; allows >4 GB memory mapping using software-configurable region registers. |
| Package | 388-pin plastic BGA (19 mm × 19 mm, 0.8 mm pitch); dictates PCB layout constraints including escape routing, thermal pad design, and reflow profile. |
Pinout & Package
Package: 388-pin Plastic Ball Grid Array (PBGA), 19 mm × 19 mm, 0.8 mm ball pitch, standard JEDEC MO-251AC footprint. Thermal pad exposed on underside for heatsink attachment or PCB copper pour.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC_CORE | Core power supply | 1.8 V supply input requiring local low-ESR ceramic decoupling; shared across CPU, FPU, and cache logic blocks. |
| VCC_IO | I/O power supply | 3.3 V supply for all digital I/O banks; must be sequenced after VCC_CORE to prevent latch-up during power-up. |
| CLKIN | External clock input | Accepts 26.6 MHz crystal or oscillator input; feeds CPG to generate 266 MHz PLL output for CPU core clock. |
| RESET | Active-low reset input | Asynchronous reset assertion forces CPU into defined initial state; must be held low ≥10 ms after VCC stabilization per Renesas hardware guidelines. |
| DDQS0–DDQS3 | DDR data strobes | Differential strobes for DDR2 data groups; require matched trace length and controlled impedance (±10%) to meet setup/hold timing at 200 MHz. |
| ADDR[0:23] | Address bus outputs | 24-bit multiplexed address lines for DDRIF and local bus; used with BA[0:2] to select DDR bank and row/column addresses. |
Key Features
| Feature | Design Value |
|---|---|
| Floating-Point Unit (FPU) | IEEE 754-compliant single/double-precision unit tightly coupled to SH-4A pipeline; eliminates need for external DSP in motor control or audio codec applications. |
| Memory Management Unit (MMU) | Hardware TLB with 64-entry unified TLB and software-managed page tables; enables secure multitasking OS support with process isolation and virtual memory. |
| SuperHyway Bus Master | High-speed 128-bit synchronous bus interface supporting up to 200 MB/s transfer; allows direct DMA access to external peripherals without CPU intervention. |
| DDR-SDRAM Interface (DDRIF) | JEDEC-compliant DDR2 controller with programmable timing registers and auto-refresh control; supports 256 MB–1 GB DDR2 modules with configurable burst lengths. |
| Debug Support | H-UDI (User Debugging Interface) with JTAG TAP and trace buffer; enables non-intrusive real-time instruction tracing and breakpoint management in safety-critical firmware validation. |
Applications
| Industrial Motion Control | Automotive Infotainment Head Unit |
|---|---|
Use Scenario: Real-time servo loop execution with multi-axis position interpolation and PWM generation in CNC machine controllers. IC Role / Device Role / Timing Role: Primary application processor executing motion control algorithms, managing DDR-based trajectory buffers, and synchronizing PWM outputs via on-chip timers. Use Value: SH-4A FPU delivers sub-microsecond floating-point math for inverse kinematics; DDRIF provides low-latency access to 64 MB frame buffer for HMI rendering. | Use Scenario: Integrated navigation/audio/video processing platform in vehicle head units with touchscreen GUI and Bluetooth A2DP streaming. IC Role / Device Role / Timing Role: Main SoC hosting Linux-based infotainment OS, driving LVDS display interface, and managing audio codecs via SSI and MMCIF. Use Value: 266 MHz SH-4A core sustains 30+ FPS GUI rendering; MMU enforces memory protection between safety-critical CAN gateway and entertainment subsystems. |
| Digital Broadcast Set-Top Box | Medical Imaging Workstation |
Use Scenario: MPEG-2/4 video decoding and conditional access processing for cable/satellite STBs with HDMI output. IC Role / Device Role / Timing Role: Baseband processor handling transport stream demuxing, descrambling, and video decode acceleration via custom coprocessor interfaces. Use Value: Dual-cache architecture minimizes instruction fetch stalls during bitstream parsing; SuperHyway bus enables direct DMA to HDMI transmitter without CPU overhead. | Use Scenario: Portable ultrasound imaging system requiring real-time beamforming, Doppler processing, and DICOM image export over Ethernet. IC Role / Device Role / Timing Role: Central compute engine performing FFT-based beam synthesis, color flow mapping, and JPEG2000 compression on acquired RF data. Use Value: Integrated FPU executes complex-valued FFTs in <50 μs per 1024-point transform; DDRIF bandwidth supports 120 MB/s raw RF data ingestion from ADC front-end. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance embedded RISC processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R5S77631AY266BGV | Omits DDR-SDRAM Interface (DDRIF); retains same SH-4A core, FPU, MMU, and cache configuration. | Suitable for applications using SRAM or NOR flash only; not viable where high-bandwidth frame buffer or large working memory is required. | Select when DDR memory is unnecessary and cost reduction is prioritized over memory bandwidth scalability. |
| R5S77632AY333BGV | Same package and feature set but rated for 333 MHz max clock frequency; requires higher VCC_CORE stability and tighter timing margins. | Enables higher instruction throughput in compute-bound tasks (e.g., video encoding), but increases power dissipation by ~22% at full load. | Choose when deterministic 333 MHz operation is validated in thermal/power budget and timing closure is achieved. |
Compared with R5S77632AY266BGV, R5S77631AY266BGV removes DDRIF to reduce cost and complexity for SRAM-centric designs, while R5S77632AY333BGV trades higher power and thermal demand for +25% CPU throughput-both require distinct PCB layout and power delivery validation.
Availability
R5S77632AY266BGV is available at Aetrix Electronics and suitable for industrial motion control, automotive infotainment, digital broadcast, and medical imaging applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for R5S77632AY266BGV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog devices, and power management ICs for industrial, automotive, and consumer markets.
The SH-4A Series, including R5S77632AY266BGV, was designed for high-performance embedded applications demanding real-time processing, memory-intensive multimedia workloads, and deterministic OS execution in resource-constrained environments.
FAQ
What is the maximum operating frequency of the R5S77632AY266BGV?
The R5S77632AY266BGV is rated for a maximum CPU clock frequency of 266 MHz, derived from an internal PLL locked to a 26.6 MHz external reference clock. This frequency is guaranteed under specified 1.8 V core supply and ambient temperature conditions per Renesas Hardware Manual Rev.3.00. Operation beyond this limit may cause timing violations or functional failure.
Does the R5S77632AY266BGV include a memory management unit (MMU)?
Yes, the R5S77632AY266BGV integrates a full-featured MMU supporting 32-bit virtual-to-physical address translation, unified TLB with 64 entries, and software-managed page tables. This enables robust multitasking OS support-including Linux and VxWorks-with memory protection, process isolation, and demand-paged virtual memory, as documented in Section 6 of the SH7763 Hardware Manual.
What type of DDR memory does the R5S77632AY266BGV support?
The R5S77632AY266BGV supports DDR2-400 SDRAM via its dedicated DDR-SDRAM Interface (DDRIF), compliant with JEDEC Standard No. 208F. It supports 256 MB to 1 GB modules with programmable CAS latency, burst lengths of 4 or 8, and auto-refresh control-all configurable through dedicated DDRIF registers in the R5S77632AY266BGV memory map.
Is the R5S77632AY266BGV pin-compatible with other SH-4A family members?
No, the R5S77632AY266BGV is not pin-compatible with other SH-4A variants such as R5S77631AY266BGV due to differences in peripheral integration-specifically, the absence of DDRIF signals in the latter. Pin assignments for DDR-related balls (e.g., DDQS, DQ, DM) are unused or repurposed in non-DDR variants, requiring distinct PCB layouts for each part number.
What debug interface does the R5S77632AY266BGV provide?
The R5S77632AY266BGV features the H-UDI (User Debugging Interface) compliant with IEEE 1149.1 JTAG, supporting boundary-scan testing, real-time instruction trace, and non-intrusive breakpoint insertion. Its dedicated TAP controller and trace buffer allow full visibility into CPU execution flow without halting system operation-critical for validating real-time firmware on R5S77632AY266BGV-based platforms.
R5S77632AY266BGV Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 449-FBGA
- Series:
- SuperH® SH7780
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- SH-4A
- Core Size:
- 32-Bit Single-Core
- Speed:
- 266MHz
- Connectivity:
- Audio Codec, I2C, Memory Card, SCI, SIM, SIO, SSI, USB
- Peripherals:
- DMA, LCD, POR, WDT
- Number of I/O:
- 107
- Program Memory Size:
- -
- Program Memory Type:
- ROMless
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.15V ~ 1.35V
- Data Converters:
- A/D 4x10b; D/A 2x8b
- Oscillator Type:
- External
- Operating Temperature:
- -20°C ~ 75°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R5S77632AY266BGV FAQ
1.How can I place an order for R5S77632AY266BGV through Aetrix?
Please submit a Request for Quotation (RFQ) for R5S77632AY266BGV on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R5S77632AY266BGV reliable?
The price and inventory of R5S77632AY266BGV are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R5S77632AY266BGV is usually 5 days.
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Once your R5S77632AY266BGV order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R5S77632AY266BGV?
For technical support, including R5S77632AY266BGV datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R5S77632AY266BGV requirements.
6.How does Aetrix verify that R5S77632AY266BGV is sourced from the original manufacturer or authorized distributors?
All R5S77632AY266BGV products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R5S77632AY266BGV meets industry standards.
7.What is the process for return or replacement of R5S77632AY266BGV?
All R5S77632AY266BGV units undergo pre-shipment inspection (PSI). If there is an issue with R5S77632AY266BGV, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R5S77632AY266BGV part is unused and in its original packaging.
Return procedure for R5S77632AY266BGV:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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