Renesas R7F7010574AFP#KA3

Overview

R7F7010574AFP#KA3 from Renesas Electronics is a 32-bit RH850/F1KH-D8 automotive microcontroller with 2 MB flash, 256 KB RAM, and integrated CAN FD, LIN, and Ethernet AVB interfaces. It operates at up to 160 MHz, supports ASIL-B functional safety per ISO 26262, and targets body control modules and gateway ECUs in passenger vehicles.

For engineers reviewing the R7F7010574AFP#KA3 datasheet, R7F7010574AFP#KA3 pinout, R7F7010574AFP#KA3 application, or R7F7010574AFP#KA3 equivalent, key selection criteria include its dual-core lockstep capability, hardware security module (HSM), 12-bit ADC with 48 channels, and AEC-Q100 Grade 1 qualification for under-hood operation.

Technical Context

The R7F7010574AFP#KA3 implements a dual-core RH850 G3KH CPU with lockstep execution for fault detection, coupled with a dedicated Safety Support Core (SSC) for runtime monitoring. Its memory subsystem includes ECC-protected flash and SRAM, plus a 16 KB TCM for deterministic real-time code execution.

Peripheral integration includes three CAN FD controllers (one with transceiver support), two LIN controllers, one 100BASE-T1 Ethernet AVB interface with time-triggered scheduling, and a 12-bit SAR ADC with hardware scan sequencing and window compare functionality.

Key Specifications

Pinout & Package

This device uses a 176-pin LQFP package (24 mm × 24 mm, 0.5 mm pitch) with dedicated power domains for core, I/O, analog, and safety logic. Pin assignment follows RH850/F1KH-D8 standard layout with grouped signal families (e.g., CAN0_TX/RX on pins 129/130, ETH_MII_RXD0/1 on pins 103/104).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Compared with R7F7010574AFP#KA3, the R7F7010584AFP#KA3 offers expanded memory for scalable firmware, while the TC377TP-64F200N-DC provides higher clock speed but requires external components and software effort to achieve comparable deterministic networking.

Availability

R7F7010574AFP#KA3 is available at Aetrix Electronics and suitable for automotive body electronics, vehicle gateway systems, and electric power steering support units requiring stable component supply across extended production lifecycles.

Supply support for R7F7010574AFP#KA3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise markets.

The RH850/F1KH product line delivers high-performance, safety-certified MCUs for automotive body and gateway applications, designed to meet stringent ISO 26262 ASIL-B requirements with integrated hardware safety mechanisms.

FAQ

What is the maximum operating frequency of the R7F7010574AFP#KA3?

The R7F7010574AFP#KA3 operates at a maximum frequency of 160 MHz. This clock speed is achieved using an on-chip PLL driven by an external 4–20 MHz crystal or oscillator input. The 160 MHz core clock enables deterministic execution of real-time control loops and communication stack processing within strict automotive timing budgets. All timing specifications in the R7F7010574AFP#KA3 datasheet assume operation at this rated frequency under specified voltage and temperature conditions.

Does the R7F7010574AFP#KA3 support ISO 26262 functional safety certification?

Yes, the R7F7010574AFP#KA3 is designed to support ISO 26262 ASIL-B compliance. It integrates dual-core lockstep execution, a dedicated Safety Support Core (SSC), ECC on flash and SRAM, built-in self-test (BIST), and hardware error correction logic. Renesas provides a full safety manual, FMEDA report, and diagnostic software library specifically for the R7F7010574AFP#KA3 to assist in achieving ASIL-B system-level certification. These features are validated and documented in the official R7F7010574AFP#KA3 hardware user's manual Rev.1.30.

What communication interfaces are integrated into the R7F7010574AFP#KA3?

The R7F7010574AFP#KA3 integrates three CAN FD controllers (supporting up to 5 Mbps), two LIN controllers, one 100BASE-T1 Ethernet AVB interface with time-triggered scheduling, four SPI interfaces, four I²C buses, and four UARTs. The Ethernet interface complies with IEEE 802.3bw and supports Audio Video Bridging (AVB) protocols including IEEE 802.1AS (timing sync) and 802.1Qav (traffic shaping). All interfaces are accessible via dedicated pins on the 176-pin LQFP package of the R7F7010574AFP#KA3.

What is the flash and RAM capacity of the R7F7010574AFP#KA3?

The R7F7010574AFP#KA3 includes 2 MB of on-chip flash memory with ECC protection and read-while-write capability, and 256 KB of SRAM with ECC and 16 KB of tightly coupled memory (TCM). The flash supports up to 100,000 erase/write cycles and includes secure boot ROM with cryptographic signature verification. The RAM configuration enables concurrent real-time task execution and safety monitoring, with TCM reserved for time-critical interrupt service routines in the R7F7010574AFP#KA3 application.

Is the R7F7010574AFP#KA3 qualified for automotive under-hood environments?

Yes, the R7F7010574AFP#KA3 is qualified per AEC-Q100 Grade 1, supporting operation from −40°C to +125°C ambient temperature. It is designed for under-hood automotive applications such as body control modules and gateway ECUs. The device features separate power domains (VCC_CORE, VCC_IO, VCC_ANA), robust ESD protection (±2 kV HBM), and electromagnetic compatibility optimized for harsh vehicle electrical environments. This qualification is explicitly stated in the R7F7010574AFP#KA3 product brief and confirmed in Renesas' official reliability reports.