Renesas R7F100GBF3CFP#BA0

Overview

R7F100GBF3CFP#BA0 from Renesas is a 32-pin LQFP-packaged RL78/G23 16-bit microcontroller designed for ultra-low-power industrial applications. It delivers 128 KB code flash, 8 KB data flash, 16 KB RAM, 1.6–5.5 V operation, and supports STOP mode with 210-nA data retention current. It integrates capacitive touch sensing (CTSU2L), RTC, UARTA, IICA, SAU, and 16-bit TAU timers for sensor interface and control in battery-powered edge devices.

For engineers reviewing the R7F100GBF3CFP#BA0 datasheet, R7F100GBF3CFP#BA0 pinout, R7F100GBF3CFP#BA0 application, or R7F100GBF3CFP#BA0 equivalent, key selection criteria include its 32-pin LQFP-0.80mm package, -40 to +105°C industrial temperature grade (C-field), 128 KB flash/16 KB RAM memory configuration, and integrated CTSU2L for self/mutual capacitance touch sensing up to 64 keys.

Technical Context

The RL78/G23 core implements a 3-stage pipeline CISC architecture with configurable instruction timing (0.03125 µs at 32 MHz high-speed mode or 30.5 µs at 32.768 kHz ultra-low-speed mode). It features SNOOZE mode sequencer (SMS) supporting 32 sequential low-power operations without CPU wake-up, and Logic & Event Link Controller (ELCL) enabling hardware-triggered peripheral chaining independent of software execution.

Power management includes dual voltage detectors (LVD0/LVD1), POR, and three oscillator options: high-speed on-chip (±1.0% accuracy, 1–32 MHz), middle-speed (adjustable 1–4 MHz), and low-speed 32.768 kHz subsystem clock. The device supports background data flash rewriting (BGO) with 1M-cycle endurance and secure block erase prohibition.

Key Specifications

Pinout & Package

Package: 32-pin plastic LQFP (7 × 7 mm, 0.80-mm pitch), RoHS-compliant, tray packaging (#BA0).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit microcontroller applications.

Compared with R7F100GBF3CFP#BA0, R7F100GBG3CFP#BA0 offers identical footprint and electrical specs but no functional advantage at this memory configuration, while R7F100GLF3CFA#BA0 scales capability at the cost of board area, layout effort, and BOM cost-making R7F100GBF3CFP#BA0 optimal for space-constrained industrial control nodes.

Availability

R7F100GBF3CFP#BA0 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart thermostats, PLC I/O modules, and energy meter front-ends requiring stable component supply across extended product lifecycles.

Supply support for R7F100GBF3CFP#BA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT markets.

The RL78/G23 product line targets ultra-low-power industrial and consumer applications requiring robust timing, analog integration, and capacitive touch-designed to replace legacy 8/16-bit MCUs with enhanced security, longevity, and ease of migration.

FAQ

What is the maximum operating frequency and instruction timing of the R7F100GBF3CFP#BA0?

The R7F100GBF3CFP#BA0 operates at up to 32 MHz using its high-speed on-chip oscillator. Its RL78 CPU core achieves a minimum instruction execution time of 0.03125 µs at 32 MHz (high-speed mode) or 30.5 µs at 32.768 kHz (ultra-low-speed mode), configurable per application power/performance needs. This timing is confirmed in the R01DS0395EJ0140 datasheet Section 1.1.

Does the R7F100GBF3CFP#BA0 support capacitive touch sensing, and what configurations are available?

Yes, the R7F100GBF3CFP#BA0 integrates the CTSU2L capacitive touch sensing unit supporting both self-capacitance (up to 32 keys on single pins) and mutual-capacitance (8×8 matrix, up to 64 keys). It operates under VDD = 1.8–5.5 V and includes built-in noise cancellation. Pin assignments like P30 (TSCAP), P60–P62 (CCD), and P20–P23 (TSxx) are dedicated for this function per datasheet Table 1-3.

What are the power supply requirements and low-power modes supported by the R7F100GBF3CFP#BA0?

The R7F100GBF3CFP#BA0 operates from a single 1.6–5.5 V supply and supports HALT, STOP, and SNOOZE modes. In STOP mode with 4 KB RAM retention, it draws just 210 nA. The SNOOZE mode sequencer enables autonomous peripheral operation (e.g., ADC sampling, GPIO toggling) without CPU involvement. These specifications are detailed in Section 1.1 "Ultra-low power consumption technology" of R01DS0395EJ0140.

Which communication interfaces are integrated into the R7F100GBF3CFP#BA0?

The R7F100GBF3CFP#BA0 integrates UARTA (3–6 channels), IICA (4–10 channels), SAU (3–8 channels supporting CSI/SPI), and a remote control signal receiver (REMC). It also supports LIN-bus via UARTA. All interfaces are accessible on its 32-pin LQFP package per pin function tables in R01DS0395EJ0140 Sections 1.3.2 and Table 1-3.

What is the industrial temperature rating and package type of the R7F100GBF3CFP#BA0?

The R7F100GBF3CFP#BA0 is rated for -40 to +105°C ambient operation (C-field application code) and housed in a 32-pin plastic LQFP package (7 × 7 mm, 0.80-mm pitch) with tray packaging (#BA0). This matches the ordering part number decoding in Figure 1-1 and Table 1-1 of R01DS0395EJ0140.

How does the R7F100GBF3CFP#BA0 handle flash memory security and field updates?

The R7F100GBF3CFP#BA0 supports flash shield window protection, block erase prohibition, and self-programming with boot swapping-enabling secure in-field firmware updates without exposing sensitive code. Data flash supports background operation (BGO), allowing code execution from program memory while rewriting parameters. These features are specified in Section 1.1 "Code flash memory" and "Data flash memory" of R01DS0395EJ0140.