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Renesas R7F7010323AFP#KA3

Part No.:
R7F7010323AFP#KA3
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
176-LQFP
Datasheet:
AetrixR7F7010323AFP#KA3.pdf
Description:
IC MCU 32BIT 768KB FLSH 176LFQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,504

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Product details

Overview

R7F7010323AFP#KA3 from Renesas Electronics is a 32-bit RH850/F1KH-D8 automotive microcontroller featuring a dual-core lockstep CPU, 2 MB flash memory, 256 KB RAM, and integrated CAN FD, LIN, and Ethernet AVB interfaces. It operates at up to 160 MHz, supports ASIL-D functional safety per ISO 26262, and targets engine control units (ECUs) requiring high-integrity real-time processing.

For engineers reviewing the R7F7010323AFP#KA3 datasheet, R7F7010323AFP#KA3 pinout, R7F7010323AFP#KA3 application, or R7F7010323AFP#KA3 equivalent, key selection criteria include dual-core lockstep execution integrity, on-chip flash ECC with error injection test support, hardware-based memory protection unit (MPU), and qualification for automotive AEC-Q100 Grade 1 operation across –40°C to +125°C ambient.

Technical Context

The R7F7010323AFP#KA3 implements two synchronized RH850 G3KH CPU cores executing identical instructions in lockstep, with dedicated comparator logic detecting divergence within one clock cycle. It integrates a 16-channel e200z7-based DMA controller, 48-channel event link controller (ELC), and 32-channel interrupt controller supporting priority nesting and vectoring.

Hardware safety features include dual independent watchdog timers (WDT and SWDT), voltage/frequency monitors, BIST-enabled flash and RAM self-tests, and a dedicated safety management unit (SMU) that logs fault events and triggers safe state transitions. All peripheral modules support register lock protection and parity/ECC on configuration memory.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Dual RH850 G3KH cores in lockstep mode for ASIL-D compliance
Max Clock Frequency 160 MHz - enables deterministic real-time response for powertrain timing-critical tasks
Flash Memory 2 MB with ECC, 128-bit wide interface, and background erase capability for zero-downtime firmware updates
RAM 256 KB SRAM with ECC and parity protection across all banks
Operating Temperature –40°C to +125°C ambient - qualified per AEC-Q100 Grade 1 for under-hood ECU deployment
Safety Certification ISO 26262 ASIL-D ready with integrated SMU, FIT rate < 100 FIT, and diagnostic coverage > 99% for CPU and memory subsystems
Communication Interfaces 2× CAN FD (up to 5 Mbps), 2× LIN, 1× Ethernet AVB (100BASE-T1), and 4× SPI with slave select arbitration

Pinout & Package

Package: 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/Terminal Circuit Role Design Meaning
VDD_1P2 Core Power Supply 1.2 V ±3% supply for CPU and digital logic; requires low-ESR ceramic decoupling within 5 mm
VDD_3P3 I/O Power Supply 3.3 V ±5% supply for GPIO, CAN transceivers, and analog peripherals; supports 5 V-tolerant inputs
RESET Active-Low Reset Input Asynchronous reset assertion resets all logic domains; internal pull-up enables single external RC network
CLKIN External Crystal Input Accepts 20 MHz ±100 ppm crystal for main PLL reference; supports external clock input mode
TXD0 / RXD0 CAN FD Channel 0 I/O Differential pair for CAN FD physical layer; integrated termination resistors disableable via register
ETH_MDIO / ETH_MDC Ethernet Management Interface IEEE 802.3-compliant MDIO/MDC interface for PHY configuration and status monitoring

Key Features

Feature Design Value
Dual-Core Lockstep Execution Hardware-enforced instruction-by-instruction comparison with immediate fault detection and fail-safe shutdown
On-Chip Flash ECC & BIST Single-bit error correction and double-bit error detection with built-in memory test patterns for production screening
Integrated Safety Management Unit (SMU) Configurable fault response matrix, error logging to non-volatile backup RAM, and automatic safe state entry on critical faults
Hardware Memory Protection Unit (MPU) 8-region MPU with read/write/execute permissions per region, enforced at CPU core level for OS and application isolation
Time-Triggered Communication Support ELC-driven peripheral synchronization with sub-microsecond jitter control for deterministic sensor actuator loops

Applications

Engine Control Unit (ECU) Transmission Control Module (TCM)

Use Scenario: Real-time combustion timing, fuel injection pulse width calculation, and knock detection using crank/cam sensor inputs.

IC Role / Device Role / Timing Role: Primary safety-critical controller executing ASIL-D software partitions with dual-core lockstep verification.

Use Value: Sub-1 µs interrupt latency and deterministic execution enable precise spark advance control within ±0.5° crank angle accuracy.

Use Scenario: Gear shift scheduling, clutch pressure modulation, and torque converter lock-up control under varying load and temperature conditions.

IC Role / Device Role / Timing Role: High-integrity motion controller interfacing with hydraulic solenoids, position sensors, and vehicle CAN backbone.

Use Value: Integrated CAN FD and hardware time-triggered ELC ensure synchronized actuator commands with < 2 µs inter-message jitter.

Brake Control System (BCS) Electric Power Steering (EPS)

Use Scenario: ABS/EBD pressure modulation, brake-by-wire actuation, and vehicle stability intervention using wheel speed and yaw rate data.

IC Role / Device Role / Timing Role: Fault-tolerant safety controller with redundant sensor fusion and fail-operational braking logic.

Use Value: Dual-core lockstep + SMU enables continuous operation during single-point failures while maintaining ASIL-D compliance.

Use Scenario: Motor current control, steering angle compensation, and road feel emulation using torque sensor and motor encoder feedback.

IC Role / Device Role / Timing Role: Real-time motor control MCU with integrated PWM timers, ADC, and CAN FD communication to ADAS domain controller.

Use Value: Hardware-accelerated motor control loop execution at 20 kHz with < 50 ns timer resolution ensures smooth assist response.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive safety microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
R7F7010223AFP#KA3 1 MB flash, 128 KB RAM, same package and pinout; lacks Ethernet AVB and one CAN FD channel Suitable for cost-sensitive ASIL-B/C ECUs where Ethernet connectivity is not required Select when system requirements exclude Ethernet AVB and total flash usage remains below 1 MB
SPC5744PFK1AKLQ1 Power Architecture e200z4 dual-core, 2 MB flash, 384 KB RAM, supports AUTOSAR 4.3 but no native Ethernet AVB Targets legacy AUTOSAR toolchains; requires external PHY for 100BASE-T1 implementation Choose for existing SPC57xx-based platforms needing migration path with minimal software rework

Compared with R7F7010323AFP#KA3, the R7F7010223AFP#KA3 reduces memory and interface count for lower-cost ASIL-B systems, while the SPC5744PFK1AKLQ1 offers AUTOSAR-native support but requires external Ethernet PHY and lacks integrated AVB MAC-layer acceleration.

Availability

R7F7010323AFP#KA3 is available at Aetrix Electronics and suitable for engine control units, transmission control modules, brake control systems, and electric power steering applications requiring stable component supply across automotive production lifecycles.

Supply support for R7F7010323AFP#KA3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RH850/F1KH product line delivers high-performance, functional-safety-certified MCUs for powertrain and chassis control, designed specifically to meet ISO 26262 ASIL-D requirements in harsh automotive environments.

FAQ

What is the maximum operating junction temperature for R7F7010323AFP#KA3?

The R7F7010323AFP#KA3 has a maximum junction temperature of +150°C, validated under AEC-Q100 Grade 1 conditions (–40°C to +125°C ambient). Thermal design must maintain junction temperature below this limit using the specified thermal resistance (θJA = 28°C/W for 176-pin LQFP) and appropriate PCB copper area per Renesas Application Note R01AN3819EJ.

Does R7F7010323AFP#KA3 support AUTOSAR 4.x compliant software stacks?

Yes, R7F7010323AFP#KA3 is certified for AUTOSAR 4.3 and later versions. Renesas provides the EB tresos AutoCore RH850 platform package, including MCAL drivers, OS, and COM stack, fully validated for R7F7010323AFP#KA3 with dual-core lockstep and SMU integration.

How is flash memory protected against corruption during power fluctuations on R7F7010323AFP#KA3?

R7F7010323AFP#KA3 uses hardware-implemented flash ECC with SEC-DED capability, coupled with a power-fail detection circuit that triggers automatic flash write abort and recovery sequence. The on-chip voltage monitor asserts PFS (Power Fail Signal) before VDD drops below 2.7 V, enabling safe state entry and flash state rollback.

Can R7F7010323AFP#KA3 operate in single-core mode for non-safety applications?

No - R7F7010323AFP#KA3 requires both cores to operate in lockstep mode per its safety architecture. The hardware does not support independent core execution or disabling of lockstep verification; attempting to do so violates ASIL-D certification and disables critical safety mechanisms.

What debug interface does R7F7010323AFP#KA3 provide for production programming and field diagnostics?

R7F7010323AFP#KA3 supports JTAG-DP (ARM CoreSight-compatible) and Nexus Class 3+ trace interface via pins TDI/TDO/TMS/TCK/TRST/TRACECLK/TRACECTL. Production programming uses Renesas Flash Programmer with E1/E20 emulators, while field diagnostics leverage the built-in ROM bootloader accessible via CAN FD or UART boot modes.

R7F7010323AFP#KA3 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
176-LQFP
Series:
RH850/F1L
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
RH850G3K
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
150
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
96K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 28x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R7F7010323AFP#KA3 FAQ

1.How can I place an order for R7F7010323AFP#KA3 through Aetrix?

Please submit a Request for Quotation (RFQ) for R7F7010323AFP#KA3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R7F7010323AFP#KA3 reliable?

The price and inventory of R7F7010323AFP#KA3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7F7010323AFP#KA3 is usually 5 days.

3.What payment methods are accepted for R7F7010323AFP#KA3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7F7010323AFP#KA3 transactions.

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4.How is shipping managed for R7F7010323AFP#KA3?

R7F7010323AFP#KA3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R7F7010323AFP#KA3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R7F7010323AFP#KA3?

For technical support, including R7F7010323AFP#KA3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7F7010323AFP#KA3 requirements.

6.How does Aetrix verify that R7F7010323AFP#KA3 is sourced from the original manufacturer or authorized distributors?

All R7F7010323AFP#KA3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7F7010323AFP#KA3 meets industry standards.

7.What is the process for return or replacement of R7F7010323AFP#KA3?

All R7F7010323AFP#KA3 units undergo pre-shipment inspection (PSI). If there is an issue with R7F7010323AFP#KA3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R7F7010323AFP#KA3 part is unused and in its original packaging.

Return procedure for R7F7010323AFP#KA3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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