Renesas R7F123FBG3ANP-C#BA0

Overview

R7F123FBG3ANP-C#BA0 from Renesas Electronics is a 16-bit RL78/F23 microcontroller in a 32-pin QFN package, featuring 64 KB flash memory, 4 KB RAM, and integrated 12-bit ADC with 12 channels. It operates at up to 24 MHz, supports LIN bus communication, and targets low-power embedded control in industrial sensors and motor drives.

For engineers reviewing the R7F123FBG3ANP-C#BA0 datasheet, R7F123FBG3ANP-C#BA0 pinout, R7F123FBG3ANP-C#BA0 application, or R7F123FBG3ANP-C#BA0 equivalent, key selection criteria include its 32-pin QFN-EP (5 × 5 mm) footprint, on-chip debug interface, 1.6–5.5 V supply range, and support for hardware real-time OS (RTOS) features including interrupt nesting and priority levels.

Technical Context

The R7F123FBG3ANP-C#BA0 implements the RL78 CPU core with 16-bit CISC architecture, 3-stage pipeline, and 1.25 DMIPS/MHz performance. It integrates a 12-bit successive-approximation ADC with sample-and-hold, 8-bit D/A converter, and 16-bit timer arrays (TMR00–TMR03) supporting PWM output and input capture.

On-chip peripherals include a LIN controller compliant with ISO 17987-4:2016, 3-channel serial array (SAU) configurable as UART/SPI/I²C, and a 16-bit watchdog timer with window function. Power management includes HALT, STOP, and SNOOZE modes achieving 0.23 µA in deep standby with RTC active.

Key Specifications

Pinout & Package

Package: 32-pin QFN (5 mm × 5 mm, 0.5 mm pitch) with exposed thermal pad (EP). Designed for compact PCB layouts and efficient heat dissipation in space-constrained applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit microcontroller applications.

Compared with R7F123FBG3ANP-C#BA0, the R7F123FGG3ANP-C#BA0 offers scalable memory and CAN while demanding layout changes, whereas the RL78/G13 R5F100LEAFB#30 trades LIN for USB and GPIO flexibility - making R7F123FBG3ANP-C#BA0 optimal for cost-sensitive, LIN-centric 32-pin embedded control.

Availability

R7F123FBG3ANP-C#BA0 is available at Aetrix Electronics and suitable for industrial sensor nodes, automotive body control modules, smart appliance motor drivers, and medical diagnostic handhelds requiring stable component supply across production lifecycles.

Supply support for R7F123FBG3ANP-C#BA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise markets.

The RL78/F23 product line delivers ultra-low-power 16-bit MCUs optimized for cost-sensitive, LIN-based automotive body electronics and industrial control applications with stringent power and footprint constraints.

FAQ

What is the maximum operating frequency of the R7F123FBG3ANP-C#BA0?

The R7F123FBG3ANP-C#BA0 supports a maximum CPU clock frequency of 24 MHz using its internal high-speed oscillator or an external crystal source. This frequency is fully supported across the full −40 °C to +85 °C operating temperature range and 1.6–5.5 V supply voltage range. The R7F123FBG3ANP-C#BA0 achieves 1.25 DMIPS/MHz performance, delivering 30 DMIPS at 24 MHz for real-time control tasks.

Does the R7F123FBG3ANP-C#BA0 include a hardware LIN controller?

Yes, the R7F123FBG3ANP-C#BA0 integrates a dedicated LIN controller compliant with ISO 17987-4:2016. It supports LIN 2.2A and SAE J2602 protocols, automatic baud rate detection, and frame checksum verification. The LIN interface uses P10 (LIN_TX) and P11 (LIN_RX) pins and operates independently of the CPU core, enabling deterministic timing without software overhead - a key feature distinguishing the R7F123FBG3ANP-C#BA0 from general-purpose MCUs.

What package type and dimensions does the R7F123FBG3ANP-C#BA0 use?

The R7F123FBG3ANP-C#BA0 is housed in a 32-pin QFN package measuring 5 mm × 5 mm with 0.5 mm pitch and an exposed thermal pad (EP). This package is designated as "QFN32V5050-EP" per Renesas' package nomenclature. Its compact footprint and thermal pad support high-density PCB layouts and efficient heat dissipation in enclosed industrial enclosures - critical for sustained operation in motor control and sensor applications.

How much flash memory and RAM does the R7F123FBG3ANP-C#BA0 provide?

The R7F123FBG3ANP-C#BA0 includes 64 KB of on-chip flash memory with 100,000 write/erase cycles and 20-year data retention, plus 4 KB of SRAM with built-in parity error detection and correction. These memory resources support complex control algorithms, secure boot code, and real-time data buffering - sufficient for standalone operation in applications such as brushless DC motor control and portable medical diagnostics without external memory expansion.

Is the R7F123FBG3ANP-C#BA0 qualified for automotive applications?

The R7F123FBG3ANP-C#BA0 is rated for industrial temperature range (−40 °C to +85 °C) and classified as a "Standard" quality grade per Renesas documentation. While it supports LIN communication used in automotive body electronics, it is not AEC-Q100 qualified and is not designated for safety-critical automotive systems such as powertrain or ADAS. For automotive use, the R7F123FBG3ANP-C#BA0 is appropriate only in non-safety-related modules like door control or ambient lighting where industrial-grade reliability suffices.