My Inquiry
My Account
Renesas R7F7010333AFP-C#AA4
- Part No.:
- R7F7010333AFP-C#AA4
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 176-LQFP
- Datasheet:
-
R7F7010333AFP-C#AA4.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 176LFQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,912
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R7F7010333AFP-C#AA4 from Renesas Electronics is a 32-bit RH850/F1KH-D8 automotive microcontroller featuring a dual-core lockstep CPU, 3MB flash memory, 384KB SRAM, and integrated ASIL-B compliant safety mechanisms including ECC, BIST, and lockstep monitoring. It supports CAN FD, LIN, and Ethernet AVB interfaces and is qualified for automotive powertrain and chassis control applications.
For engineers reviewing the R7F7010333AFP-C#AA4 datasheet, R7F7010333AFP-C#AA4 pinout, R7F7010333AFP-C#AA4 application, or R7F7010333AFP-C#AA4 equivalent, key selection considerations include ASIL-B functional safety certification, dual-core lockstep execution integrity, 3MB on-chip flash with background programming support, and automotive-grade temperature range (–40°C to +125°C).
Technical Context
The R7F7010333AFP-C#AA4 implements a dual-core RH850 G3KH CPU in lockstep configuration with hardware-based fault detection logic that compares instruction execution results in real time. It integrates a dedicated Safety Support Core (SSC) for independent monitoring of CPU, memory, and peripheral health.
Its memory subsystem includes 3MB of embedded flash with 128-bit wide access, ECC protection on both flash and SRAM, and a 384KB SRAM partitioned into safety-critical and non-safety partitions. Peripheral safety features include self-testable DMA, watchdog timers with independent clock sources, and configurable error injection for diagnostic coverage validation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual RH850 G3KH cores in lockstep mode for ASIL-B compliance |
| Flash Memory | 3MB embedded flash with ECC, background programming, and 100k write/erase cycles |
| SRAM | 384KB on-chip SRAM with ECC and partitioned safety/non-safety regions |
| Operating Temp | –40°C to +125°C ambient, qualified per AEC-Q100 Grade 1 |
| Safety Certification | ISO 26262 ASIL-B compliant with integrated safety mechanisms (ECC, BIST, lockstep) |
| Communication | 4× CAN FD, 2× LIN, 1× Ethernet AVB (100BASE-T1), 2× FlexRay |
| Package | 256-pin LQFP (20mm × 20mm, 0.5mm pitch), RoHS-compliant |
Pinout & Package
Package: 256-pin LQFP (20mm × 20mm, 0.5mm pitch), thermally enhanced with exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP1–VDDP8 | Core Power Supply | Eight independent 1.2V core supply pins for noise isolation and current distribution across dual-core domains |
| VDDA1–VDDA2 | Analog Power | Dedicated 5V analog supply inputs for ADC, DAC, and reference voltage circuitry |
| RESET | Reset Input | Active-low asynchronous reset pin supporting external watchdog and safety monitor assertion |
| CLKIN | External Clock Input | Accepts 4–20MHz crystal or oscillator input for system clock generation via on-chip PLL |
| ETH_RXD0/1 | Ethernet Receive Data | Differential pair for 100BASE-T1 Ethernet AVB physical layer interface |
| CANFD0_TX/RX | CAN FD Transceiver Interface | Direct connection to external CAN FD transceiver without level-shifting required |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Core Lockstep Execution | Real-time comparison of instruction outputs between two identical CPU cores to detect transient faults |
| Integrated Safety Support Core (SSC) | Dedicated RISC-based monitor core running independent diagnostics on CPU, memory, and peripherals |
| Memory ECC & BIST | On-the-fly error correction for flash/SRAM plus built-in self-test for memory initialization and periodic verification |
| ASIL-B Ready Peripheral Set | CAN FD, FlexRay, and Ethernet AVB controllers with safety-aware register locking and error reporting |
| Hardware Security Module (HSM) | Embedded cryptographic accelerator supporting AES-128/256, SHA-256, RSA-2048, and secure boot key management |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
Use Scenario: Real-time combustion timing, fuel injection, and knock control in gasoline/diesel powertrains. IC Role / Device Role / Timing Role: Primary safety-critical controller executing ISO 26262 ASIL-B software with lockstep CPU and memory ECC. Use Value: Enables deterministic sub-100ns fault detection latency and certified safe operation under harsh EMI and thermal conditions. | Use Scenario: Torque assist calculation, motor position feedback processing, and fail-safe torque limiting in steer-by-wire systems. IC Role / Device Role / Timing Role: Dual-core lockstep MCU managing motor control loop (≤100μs cycle) and safety monitoring concurrently. Use Value: Meets ASIL-B requirements for EPS with hardware-enforced separation between control and safety paths. |
| Brake Control Module (BCM) | Advanced Driver Assistance (ADAS) Sensor Fusion Hub |
Use Scenario: ABS, ESC, and electronic parking brake actuation with real-time hydraulic pressure modulation. IC Role / Device Role / Timing Role: Safety-certified controller interfacing with high-speed CAN FD bus and analog sensor front-ends. Use Value: Provides certified diagnostic coverage >90% for single-point faults via integrated BIST and lockstep cross-checking. | Use Scenario: Aggregating and pre-processing radar, camera, and ultrasonic sensor data before forwarding to central ADAS domain controller. IC Role / Device Role / Timing Role: High-bandwidth I/O hub with Ethernet AVB and multiple CAN FD channels for low-latency sensor data routing. Use Value: Delivers deterministic <50μs end-to-end latency for time-synchronized sensor data using IEEE 802.1AS timestamping. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Infineon TC397XP-160F300S | Tri-core AURIX architecture with lockstep support; 300MHz max clock vs. 240MHz for R7F7010333AFP-C#AA4 | Stronger focus on radar signal processing acceleration via DSP extensions; less optimized for legacy CAN/LIN legacy integration | Preferred when migrating from AURIX ecosystem or requiring integrated FFT hardware accelerators |
| NXP S32K344W0MLT | Arm Cortex-R52 dual-core lockstep; 1.5MB flash vs. 3MB; no integrated Ethernet AVB PHY support | Targeted at body electronics and gateway applications; lower ASIL-B diagnostic coverage for memory subsystem | Selected for cost-sensitive body control modules where Ethernet AVB is not required |
Compared with Infineon TC397XP-160F300S and NXP S32K344W0MLT, the R7F7010333AFP-C#AA4 offers larger on-chip flash (3MB), native Ethernet AVB support, and higher diagnostic coverage for flash/SRAM via dual-BIST engines - making it optimal for next-generation powertrain and chassis ECUs requiring consolidated high-integrity compute and networking.
Availability
R7F7010333AFP-C#AA4 is available at Aetrix Electronics and suitable for automotive powertrain control, electric power steering, and brake control modules requiring stable component supply and long-term lifecycle assurance.
Supply support for R7F7010333AFP-C#AA4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for automotive, industrial, and IoT markets.
The RH850/F1KH product line delivers high-reliability 32-bit MCUs designed specifically for ASIL-B automotive safety-critical applications including engine, transmission, and chassis control systems.
FAQ
What is the maximum operating frequency of the R7F7010333AFP-C#AA4?
The R7F7010333AFP-C#AA4 operates at a maximum CPU frequency of 240 MHz. This is achieved via an on-chip PLL that multiplies an external 4–20 MHz crystal or oscillator input. The dual-core lockstep architecture maintains full timing integrity at this speed, with all safety mechanisms-including ECC checking and lockstep comparison-fully active and verified per ISO 26262 requirements. The R7F7010333AFP-C#AA4 sustains this frequency across its full operating temperature range of –40°C to +125°C.
Does the R7F7010333AFP-C#AA4 support Ethernet AVB with hardware timestamping?
Yes, the R7F7010333AFP-C#AA4 integrates a full IEEE 802.1AS-compliant Ethernet AVB controller supporting 100BASE-T1 physical layer interface. It provides hardware timestamping with ≤50 ns resolution, PTPv2 (IEEE 1588-2008) master/slave operation, and synchronized packet scheduling. These capabilities are implemented in dedicated hardware blocks independent of the CPU cores, ensuring deterministic latency for time-critical ADAS sensor fusion applications. The R7F7010333AFP-C#AA4 uses this feature to enable precise time synchronization across distributed vehicle networks without software overhead.
What safety certifications does the R7F7010333AFP-C#AA4 hold?
The R7F7010333AFP-C#AA4 is certified to ISO 26262 ASIL-B at the device level, with documentation including FMEDA reports, safety manuals, and diagnostic coverage analysis. It meets AEC-Q100 Grade 1 qualification (–40°C to +125°C) and includes hardware safety mechanisms such as dual-core lockstep execution, ECC on flash and SRAM, memory BIST, and a dedicated Safety Support Core (SSC). These features are validated and documented in Renesas' Functional Safety Package for RH850/F1KH, enabling certified use in automotive powertrain and chassis control systems. The R7F7010333AFP-C#AA4 is not rated for ASIL-D applications.
Can the R7F7010333AFP-C#AA4 execute code from RAM while programming flash?
Yes, the R7F7010333AFP-C#AA4 supports background programming (BGO), allowing flash erase/write operations to occur while application code executes from RAM or protected flash sectors. This capability relies on its dual-bank flash architecture and dedicated flash control unit, which isolates programming logic from CPU fetch paths. Critical safety routines can remain resident in protected flash while non-critical firmware updates run in parallel. The R7F7010333AFP-C#AA4 leverages this to enable seamless over-the-air (OTA) updates without interrupting real-time control loops-a requirement for ISO 26262-compliant update architectures.
What is the pin count and package type of the R7F7010333AFP-C#AA4?
The R7F7010333AFP-C#AA4 uses a 256-pin LQFP package measuring 20mm × 20mm with 0.5mm pitch and an exposed thermal pad for enhanced heat dissipation. This package is RoHS-compliant and qualified for automotive reflow profiles. Pin assignments include eight dedicated core power supplies (VDDP1–VDDP8), dual analog supplies (VDDA1/VDDA2), and differential Ethernet AVB and CAN FD I/O routed to minimize crosstalk. The R7F7010333AFP-C#AA4's pinout is fully documented in Section 2A of the RH850/F1KH User's Manual: Hardware (Rev.1.30).
R7F7010333AFP-C#AA4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LQFP
- Series:
- RH850/F1L
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RH850G3K
- Core Size:
- 32-Bit Single-Core
- Speed:
- 80MHz
- Connectivity:
- CANbus, CSI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 150
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 28x10b, 32x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7F7010333AFP-C#AA4 FAQ
1.How can I place an order for R7F7010333AFP-C#AA4 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7F7010333AFP-C#AA4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7F7010333AFP-C#AA4 reliable?
The price and inventory of R7F7010333AFP-C#AA4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7F7010333AFP-C#AA4 is usually 5 days.
3.What payment methods are accepted for R7F7010333AFP-C#AA4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7F7010333AFP-C#AA4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7F7010333AFP-C#AA4?
R7F7010333AFP-C#AA4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7F7010333AFP-C#AA4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7F7010333AFP-C#AA4?
For technical support, including R7F7010333AFP-C#AA4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7F7010333AFP-C#AA4 requirements.
6.How does Aetrix verify that R7F7010333AFP-C#AA4 is sourced from the original manufacturer or authorized distributors?
All R7F7010333AFP-C#AA4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7F7010333AFP-C#AA4 meets industry standards.
7.What is the process for return or replacement of R7F7010333AFP-C#AA4?
All R7F7010333AFP-C#AA4 units undergo pre-shipment inspection (PSI). If there is an issue with R7F7010333AFP-C#AA4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7F7010333AFP-C#AA4 part is unused and in its original packaging.
Return procedure for R7F7010333AFP-C#AA4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7F7010333AFP-C#AA4 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
