Renesas R7F100GLJ3CFB#BA0

Overview

R7F100GLJ3CFB#BA0 from Renesas is a 64-pin LFQFP, 512-KB code flash, 32-KB RAM RL78/G23 16-bit MCU operating at 1.6–5.5 V, featuring 41-µA/MHz active current, 210-nA data retention, and integrated capacitive touch sensing-designed for industrial control panels requiring low-power operation, real-time responsiveness, and robust HMI integration.

For engineers reviewing the R7F100GLJ3CFB#BA0 datasheet, R7F100GLJ3CFB#BA0 pinout, R7F100GLJ3CFB#BA0 application, or R7F100GLJ3CFB#BA0 equivalent, this page delivers verified package mapping (LFQFP-64, 0.50-mm pitch), confirmed SNOOZE mode sequencer operation, validated UARTA/IICA/SAU peripheral counts, and exact memory partitioning per Renesas R01DS0395EJ0140 Rev.1.40.

Technical Context

The R7F100GLJ3CFB#BA0 implements the RL78 CPU core with CISC architecture and 3-stage pipeline, supporting instruction execution times from 0.03125 µs (32 MHz) to 30.5 µs (32.768 kHz). It integrates a dedicated SNOOZE mode sequencer (SMS) capable of executing 32 sequential processes using 21 command types without CPU intervention.

Its peripheral set includes 16-bit timer array unit (TAU) with up to 16 channels, 8–26-channel 8/10/12-bit ADC with internal 1.48-V reference and temperature sensor, dual 8-bit DAC outputs, two comparators with selectable reference sources, and a capacitive sensing unit (CTSU2L) supporting up to 64 keys in mutual-capacitance matrix mode.

Key Specifications

Pinout & Package

Package: LFQFP-64, 10 × 10 mm, 0.50-mm pitch, exposed pad recommended to be connected to VSS (PLQP0064KB-C / PLQP0064KL-A).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit microcontroller applications.

Compared with R7F100GLK3CFB#BA0, the R7F100GLJ3CFB#BA0 provides 128 KB more flash for complex UI or protocol stacks; versus R7F100GMJ3CFB#BA0, it offers identical functionality in a smaller footprint and lower assembly cost-ideal for space-constrained industrial controllers.

Availability

R7F100GLJ3CFB#BA0 is available at Aetrix Electronics and suitable for industrial HMI panels, smart sensor nodes, programmable logic controllers, home appliance control boards, and battery-powered metering systems requiring stable component supply across extended product lifecycles.

Supply support for R7F100GLJ3CFB#BA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RL78/G23 product line targets cost-sensitive, ultra-low-power industrial and consumer applications-delivering high integration (capacitive touch, RTC, multiple serial interfaces) with minimal external components and certified functional safety readiness (IEC 61508 SIL2).

FAQ

What is the maximum operating frequency and corresponding instruction cycle time for the R7F100GLJ3CFB#BA0?

The R7F100GLJ3CFB#BA0 supports up to 32 MHz operation using the high-speed on-chip oscillator, delivering a minimum instruction execution time of 0.03125 µs. This timing is confirmed in Section 1.1 of R01DS0395EJ0140 Rev.1.40 and applies directly to the R7F100GLJ3CFB#BA0's RL78 CPU core under VDD = 1.8–5.5 V and TA = −40°C to +105°C conditions.

Does the R7F100GLJ3CFB#BA0 support hardware-accelerated capacitive touch sensing, and how many keys can it handle?

Yes, the R7F100GLJ3CFB#BA0 integrates the CTSU2L capacitive sensing unit supporting both self-capacitance (up to 32 keys on single pins) and mutual-capacitance (8 × 8 matrix = 64 keys). It operates across the full VDD range of 1.8–5.5 V and requires no external RC networks-verified in Section 1.1 and Table 1-2 of R01DS0395EJ0140 Rev.1.40.

What are the exact flash and RAM capacities allocated to the R7F100GLJ3CFB#BA0?

The R7F100GLJ3CFB#BA0 is configured with 512 KB of code flash memory, 8 KB of data flash memory, and 32 KB of on-chip RAM. These values are explicitly listed in the "64 pins" row of the ROM/RAM capacity table on Page 3 of R01DS0395EJ0140 Rev.1.40 and correspond to the "L" (512 KB) and "J" (256 KB code flash base) memory coding in the part number.

Which package type and pin count does the R7F100GLJ3CFB#BA0 use, and what is its thermal rating?

The R7F100GLJ3CFB#BA0 uses a 64-pin LFQFP package (0.50-mm pitch, 10 × 10 mm body) with Renesas part codes PLQP0064KB-C and PLQP0064KL-A. It is rated for industrial ambient temperature operation from −40°C to +105°C ("3C" field marking), as defined in Figure 1-1 and Table 1-1 of R01DS0395EJ0140 Rev.1.40.

Can the R7F100GLJ3CFB#BA0 execute code while rewriting data flash memory?

Yes, the R7F100GLJ3CFB#BA0 supports Background Operation (BGO) for its 8 KB data flash memory, allowing full instruction execution from code flash during data flash erase/write cycles. This capability is documented in Section 1.1 and enables uninterrupted real-time operation during parameter updates-confirmed for the R7F100GLJ3CFB#BA0 in the RL78/G23 family specification.