Renesas R7F102G4C3CNP#BA0
- Part No.:
- R7F102G4C3CNP#BA0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 16-WFQFN Exposed Pad
- Datasheet:
-
R7F102G4C3CNP#BA0.pdf
- Description:
- 16BIT MCU RL78/G22 32K 16HWQFN -
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
R7F102G4C3CNP#BA0 from Renesas is a 16-pin HWQFN-packaged RL78/G22 16-bit microcontroller with 32 KB code flash, 4 KB RAM, and 2 KB data flash, operating from 1.6–5.5 V. It delivers ultra-low power consumption (37.5 µA/MHz active, 200 nA STOP mode), integrates capacitive touch sensing for up to 29 keys, and supports UART, I²C, SPI, RTC, and 10-bit ADC - ideal for battery-powered industrial HMI and sensor nodes.
For engineers reviewing the R7F102G4C3CNP#BA0 datasheet, R7F102G4C3CNP#BA0 pinout, R7F102G4C3CNP#BA0 application, or R7F102G4C3CNP#BA0 equivalent, key selection criteria include its 16-pin HWQFN (3 × 3 mm, 0.5-mm pitch) footprint, -40°C to +85°C industrial temperature grade, 32 KB flash capacity, CTSU2La capacitive touch unit, and SNOOZE mode sequencer for autonomous low-power sensing duty cycles.
Technical Context
The R7F102G4C3CNP#BA0 implements the RL78 CPU core with a 3-stage pipeline, supporting instruction execution times from 0.03125 µs (32 MHz high-speed oscillator) to 30.5 µs (32.768 kHz subsystem clock). Its SNOOZE mode sequencer executes up to 32 preconfigured commands-including timer comparisons and ADC sampling-without CPU, RAM, or flash activation, enabling deterministic sub-µA wake-and-measure operation.
Peripheral integration includes a 10-bit ADC with internal 1.48 V reference and temperature sensor, dual I²C interfaces (IICA0/IICA1), UARTA with LIN support, and a configurable CTSU2La unit supporting both self- and mutual-capacitance touch sensing across dedicated TSx pins. All peripherals are linked via the Event Link Controller (ELC) for hardware-triggered, zero-CPU-overhead event chaining.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | RL78 16-bit CISC CPU with 3-stage pipeline and multiply/divide/accumulate instructions |
| Memory | 32 KB code flash (2 KB block size), 2 KB data flash (1M rewrite cycles), 4 KB SRAM |
| Power | 1.6–5.5 V supply; 37.5 µA/MHz active current; 200 nA STOP mode; ±1.0% oscillator accuracy |
| Timers & RTC | Eight 16-bit TAU channels; 32-bit interval timer; RTC with alarm and 1-second-to-99-year counting |
| ADC | 10-bit resolution, 3-channel analog input (ANI0–ANI2), internal 1.48 V reference, integrated temperature sensor |
| Capacitive Sensing | CTSU2La unit supporting up to 29 self-capacitance keys or matrix-based mutual-capacitance configurations |
| Package | HWQFN-16 (3 × 3 mm, 0.50-mm pitch), exposed die pad, industrial-grade (-40°C to +85°C) |
Pinout & Package
16-pin HWQFN package (3 × 3 mm, 0.50-mm pitch) with exposed die pad connected to VSS; REGC requires 0.47–1 µF capacitor to VSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P122 / X2 / XT2 / EXCLK / EXCLKS | Crystal/oscillator input | Supports external crystal (up to 20 MHz) or clock input; enables precise timing and low-jitter system clock |
| P121 / X1 / XT1 | Crystal/oscillator input | Paired with P122 for fundamental-mode crystal connection; required for high-accuracy real-time operation |
| REGC | Regulator bypass capacitor terminal | Mandatory 0.47–1 µF ceramic capacitor to VSS ensures stable on-chip voltage regulator output |
| VSS | Ground reference | Primary digital/analog ground; exposed die pad must be connected to this node for thermal and EMI performance |
| VDD | Power supply input | Single 1.6–5.5 V supply powers entire chip; no separate analog/digital rails required |
| RESET | Active-low reset input | Asynchronous reset assertion halts CPU and peripherals; debounced internally for noise immunity |
| P137 / INTP0 | External interrupt input | Dedicated edge-sensitive interrupt pin usable for wake-from-STOP or real-time event capture |
| P30 / INTP3 / TSCAP / RTC1HZ / SCL11 | Multi-function I/O | Configurable as touch sensor capacitor input (TSCAP), RTC 1-Hz output, or I²C clock line (SCL11) |
| P17 / TI02 / TO02 / TS18 / SDA11 | Multi-function I/O | Supports timer input/output, capacitive touch channel 18, or I²C data line (SDA11) |
| P12 / SO00 / TxD0 / TOOLTxD / TS13 | Multi-function I/O | Configurable as SPI output, UART transmit, debug serial output, or touch channel 13 |
| P11 / SI00 / RxD0 / TOOLRxD / SDA00 / TS12 | Multi-function I/O | Supports SPI input, UART receive, debug serial input, I²C data, or touch channel 12 |
| P10 / SCK00 / SCL00 / TS11 | Multi-function I/O | Configurable as SPI clock, I²C clock, or touch channel 11 - shared function reduces pin count without sacrificing interface flexibility |
| P22 / ANI2 / TS20 | Analog/touch input | Simultaneous use as ADC input (ANI2) and capacitive touch channel (TS20); no external components needed for basic sensing |
| P21 / ANI1 / AVREFM | Analog reference input | Accepts external negative reference or connects to internal AVREFM for ratiometric ADC measurements |
| P20 / ANI0 / AVREFP | Analog reference input | Accepts external positive reference or connects to internal AVREFP; enables precision 10-bit conversions with internal 1.48 V reference |
| P40 / TOOL0 | Debug interface pin | Used for on-chip debugging communication (SWD/JTAG); enables full flash programming and real-time trace without additional headers |
Key Features
| Feature | Design Value |
|---|---|
| SNOOZE Mode Sequencer (SMS) | Executes up to 32 preloaded commands (e.g., ADC sampling, value comparison, GPIO toggle) autonomously - eliminates CPU wake-up overhead in periodic sensing applications |
| Capacitive Touch Sensing Unit (CTSU2La) | Hardware-accelerated touch engine supporting self-capacitance (29 keys) or mutual-capacitance matrix; immune to VDD variation and operates down to 1.8 V |
| Background Data Flash Operation (BGO) | Enables code execution from main flash while rewriting data flash - critical for field firmware updates and nonvolatile parameter storage without system interruption |
| Event Link Controller (ELC) | Direct hardware linking of 20 peripheral events (e.g., ADC end-of-conversion → DMA transfer → UART transmit) - removes software latency and CPU load in signal chains |
| Ultra-Low-Power STOP Mode | 200 nA typical current draw with RTC running and 32.768 kHz oscillator active - extends battery life to years in intermittent-sensing applications |
| On-Chip Security | Flash block erase/write prohibition and boot swapping prevent unauthorized firmware modification and enable secure bootloader implementation |
Applications
| Industrial Control Panel | Smart Thermostat Interface |
|---|---|
Use Scenario: Compact wall-mounted control panel with tactile buttons and LED indicators in HVAC systems. IC Role / Device Role / Timing Role: Primary MCU managing capacitive touch inputs, LED drive, local temperature sensing, and RS-485 communication. Use Value: CTSU2La enables reliable touch detection through plastic overlays; 32 KB flash hosts UI logic and communication stack; STOP mode extends battery backup life during power outages. |
Use Scenario: Battery-powered residential thermostat with ambient temperature, humidity, and occupancy sensing. IC Role / Device Role / Timing Role: System controller performing periodic ADC reads, touch wake-up, RTC-based scheduling, and BLE-ready UART communication. Use Value: 200 nA STOP mode enables >5-year coin-cell operation; integrated temperature sensor and 10-bit ADC eliminate external components; SNOOZE sequencer handles timed sensor polling without CPU intervention. |
| Wireless Sensor Node | Programmable Logic Controller (PLC) I/O Module |
Use Scenario: LoRaWAN or NB-IoT endpoint collecting environmental data (temp, humidity, motion) in remote locations. IC Role / Device Role / Timing Role: Edge-processing MCU acquiring sensor data, executing local thresholds, and formatting packets for wireless transmission. Use Value: BGO allows concurrent sensor logging to data flash and radio stack execution; ultra-low active current (37.5 µA/MHz) maximizes energy harvesting efficiency; 16-pin HWQFN minimizes PCB area. |
Use Scenario: DIN-rail mounted digital I/O expansion module for industrial PLCs requiring isolated inputs/outputs and diagnostics. IC Role / Device Role / Timing Role: Local intelligence unit monitoring optocoupled inputs, driving relay drivers, and reporting status over Modbus RTU. Use Value: ELC links input change interrupts directly to GPIO toggles and UART transmit triggers - guarantees <100 µs response time; 32 KB flash accommodates protocol stack and field-upgradable diagnostics firmware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F102G4E3CNP#BA0 | Same package and pinout; 64 KB code flash (vs. 32 KB), identical peripherals and power specs | Required when firmware exceeds 32 KB or future-proofing for feature expansion is needed | Select if larger code space is confirmed necessary; no PCB or firmware changes required beyond flash layout adjustment |
| R7F102G6C3CSP#HA0 | 20-pin LSSOP package (4.4 × 6.5 mm); adds two extra ADC channels (ANI16/ANI17) and UART1 (RxD1/TxD1) | Suitable when additional analog inputs or dual UART isolation is required in space-tolerant designs | Choose for higher I/O count and extended analog capability; requires PCB redesign due to different package and pin mapping |
Compared with R7F102G4C3CNP#BA0, the R7F102G4E3CNP#BA0 offers double flash capacity with full pin and functional compatibility, while the R7F102G6C3CSP#HA0 trades compactness for expanded analog and serial I/O in a larger LSSOP package - enabling direct trade-offs between board area, memory headroom, and peripheral scalability.
Availability
R7F102G4C3CNP#BA0 is available at Aetrix Electronics and suitable for industrial control panels, smart thermostats, wireless sensor nodes, and PLC I/O modules requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for R7F102G4C3CNP#BA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.
The RL78/G22 product line delivers true low-power 16-bit MCUs optimized for cost-sensitive, battery-operated, and touch-enabled industrial and consumer devices - emphasizing ultra-low active/standby current, integrated human-machine interface peripherals, and robust development tooling.
FAQ
What is the maximum operating frequency and corresponding current consumption of the R7F102G4C3CNP#BA0?
The R7F102G4C3CNP#BA0 operates up to 32 MHz using the high-speed on-chip oscillator, achieving a minimum instruction execution time of 0.03125 µs. At this speed, its typical active current is 37.5 µA per MHz - meaning full-speed operation draws approximately 1.2 mA (32 MHz × 37.5 µA/MHz), verified under VDD = 3.3 V and TA = 25°C per the official datasheet.
Does the R7F102G4C3CNP#BA0 support capacitive touch sensing, and how many channels are available?
Yes, the R7F102G4C3CNP#BA0 integrates the CTSU2La capacitive touch sensing unit supporting up to 29 touch channels. In self-capacitance mode, each channel uses one dedicated TSx pin (e.g., TS11–TS20 on the 16-pin variant); mutual-capacitance configurations are possible but require additional pins not present in the 16-pin package - limiting it to single-axis key scanning.
What debug interface does the R7F102G4C3CNP#BA0 provide, and which pins are used?
The R7F102G4C3CNP#BA0 supports on-chip debugging via the SWD (Serial Wire Debug) interface using dedicated pins P40/TOOL0 and RESET. No external debugger header is required - programming and real-time debugging are performed through these two pins, simplifying PCB layout and reducing BOM count compared to JTAG-based alternatives.
Can the R7F102G4C3CNP#BA0 execute code while writing to data flash memory?
Yes, the R7F102G4C3CNP#BA0 supports Background Operation (BGO) for data flash, allowing the CPU to execute instructions from code flash while simultaneously rewriting data flash memory. This capability is essential for seamless firmware updates, parameter logging, and runtime configuration storage without system interruption.
What is the temperature grade and package type of the R7F102G4C3CNP#BA0?
The R7F102G4C3CNP#BA0 is rated for industrial operation from -40°C to +85°C and housed in a 16-pin HWQFN package measuring 3 × 3 mm with 0.50-mm pitch and an exposed die pad. The "C" in the part number denotes industrial temperature grade, and "NP" specifies the HWQFN package per Renesas' ordering nomenclature.
R7F102G4C3CNP#BA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 16-WFQFN Exposed Pad
- Series:
- RL78/G22
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RL78
- Core Size:
- 16-Bit
- Speed:
- 32MHz
- Connectivity:
- CSI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 11
- Program Memory Size:
- 32KB (32K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 2K x 8
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.6V ~ 5.5V
- Data Converters:
- A/D 3x8/10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7F102G4C3CNP#BA0 FAQ
1.How can I place an order for R7F102G4C3CNP#BA0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7F102G4C3CNP#BA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7F102G4C3CNP#BA0 reliable?
The price and inventory of R7F102G4C3CNP#BA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7F102G4C3CNP#BA0 is usually 5 days.
3.What payment methods are accepted for R7F102G4C3CNP#BA0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7F102G4C3CNP#BA0 transactions.
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Once your R7F102G4C3CNP#BA0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7F102G4C3CNP#BA0?
For technical support, including R7F102G4C3CNP#BA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7F102G4C3CNP#BA0 requirements.
6.How does Aetrix verify that R7F102G4C3CNP#BA0 is sourced from the original manufacturer or authorized distributors?
All R7F102G4C3CNP#BA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7F102G4C3CNP#BA0 meets industry standards.
7.What is the process for return or replacement of R7F102G4C3CNP#BA0?
All R7F102G4C3CNP#BA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7F102G4C3CNP#BA0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7F102G4C3CNP#BA0 part is unused and in its original packaging.
Return procedure for R7F102G4C3CNP#BA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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