Renesas R7F100GBF2DFP#BA0
- Part No.:
- R7F100GBF2DFP#BA0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 32-LQFP
- Datasheet:
-
R7F100GBF2DFP#BA0.pdf
- Description:
- IC MCU 16BIT 96KB FLASH 32LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,999
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R7F100GBF2DFP#BA0 from Renesas is a 32-bit RL78/G23 microcontroller with 128 KB code flash, 16 KB RAM, and 8 KB data flash, operating from 1.6–5.5 V. It delivers ultra-low power consumption (41 µA/MHz active, 210 nA data retention), integrates capacitive touch sensing (up to 64 keys), and supports industrial temperature range (−40 to +105°C) for embedded control in battery-powered HMI and sensor nodes.
For engineers reviewing the R7F100GBF2DFP#BA0 datasheet, R7F100GBF2DFP#BA0 pinout, R7F100GBF2DFP#BA0 application, or R7F100GBF2DFP#BA0 equivalent, key selection criteria include its LQFP-32 package, 32-pin I/O count, integrated RTC and SNOOZE mode sequencer for autonomous low-power operation, and dual-voltage I/O capability supporting 1.8/2.5/3.0 V interfaces.
Technical Context
The R7F100GBF2DFP#BA0 implements the RL78 CPU core with CISC architecture and 3-stage pipeline, enabling instruction execution times from 0.03125 µs (32 MHz high-speed mode) to 30.5 µs (32.768 kHz ultra-low-speed mode). Its SNOOZE mode sequencer executes up to 32 preconfigured processes-including ADC sampling, comparator comparison, and timer-triggered actions-without CPU, RAM, or flash activation.
Peripheral integration includes a logic/event link controller (ELCL) for configurable signal routing between peripherals, a 12-bit A/D converter with 26-channel input and internal 1.48 V reference, and dual D/A converters (8-bit, 0–VDD output) with real-time update capability. The device supports background data flash rewriting (BGO) and flash shield window security.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | RL78 32-bit CISC with 3-stage pipeline and multiply/divide/accumulate instructions |
| Flash Memory | 128 KB code flash (2 KB block size) + 8 KB data flash with 1M rewrite cycles (typ.) |
| RAM | 16 KB on-chip RAM with 210 nA data retention current at 4 KB usage |
| Operating Voltage | 1.6–5.5 V supply; supports interface to 1.8/2.5/3.0 V external devices via voltage-tolerant I/O |
| Power Modes | HALT (0.29 µA), STOP (0.34 µA), SNOOZE (1.2 µA typical); wakeup from STOP in ≤3.5 µs |
| ADC Resolution | 8-/10-/12-bit selectable; 26 analog inputs with internal 1.48 V reference and temperature sensor |
| Capacitive Sensing | CTSU2L unit supporting self-capacitance (32 keys) or mutual capacitance (8×8 matrix, 64 keys) |
| Timers | 16-bit TAU (16 channels), 32-bit interval timer (1×32-bit, 2×16-bit, 4×8-bit), RTC (alarm, correction, 1-sec to 99-year count) |
Pinout & Package
Package: 32-pin plastic LQFP (7 × 7 mm, 0.80-mm pitch), RoHS-compliant, tray-packaged (#BA0).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P00 | Analog input / UART TX | ANI17 and TxD1; supports 12-bit ADC channel and LIN-bus-compatible serial output |
| P01 | Analog input / UART RX | ANI16 and RxD1; enables simultaneous analog sensing and LIN communication |
| P10–P17 | Serial interface I/O | Configurable as SCK/SI/SO for up to 8 SPI channels or SCL/SDA for up to 10 I²C channels |
| P30 | Capacitive sensing / RTC | TSCAP and RTC1HZ; provides dedicated pin for touch electrode and precise 1-Hz timekeeping output |
| P60–P61 | I²C interface | SCLA0 and SDAA0; hardware-accelerated I²C master/slave with clock stretching support |
| RESET | System reset input | Active-low asynchronous reset with built-in POR and dual voltage detectors (LVD0/LVD1) |
| VDD / VSS | Power supply rails | Single 1.6–5.5 V supply; REGC capacitor required for internal regulator stability |
| X1 / X2 | Crystal oscillator inputs | Supports 32.768 kHz crystal for RTC accuracy or external high-speed clock up to 32 MHz |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low power operation | 41 µA/MHz active current enables >10-year battery life in sensor nodes with periodic wakeups |
| SNOOZE mode sequencer | Executes 32-step autonomous sequences (ADC→compare→GPIO toggle) without CPU or memory access |
| Capacitive touch sensing (CTSU2L) | Supports both self- and mutual-capacitance configurations for robust touchpad or slider implementation |
| Data flash background operation | BGO allows full program execution from code flash while rewriting data flash-no interrupt latency penalty |
| Flexible clock system | Three on-chip oscillators (high/middle/low speed) plus external crystal support enable dynamic frequency scaling |
| ELCL event routing | Hardware-configurable logic links peripherals (e.g., timer overflow → ADC trigger → DMA transfer) without CPU intervention |
Applications
| Smart Thermostat Interface | Industrial Sensor Node |
|---|---|
Use Scenario: Touch-enabled HVAC control panel with ambient temperature/humidity sensing and wireless reporting. IC Role / Device Role / Timing Role: Main MCU handling capacitive touch decoding, 12-bit ADC acquisition, RTC-based scheduling, and UART-to-Sub-GHz transceiver interface. Use Value: SNOOZE mode reduces average current to <2 µA during display-off periods while maintaining accurate time and scheduled sensor reads. | Use Scenario: Battery-powered vibration/temperature monitor mounted on rotating machinery in factory settings. IC Role / Device Role / Timing Role: Data acquisition controller with 12-bit ADC, RTC timestamping, and low-power wake-on-event via ELCL-linked comparator and timer. Use Value: Dual voltage-tolerant I/O permits direct connection to 3.3 V MEMS sensors; STOP mode draws only 0.34 µA between 10-second measurement intervals. |
| Home Appliance Control Board | Medical Wearable Monitor |
Use Scenario: Washing machine main board requiring motor control, water level sensing, and user LED feedback. IC Role / Device Role / Timing Role: System controller managing PWM-driven triac outputs, 10-bit ADC for pressure sensor, and buzzer/LED drivers via PCLBUZ0/PCLBUZ1. Use Value: Controlled-current drive ports eliminate external current-limiting resistors for LEDs; integrated D/A converters provide smooth analog dimming control. | Use Scenario: Portable pulse oximeter with optical sensor front-end, OLED display, and Bluetooth LE connectivity. IC Role / Device Role / Timing Role: Signal processor acquiring synchronized red/IR photodiode signals via 12-bit ADC, computing SpO₂, and driving OLED via SPI. Use Value: 210 nA data retention current preserves calibration coefficients and patient history in 4 KB RAM during multi-week standby. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F100GBG2DFP#BA0 | Same package and pinout; 128 KB flash, 16 KB RAM, but adds 4-channel 10-bit D/A converter (vs. 2-channel 8-bit on R7F100GBF2DFP#BA0) | Required where higher-resolution analog output (e.g., precision sensor biasing) is needed | Select R7F100GBG2DFP#BA0 when additional DAC channels or resolution justify cost premium |
| R7F100GLF2DFA#BA0 | 64-pin LQFP, 512 KB flash, 48 KB RAM, same peripheral set; larger footprint and higher memory capacity | Used in complex HMI systems needing larger code space for graphics stack or protocol stacks (e.g., Modbus TCP) | Choose R7F100GLF2DFA#BA0 only if design requires >128 KB flash or >32 I/O pins |
Compared with R7F100GBG2DFP#BA0 and R7F100GLF2DFA#BA0, the R7F100GBF2DFP#BA0 offers optimal balance of ultra-low power, capacitive touch capability, and compact 32-pin LQFP packaging for cost-sensitive, space-constrained embedded controls-without over-provisioning memory or I/O.
Availability
R7F100GBF2DFP#BA0 is available at Aetrix Electronics and suitable for smart home controllers, industrial sensor nodes, appliance main boards, and medical wearables requiring stable component supply across production lifecycles.
Supply support for R7F100GBF2DFP#BA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RL78/G23 product line targets ultra-low-power embedded applications demanding high integration, robust capacitive touch, and long battery life-designed specifically for smart appliances, industrial HMIs, and portable medical devices.
FAQ
What is the maximum operating frequency and corresponding supply voltage range for the R7F100GBF2DFP#BA0?
The R7F100GBF2DFP#BA0 operates up to 32 MHz using its high-speed on-chip oscillator, with guaranteed functionality across the full 1.6–5.5 V supply range. At 32 MHz, minimum supply voltage is 2.7 V per datasheet timing specifications; operation below 2.7 V requires reduced clock frequencies (e.g., 24 MHz at 2.4 V, 16 MHz at 1.8 V). The R7F100GBF2DFP#BA0 maintains full peripheral functionality-including ADC, RTC, and CTSU-at all supported frequencies and voltages.
Does the R7F100GBF2DFP#BA0 support hardware debug interfaces, and what are the pin requirements?
Yes, the R7F100GBF2DFP#BA0 supports on-chip debugging via the single-wire SWD interface using dedicated TOOL0 (pin 1), TOOLRxD (P11), and TOOLTxD (P12) pins. These three pins enable full breakpoint, step-through, and memory inspection capabilities without requiring additional debug headers or JTAG adapters. The R7F100GBF2DFP#BA0 does not require external pull-ups on debug lines, as internal resistors are enabled automatically upon debug entry.
How many capacitive touch channels can the R7F100GBF2DFP#BA0 support, and what configuration options exist?
The R7F100GBF2DFP#BA0 integrates the CTSU2L unit supporting up to 32 self-capacitance keys (one pin per key) or 64 mutual-capacitance keys (8×8 matrix). It uses shared I/O pins-such as P30 (TSCAP), P20–P25, and P00–P01-with no dedicated touch-only pins. The R7F100GBF2DFP#BA0 firmware configures scan parameters (voltage, cycle count, noise rejection) per key, and supports automatic baseline tracking and drift compensation for reliable operation in varying environmental conditions.
What are the data flash endurance and write-cycle limitations for the R7F100GBF2DFP#BA0?
The R7F100GBF2DFP#BA0 features 8 KB of data flash rated for 1,000,000 write/erase cycles (typical) with background operation (BGO) support. Each write operation must target aligned 128-byte blocks, and erase operations are performed per 2 KB sector. The R7F100GBF2DFP#BA0 includes flash shield window protection to prevent unauthorized access to data flash contents during programming or runtime.
Can the R7F100GBF2DFP#BA0 operate reliably in industrial environments with extended temperature ranges?
Yes, the R7F100GBF2DFP#BA0 is qualified for industrial applications with an operating ambient temperature range of −40 to +105°C (3C grade), verified across voltage (1.6–5.5 V) and frequency (up to 32 MHz) specifications. It incorporates dual voltage detectors (LVD0/LVD1), enhanced ESD protection (±4 kV HBM), and robust clock fail-safe mechanisms-including automatic switch to backup oscillator on crystal failure-to ensure deterministic behavior in harsh electrical and thermal conditions. The R7F100GBF2DFP#BA0 meets AEC-Q100 stress test requirements for industrial-grade reliability.
R7F100GBF2DFP#BA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 32-LQFP
- Series:
- RL78/G23
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RL78
- Core Size:
- 16-Bit
- Speed:
- 32MHz
- Connectivity:
- CSI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- Capacitive Touch, LVD, POR, PWM, WDT
- Number of I/O:
- 27
- Program Memory Size:
- 96KB (96K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 8K x 8
- RAM Size:
- 12K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.6V ~ 5.5V
- Data Converters:
- A/D 8x8/10b/12b; D/A 2x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7F100GBF2DFP#BA0 FAQ
1.How can I place an order for R7F100GBF2DFP#BA0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7F100GBF2DFP#BA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7F100GBF2DFP#BA0 reliable?
The price and inventory of R7F100GBF2DFP#BA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7F100GBF2DFP#BA0 is usually 5 days.
3.What payment methods are accepted for R7F100GBF2DFP#BA0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7F100GBF2DFP#BA0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7F100GBF2DFP#BA0?
R7F100GBF2DFP#BA0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7F100GBF2DFP#BA0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7F100GBF2DFP#BA0?
For technical support, including R7F100GBF2DFP#BA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7F100GBF2DFP#BA0 requirements.
6.How does Aetrix verify that R7F100GBF2DFP#BA0 is sourced from the original manufacturer or authorized distributors?
All R7F100GBF2DFP#BA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7F100GBF2DFP#BA0 meets industry standards.
7.What is the process for return or replacement of R7F100GBF2DFP#BA0?
All R7F100GBF2DFP#BA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7F100GBF2DFP#BA0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7F100GBF2DFP#BA0 part is unused and in its original packaging.
Return procedure for R7F100GBF2DFP#BA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7F100GBF2DFP#BA0 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

