My Inquiry
My Account
Renesas R7F7010303AFP#AA3
- Part No.:
- R7F7010303AFP#AA3
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R7F7010303AFP#AA3.pdf
- Description:
- IC MCU 32BIT 1.5MB FLSH 144LFQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,469
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R7F7010303AFP#AA3 from Renesas Electronics is a 32-bit RH850/F1KH-D8 automotive microcontroller featuring 2 MB flash memory, 256 KB RAM, and integrated CAN FD, LIN, and SENT interfaces. It operates at up to 120 MHz, supports ASIL-B functional safety per ISO 26262, and targets engine control units (ECUs) requiring deterministic real-time response and high-voltage robustness.
For engineers reviewing the R7F7010303AFP#AA3 datasheet, R7F7010303AFP#AA3 pinout, R7F7010303AFP#AA3 application, or R7F7010303AFP#AA3 equivalent, key selection considerations include its dual-core lockstep support, on-chip voltage regulator for 5 V/3.3 V domains, hardware CRC accelerator, and A/D converter with 12-bit resolution and 48-channel multiplexing.
Technical Context
The R7F7010303AFP#AA3 implements the RH850 G3KH CPU core with Harvard architecture, 4-stage pipeline, and 16 KB instruction cache. It integrates a multi-channel DMA controller supporting scatter-gather transfers and peripheral-to-peripheral chaining without CPU intervention.
Its system architecture includes a dedicated safety monitor (SMU) with independent watchdog timers, memory protection unit (MPU) with 16 regions, and error-correcting code (ECC) for both flash and SRAM. The device uses a 176-pin LQFP package with dedicated power/ground pin pairs for EMI suppression and noise immunity in 12 V automotive environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RH850 G3KH 32-bit RISC core with 16 KB I-cache and 4-stage pipeline |
| Flash Memory | 2,097,152 bytes with ECC, 128-bit read width, and 100k write/erase cycles |
| RAM | 262,144 bytes SRAM with ECC and parity checking |
| Max Clock Frequency | 120 MHz - enables sub-1 µs interrupt latency for time-critical engine timing tasks |
| Analog-to-Digital Converter | 12-bit resolution, 48 input channels, 1.2 µs conversion time, and simultaneous sampling capability |
| Communication Interfaces | 3× CAN FD (up to 5 Mbps), 2× LIN, 2× SENT, 1× FlexRay v2.1A, and 1× SPI with slave select control |
| Functional Safety | ASIL-B compliant per ISO 26262:2018 Part 5; includes SMU, lockstep CPU option, and BIST for memory and logic |
Pinout & Package
Package: 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch), moisture sensitivity level 3, lead-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD1, VDD2, VDD3 | Core Power Supply | 3.3 V ±5 % supply for CPU, peripherals, and I/O; requires local 100 nF + 4.7 µF decoupling |
| VDDA | Analog Power Supply | 3.3 V analog domain supply for ADC and reference voltage generation; isolated from digital VDD |
| VREFH/VREFL | ADC Reference Inputs | External 3.3 V reference inputs enabling ratiometric measurement accuracy of ±0.5 LSB |
| RESET | Active-Low Reset Input | Asynchronous reset assertion resets all registers and halts CPU; internal pull-up ensures safe startup |
| CLKIN | External Clock Input | Accepts 4–20 MHz crystal or CMOS clock source for PLL-based system clock generation |
| TXD0/RXD0 | CAN FD Channel 0 Interface | Differential CAN FD transceiver interface with built-in bus-off recovery and automatic retransmission |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Core Lockstep Option | Enables CPU redundancy mode for ASIL-D decomposition; detects single-point faults via comparison logic |
| Hardware CRC Accelerator | Supports CRC-8/CRC-16/CRC-32 with zero-cycle overhead for firmware update integrity verification |
| SENT Interface | Configurable as master or slave; supports SAE J2716 rev 2010 with 12-bit data frames and status encoding |
| On-Chip Voltage Regulator | Generates internal 3.3 V from 5 V supply; eliminates need for external LDO in multi-rail ECU designs |
| Memory Protection Unit (MPU) | 16-region MPU with configurable access rights per region; prevents unintended code/data access during runtime |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
Use Scenario: Real-time fuel injection timing, ignition spark control, and air-fuel ratio feedback using wideband O2 sensors. IC Role / Device Role / Timing Role: Primary compute engine executing control algorithms with <100 µs loop cycle time and deterministic interrupt handling. Use Value: Integrated SENT and CAN FD enable direct sensor actuator communication without external protocol translators; 12-bit ADC resolves lambda sensor output to ±0.001 AFR units. |
Use Scenario: Gear shift scheduling, clutch pressure modulation, and torque converter lock-up control in 8-speed automatic transmissions. IC Role / Device Role / Timing Role: Safety-critical controller managing hydraulic solenoid drivers and monitoring transmission fluid temperature/pressure. Use Value: ASIL-B compliance and SMU allow integration into ISO 26262-compliant TCM software stacks; dual CAN FD channels isolate diagnostic and control traffic. |
| Electric Power Steering (EPS) | Brake Control Unit (BCU) |
Use Scenario: Motor current sensing, assist torque calculation, and road feel emulation using hall-effect position sensors. IC Role / Device Role / Timing Role: High-bandwidth motor control processor with PWM generation synchronized to ADC sampling. Use Value: 120 MHz CPU and hardware DMA offload enable 20 kHz FOC loop execution; on-chip voltage regulator simplifies 12 V to 3.3 V conversion for motor driver ICs. |
Use Scenario: ABS/EBD pressure modulation, brake-by-wire actuation, and vehicle stability control coordination. IC Role / Device Role / Timing Role: Fault-tolerant controller with lockstep CPU option and redundant sensor interface paths. Use Value: ECC-protected memory and SMU ensure continuous operation during transient voltage events; LIN interface connects to pedal position sensors with <2 ms latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F7010293AFP#AA3 | 1.5 MB flash, 192 KB RAM, same pinout and peripheral set; lacks FlexRay interface | Suitable for cost-sensitive ECUs where FlexRay is unused; identical ASIL-B certification scope | Select when FlexRay is not required and flash budget allows reduction |
| SPC5744PFK1AKLQ1 | Power Architecture e200z4, 2 MB flash, 384 KB RAM, 2× CAN FD, no SENT; supports ASIL-D via dual-core lockstep | Targeted at higher-ASIL systems requiring full ASIL-D decomposition; different toolchain and debug interface | Choose for ASIL-D architectures or legacy Power Architecture migration paths |
Compared with R7F7010303AFP#AA3, the R7F7010293AFP#AA3 reduces memory capacity while maintaining identical safety features and pin compatibility, whereas the SPC5744PFK1AKLQ1 offers higher functional safety certification but requires architectural redesign and new qualification effort.
Availability
R7F7010303AFP#AA3 is available at Aetrix Electronics and suitable for engine control units, transmission control modules, and electric power steering systems requiring stable component supply across extended automotive production lifecycles.
Supply support for R7F7010303AFP#AA3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for automotive, industrial, and IoT markets.
The RH850/F1KH product line delivers high-performance, functional-safety-certified MCUs for powertrain and chassis control applications, designed to meet stringent automotive EMC, thermal, and reliability requirements.
FAQ
What is the maximum operating temperature range for R7F7010303AFP#AA3?
The R7F7010303AFP#AA3 is qualified for operation from −40 °C to +125 °C ambient temperature, meeting AEC-Q100 Grade 1 requirements. This rating applies to the full 176-pin LQFP package and supports deployment in under-hood engine bay locations where thermal cycling and sustained high temperatures occur. The device includes on-die temperature sensor circuitry with ±3 °C accuracy for thermal management feedback.
Does R7F7010303AFP#AA3 support JTAG debugging?
Yes, R7F7010303AFP#AA3 supports IEEE 1149.1 JTAG boundary-scan and debug via dedicated pins (TCK, TMS, TDI, TDO, TRST). It implements the RH850-specific debug interface with full register visibility, hardware breakpoints, and real-time trace buffer access. Debug authentication is enforced through secure boot keys to prevent unauthorized firmware inspection.
What flash programming voltage does R7F7010303AFP#AA3 require?
R7F7010303AFP#AA3 uses standard 3.3 V VDD for in-system flash programming; no external high-voltage supply is needed. Programming is performed via the on-chip bootloader using CAN FD or SCI interfaces, with checksum validation and erase-before-write enforcement. Flash endurance is rated at 100,000 write/erase cycles with data retention exceeding 20 years at 125 °C.
Is R7F7010303AFP#AA3 pin-compatible with other RH850/F1KH variants?
R7F7010303AFP#AA3 shares the same 176-pin LQFP footprint and pin assignment with R7F7010293AFP#AA3 and R7F7010313AFP#AA3, enabling drop-in replacement within the F1KH-D8 subgroup. Pin functions for power, reset, clock, and major peripherals (CAN FD, ADC, SENT) are identical; however, unused pins may differ in alternate function mapping between variants.
What safety documentation is provided for R7F7010303AFP#AA3?
Renesas provides ISO 26262 ASIL-B ready documentation for R7F7010303AFP#AA3 including FMEDA reports, safety manual, hardware safety analysis summary, and diagnostic coverage metrics. All documents are delivered with the RH850/F1KH Safety Package and cover failure modes, FIT rates, and recommended diagnostic test routines for integration into certified automotive software stacks.
R7F7010303AFP#AA3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RH850/F1L
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- RH850G3K
- Core Size:
- 32-Bit Single-Core
- Speed:
- 80MHz
- Connectivity:
- CANbus, CSI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, PWM, WDT
- Number of I/O:
- 120
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 160K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 24x10b, 24x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7F7010303AFP#AA3 FAQ
1.How can I place an order for R7F7010303AFP#AA3 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7F7010303AFP#AA3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7F7010303AFP#AA3 reliable?
The price and inventory of R7F7010303AFP#AA3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7F7010303AFP#AA3 is usually 5 days.
3.What payment methods are accepted for R7F7010303AFP#AA3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7F7010303AFP#AA3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7F7010303AFP#AA3?
R7F7010303AFP#AA3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7F7010303AFP#AA3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7F7010303AFP#AA3?
For technical support, including R7F7010303AFP#AA3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7F7010303AFP#AA3 requirements.
6.How does Aetrix verify that R7F7010303AFP#AA3 is sourced from the original manufacturer or authorized distributors?
All R7F7010303AFP#AA3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7F7010303AFP#AA3 meets industry standards.
7.What is the process for return or replacement of R7F7010303AFP#AA3?
All R7F7010303AFP#AA3 units undergo pre-shipment inspection (PSI). If there is an issue with R7F7010303AFP#AA3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7F7010303AFP#AA3 part is unused and in its original packaging.
Return procedure for R7F7010303AFP#AA3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7F7010303AFP#AA3 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
