Renesas R7F7010493AFP#KA3
- Part No.:
- R7F7010493AFP#KA3
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R7F7010493AFP#KA3.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 144LFQFP
- Quantity:
- Payment:

- Shipping:

Inventory:2,932
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R7F7010493AFP#KA3 from Renesas Electronics is a 32-bit RH850/F1KH-D8 automotive microcontroller featuring dual-core lockstep CPU architecture, 2 MB on-chip flash memory, and ASIL-B compliance per ISO 26262 for safety-critical powertrain and chassis control applications. It integrates CAN FD (up to 5 channels), LIN, SENT, and hardware-based cryptographic acceleration.
For engineers reviewing the R7F7010493AFP#KA3 datasheet, R7F7010493AFP#KA3 pinout, R7F7010493AFP#KA3 application, or R7F7010493AFP#KA3 equivalent, key selection criteria include ASIL-B functional safety certification, dual-core lockstep execution integrity, CAN FD interface count and timing accuracy, flash endurance (100k write/erase cycles), and qualification per AEC-Q100 Grade 1 (-40°C to +125°C).
Technical Context
The R7F7010493AFP#KA3 implements a dual-core RH850 G3KH CPU with lockstep monitoring, enabling real-time fault detection and fail-safe operation in automotive control units. It supports hardware memory protection units (MPU), ECC-protected SRAM (192 KB), and boot ROM with secure boot verification.
Its peripheral set includes five CAN FD controllers compliant with ISO 11898-1:2015, four 12-bit ADCs with simultaneous sampling, and a 32-channel GPTA timer subsystem supporting PWM generation and input capture with ±1 LSB integral nonlinearity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual RH850 G3KH cores in lockstep mode for ASIL-B compliance and fault containment. |
| Flash Memory | 2 MB on-chip flash with 100k write/erase cycles, 128-bit ECC, and background erase capability. |
| RAM | 192 KB SRAM with SEC-DED ECC and parity protection for runtime data integrity. |
| CAN FD Interfaces | 5 independent CAN FD controllers supporting up to 5 Mbps data phase and ISO 11898-1:2015 conformance. |
| ADC | Four 12-bit SAR ADCs with simultaneous sampling across 32 channels and ±1 LSB INL. |
| Operating Temp | AEC-Q100 Grade 1 qualified: -40°C to +125°C ambient, suitable for engine bay and transmission control. |
| Package | 176-pin LQFP (24 × 24 mm, 0.5 mm pitch) with thermal pad for enhanced power dissipation. |
Pinout & Package
Package: 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch) with exposed thermal pad (EPAD) for improved thermal performance in high-power automotive modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD15_0–VDD15_3 | Core Power Supply (1.5 V) | Four dedicated 1.5 V supply pins for CPU core and cache, requiring local decoupling for noise immunity. |
| VDD33_0–VDD33_5 | I/O & Peripheral Power (3.3 V) | Six 3.3 V supply pins for I/O banks and peripherals; grouped by voltage domain for isolation. |
| RESET | Active-low Reset Input | Asynchronous reset pin with internal pull-up; accepts external reset controller signals or watchdog timeout pulses. |
| CLKIN | External Clock Input | Accepts 4–20 MHz crystal or CMOS clock source for main PLL; supports spread-spectrum modulation. |
| CANFD0_TX / CANFD0_RX | CAN FD Channel 0 Interface | Differential transmit/receive pair for first CAN FD bus; compatible with ISO 11898-2 physical layer drivers. |
| AD00–AD31 | Analog Input Channels | 32 dedicated analog input pins mapped to four 12-bit ADC units with programmable sampling windows. |
Key Features
| Feature | Design Value |
|---|---|
| ASIL-B Functional Safety | Hardware lockstep CPU, ECC on flash/SRAM, BIST for RAM/ROM, and safety monitor IP certified per ISO 26262. |
| Cryptographic Acceleration | Dedicated ICUMD module supporting AES-128/256, SHA-256, RSA-2048, and TRNG for secure boot and OTA updates. |
| CAN FD Integration | Five independent CAN FD controllers with time-triggered communication support and flexible data-rate switching. |
| High-Resolution Timing | GPTA subsystem with 32 channels, 1 ns resolution, and hardware dead-time insertion for motor control PWM. |
| Robust I/O Protection | All I/O pins rated for ±8 kV HBM ESD, 100 mA short-circuit current limit, and overvoltage tolerance to 5.5 V. |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection, and knock detection in gasoline/diesel engines. IC Role / Device Role / Timing Role: Primary safety-certified controller executing ASIL-B software with lockstep CPU validation and CAN FD diagnostics. Use Value: Enables deterministic sub-microsecond interrupt latency and hardware-verified execution integrity for torque management and fail-safe shutdown. |
Use Scenario: Closed-loop motor position/speed control and assist-torque calculation in column-assist EPS systems. IC Role / Device Role / Timing Role: Dual-core coordination of motor control loop (GPTA PWM), sensor fusion (ADC + SENT), and vehicle bus communication (CAN FD). Use Value: Delivers 1 ns PWM resolution and simultaneous 32-channel ADC sampling for precise torque ripple suppression and road feel tuning. |
| Brake-by-Wire System | Transmission Control Module (TCM) |
|
Use Scenario: Redundant actuator control and pressure monitoring in electro-hydraulic brake systems. IC Role / Device Role / Timing Role: Safety monitor core validates application core output; both execute independent control algorithms with cross-checking. Use Value: Meets ASIL-D decomposition requirements via dual-lockstep architecture and hardware memory protection unit (MPU) enforcement. |
Use Scenario: Gear shift scheduling, clutch engagement control, and adaptive learning in 8-speed automatic transmissions. IC Role / Device Role / Timing Role: High-bandwidth CAN FD interface synchronizes with engine ECU and body domain controllers for coordinated torque management. Use Value: Five CAN FD channels enable concurrent communication with engine, chassis, and infotainment domains without arbitration delay. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F7010533AFP#KA3 | Same RH850/F1KH-D8 family; 3 MB flash, 256 KB SRAM, identical pinout and peripheral set. | Higher memory capacity supports larger AUTOSAR OS stacks and complex diagnostic routines. | Select when >2 MB flash is required for multi-layer software architecture or extended logging. |
| R7F7010293AFP#KA3 | Same package and core; reduced flash (1 MB), no ICUMD crypto module, 3 CAN FD channels instead of 5. | Limited security and communication bandwidth; suitable for cost-sensitive chassis modules with lower safety scope. | Choose for non-ASIL-D applications where crypto acceleration and full CAN FD channel count are not mandatory. |
Compared with R7F7010493AFP#KA3, the R7F7010533AFP#KA3 offers higher memory headroom for AUTOSAR scalability, while the R7F7010293AFP#KA3 trades flash size, crypto capability, and CAN FD count for cost reduction-making it viable only where those features are unused.
Availability
R7F7010493AFP#KA3 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, brake-by-wire modules, and transmission control modules requiring stable component supply under AEC-Q100 Grade 1 conditions.
Supply support for R7F7010493AFP#KA3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for automotive, industrial, and IoT markets.
The RH850/F1KH product line delivers ASIL-B/C-capable 32-bit MCUs optimized for powertrain, chassis, and advanced driver assistance systems (ADAS) with integrated safety mechanisms and automotive-grade reliability.
FAQ
What is the safety certification level of the R7F7010493AFP#KA3?
The R7F7010493AFP#KA3 is certified for ASIL-B compliance per ISO 26262:2018, supported by hardware lockstep CPU execution, ECC-protected memory, built-in self-test (BIST), and safety manual documentation from Renesas. The R7F7010493AFP#KA3 achieves this through dual-core lockstep monitoring and dedicated safety monitor IP-not software-only checks.
Does the R7F7010493AFP#KA3 support CAN FD with ISO 11898-1:2015 conformance?
Yes, the R7F7010493AFP#KA3 integrates five fully independent CAN FD controllers compliant with ISO 11898-1:2015, supporting data rates up to 5 Mbps in the data phase and classic CAN 1 Mbps in arbitration phase. Each CAN FD channel on the R7F7010493AFP#KA3 includes hardware timestamping and error confinement logic.
What is the maximum operating temperature range for the R7F7010493AFP#KA3?
The R7F7010493AFP#KA3 is qualified per AEC-Q100 Grade 1, with guaranteed operation from −40°C to +125°C ambient temperature. This rating applies to the full device-including CPU, flash, ADC, and CAN FD peripherals-and is validated across voltage and process corners per Renesas test reports.
How much on-chip flash memory does the R7F7010493AFP#KA3 provide?
The R7F7010493AFP#KA3 provides 2 MB of on-chip flash memory with 128-bit ECC protection, 100k write/erase cycle endurance, and background erase capability. This flash capacity supports dual-bank operation for safe firmware updates and meets AUTOSAR memory partitioning requirements in the R7F7010493AFP#KA3.
Is the R7F7010493AFP#KA3 pin-compatible with other RH850/F1KH-D8 variants?
Yes, the R7F7010493AFP#KA3 shares identical 176-pin LQFP packaging and pin assignment with all RH850/F1KH-D8 family members, including R7F7010533AFP#KA3 and R7F7010293AFP#KA3. Pin compatibility enables PCB reuse across memory- and feature-scaled variants of the R7F7010493AFP#KA3 platform.
R7F7010493AFP#KA3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RH850/F1L
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- RH850G3K
- Core Size:
- 32-Bit Single-Core
- Speed:
- 80MHz
- Connectivity:
- CANbus, CSI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, PWM, WDT
- Number of I/O:
- 120
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 24x10b, 24x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7F7010493AFP#KA3 FAQ
1.How can I place an order for R7F7010493AFP#KA3 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7F7010493AFP#KA3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7F7010493AFP#KA3 reliable?
The price and inventory of R7F7010493AFP#KA3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7F7010493AFP#KA3 is usually 5 days.
3.What payment methods are accepted for R7F7010493AFP#KA3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7F7010493AFP#KA3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7F7010493AFP#KA3?
R7F7010493AFP#KA3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7F7010493AFP#KA3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7F7010493AFP#KA3?
For technical support, including R7F7010493AFP#KA3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7F7010493AFP#KA3 requirements.
6.How does Aetrix verify that R7F7010493AFP#KA3 is sourced from the original manufacturer or authorized distributors?
All R7F7010493AFP#KA3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7F7010493AFP#KA3 meets industry standards.
7.What is the process for return or replacement of R7F7010493AFP#KA3?
All R7F7010493AFP#KA3 units undergo pre-shipment inspection (PSI). If there is an issue with R7F7010493AFP#KA3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7F7010493AFP#KA3 part is unused and in its original packaging.
Return procedure for R7F7010493AFP#KA3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7F7010493AFP#KA3 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

