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Renesas R7F701275EABG-C#BC6

Part No.:
R7F701275EABG-C#BC6
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
252-FBGA
Datasheet:
AetrixR7F701275EABG-C#BC6.pdf
Description:
IC MCU 32BIT 4MB FLASH 252FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:641

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Product details

Overview

R7F701275EABG-C#BC6 from Renesas Electronics is a 32-bit RH850/C1M-A1 automotive microcontroller with 2 MB code flash, 256 KB RAM, and dual-lockstep CPU cores supporting ASIL-D functional safety. It integrates CAN FD (2 channels), LIN (3 channels), Ethernet AVB, and hardware security module (HSM) for secure boot and cryptographic acceleration. Used in automotive body control modules requiring high-integrity real-time control.

For engineers reviewing the R7F701275EABG-C#BC6 datasheet, R7F701275EABG-C#BC6 pinout, R7F701275EABG-C#BC6 application, or R7F701275EABG-C#BC6 equivalent, key selection criteria include dual-core lockstep compliance with ISO 26262 ASIL-D, integrated HSM for AES-128/SHA-256, CAN FD data rate up to 5 Mbps, and 176-pin LQFP package with automotive-grade AEC-Q100 Grade 1 qualification.

Technical Context

The R7F701275EABG-C#BC6 implements a dual-core RH850 G3KH CPU architecture with hardware-enforced lockstep execution and error-correcting code (ECC) on both instruction and data memories. It features a dedicated Safety Support Core (SSC) that monitors core divergence, memory integrity, and clock domain faults in real time.

Its peripheral set includes a 12-bit ADC with 48 channels, 32-bit timer units (MTU3, GPT), and a flexible I/O port system supporting programmable slew rate, pull-up/down, and noise filtering per pin-critical for harsh automotive EMI environments.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreRH850 G3KH dual-core lockstep, 400 MHz max, compliant with ISO 26262 ASIL-D decomposition
Memory2 MB on-chip code flash (with ECC), 256 KB SRAM (with ECC), 64 KB data flash
Connectivity2× CAN FD (5 Mbps), 3× LIN, 1× 100BASE-T1 Ethernet AVB, 2× SPI, 2× I²C, 2× UART
Analog Peripherals12-bit ADC (48 ch, 1 µs conversion), 12-bit DAC (2 ch), temperature sensor, reference voltage generator
Safety FeaturesDedicated Safety Support Core (SSC), BIST for CPU/memory, windowed watchdog timers, memory protection unit (MPU)
SecurityHardware Security Module (HSM) with AES-128/192/256, SHA-256, RSA-2048, secure boot ROM, key encryption engine
Package176-pin LQFP (24 × 24 mm, 0.5 mm pitch), AEC-Q100 Grade 1 (−40°C to +125°C)

Pinout & Package

176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch), thermally enhanced with exposed thermal pad. Pinout conforms to RH850/C1M-A1 standard layout per Renesas User's Manual Hardware Rev.1.20 (May 2018), Section 1.2.2.

Pin/TerminalCircuit RoleDesign Meaning
VDD, VDDIOPower supply inputsSeparate 3.3 V domains for core (VDD) and I/O (VDDIO); each requires local decoupling per Renesas layout guidelines
RESETnActive-low reset inputAsynchronous reset with internal pull-up; must be held low ≥100 ns for valid reset assertion
CLKINExternal clock inputAccepts 1–20 MHz crystal or CMOS clock; feeds PLL for 400 MHz core clock generation
TXD0, RXD0UART0 serial interfaceFull-duplex asynchronous communication; supports LIN physical layer via software-controlled baud rate modulation
CTX0, CRX0CAN FD channel 0Differential transceiver interface; supports ISO 11898-1:2015 with bit rates up to 5 Mbps in FD mode
ETH_MDIO, ETH_MDCEthernet management interfaceIEEE 802.3-compliant MDIO/MDC bus for PHY register access and configuration

Key Features

FeatureDesign Value
Dual-core lockstep executionHardware-synchronized CPU cores with real-time comparison and fault reporting-enables ASIL-D compliance without external monitoring IC
Integrated HSMOn-die cryptographic accelerator with dedicated RAM and key storage; isolates secure operations from main CPU context
Flexible I/O configurationPer-pin programmable drive strength, slew rate, pull-up/down, and digital noise filter-reduces external EMI suppression components
Functional safety peripheralsBuilt-in self-test (BIST) for flash/SRAM, SSC-monitored watchdogs, and memory protection unit (MPU) with region-based access control
Ethernet AVB supportHardware timestamping, traffic shaping, and stream reservation protocol (SRP) acceleration-enables deterministic audio/video streaming over automotive Ethernet

Applications

Body Control Module (BCM)Gateway ECU

Use Scenario: Centralized control of lighting, door locks, windows, and HVAC in modern vehicles.

IC Role / Device Role / Timing Role: Main application controller executing real-time state machines with fail-safe diagnostics and CAN FD communication to sub-nodes.

Use Value: Dual-core lockstep and ECC memory ensure uninterrupted operation during transient EMI events; HSM enables secure OTA firmware updates.

Use Scenario: Aggregation and routing of data between CAN FD, LIN, and Ethernet domains in zonal architectures.

IC Role / Device Role / Timing Role: High-throughput message router with time-synchronized packet forwarding and firewall policy enforcement.

Use Value: Integrated 100BASE-T1 Ethernet AVB with hardware timestamping meets AUTOSAR Adaptive timing requirements; dual CAN FD interfaces handle legacy and high-speed domains simultaneously.

Electric Power Steering (EPS) Support MCUAdvanced Driver Assistance System (ADAS) Sensor Hub

Use Scenario: Secondary safety-monitoring MCU validating torque commands and motor position feedback in EPS systems.

IC Role / Device Role / Timing Role: Independent safety checker running parallel to primary controller, comparing results via shared memory and lockstep signals.

Use Value: SSC detects CPU divergence within <5 µs and triggers safe shutdown; redundant ADC channels enable cross-checked analog sensing.

Use Scenario: Pre-processing and fusion of radar, camera, and ultrasonic sensor data before transmission to central ADAS domain controller.

IC Role / Device Role / Timing Role: Real-time signal conditioner and protocol translator with low-latency interrupt handling for time-critical sensor interrupts.

Use Value: 12-bit ADC with 48 channels and 1 µs conversion supports simultaneous sampling of multiple analog sensors; hardware CRC accelerators offload checksum computation from main CPU.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R7F701274EABG-C#BC6Same RH850/C1M-A1 die but with 1.5 MB code flash and 192 KB RAM; identical pinout and peripheral setSuitable for cost-optimized BCM designs with reduced firmware footprint and fewer runtime tasksSelect when flash/RAM headroom is sufficient and BOM cost reduction is prioritized over future scalability
R7F701276EABG-C#BC6Same package and pinout; adds 1 MB additional code flash (3 MB total) and 32 KB extra RAM; same safety/security featuresTargeted at next-gen gateway ECUs requiring larger secure boot partitions and multi-OS support (e.g., AUTOSAR Classic + Adaptive)Choose when future-proofing for complex middleware stacks or dual-application partitioning is required

Compared with R7F701274EABG-C#BC6 and R7F701276EABG-C#BC6, the R7F701275EABG-C#BC6 provides balanced memory resources (2 MB flash / 256 KB RAM) ideal for production-ready ASIL-D body/gateway applications without over-provisioning or under-specifying.

Availability

R7F701275EABG-C#BC6 is available at Aetrix Electronics and suitable for automotive body control modules, gateway ECUs, and EPS support systems requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 Grade 1 qualification.

Supply support for R7F701275EABG-C#BC6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RH850/C1M-A1 product line delivers high-reliability 32-bit MCUs designed specifically for ASIL-D automotive applications including body electronics, chassis, and domain controllers-emphasizing functional safety, security, and real-time determinism.

FAQ

What is the maximum operating frequency of the R7F701275EABG-C#BC6?

The R7F701275EABG-C#BC6 operates at a maximum CPU frequency of 400 MHz, achieved via its on-chip PLL using an external 1–20 MHz crystal or clock source. This frequency is sustained across the full AEC-Q100 Grade 1 temperature range (−40°C to +125°C) with appropriate power supply regulation and thermal design. The R7F701275EABG-C#BC6 maintains timing closure and functional correctness at this speed under worst-case voltage and temperature conditions as verified by Renesas silicon characterization.

Does the R7F701275EABG-C#BC6 support ISO 26262 ASIL-D compliance out of the box?

Yes, the R7F701275EABG-C#BC6 is architected for ASIL-D compliance per ISO 26262:2018 Part 2–6. It includes dual-core lockstep execution, ECC on all on-chip memories, a dedicated Safety Support Core (SSC), built-in self-test (BIST), and hardware memory protection. Renesas provides certified safety manuals, FMEDA reports, and diagnostic software libraries to support integration into ASIL-D systems. The R7F701275EABG-C#BC6 itself is not "certified" - certification occurs at the system level, but the device provides all required hardware mechanisms.

What Ethernet standard does the R7F701275EABG-C#BC6 implement?

The R7F701275EABG-C#BC6 implements IEEE 802.3bw (100BASE-T1) Automotive Ethernet with AVB (Audio Video Bridging) extensions, including hardware timestamping, traffic shaping, and SRP (Stream Reservation Protocol) acceleration. It supports full-duplex 100 Mbps operation over single-pair unshielded twisted pair (UTP), meeting ISO 10605 and ISO 11452-4 EMI immunity requirements for automotive use. The R7F701275EABG-C#BC6 does not support 1000BASE-T1 or TSN time-aware shapers beyond AVB baseline.

How many CAN FD interfaces does the R7F701275EABG-C#BC6 include?

The R7F701275EABG-C#BC6 integrates two independent CAN FD controllers compliant with ISO 11898-1:2015, each supporting data rates up to 5 Mbps in FD mode and classic CAN up to 1 Mbps. Both controllers feature message RAM with configurable TX/RX buffers, hardware acceptance filtering, and loopback self-test modes. These interfaces are electrically isolated from the MCU core via dedicated bus bridges and support concurrent operation without CPU intervention using DMA-assisted transfers.

Is the R7F701275EABG-C#BC6 pin-compatible with other RH850/C1M-A1 variants?

Yes, the R7F701275EABG-C#BC6 is fully pin-compatible with all members of the RH850/C1M-A1 family in the 176-pin LQFP package (e.g., R7F701274EABG-C#BC6, R7F701276EABG-C#BC6), sharing identical mechanical dimensions, pin count, pitch, and signal assignment per Renesas Hardware User's Manual Rev.1.20. This allows direct PCB reuse across memory-variant SKUs, simplifying platform scaling and reducing NRE costs. The R7F701275EABG-C#BC6 retains full electrical compatibility including drive strength, voltage thresholds, and timing parameters.

R7F701275EABG-C#BC6 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
252-FBGA
Series:
RH850/C1M-Ax
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
RH850G3MH
Core Size:
32-Bit Dual-Core
Speed:
320MHz
Connectivity:
CANbus, CSI, LINbus, SCI
Peripherals:
DMA, PWM, WDT
Number of I/O:
99
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
320K x 8
Voltage - Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 48x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R7F701275EABG-C#BC6 FAQ

1.How can I place an order for R7F701275EABG-C#BC6 through Aetrix?

Please submit a Request for Quotation (RFQ) for R7F701275EABG-C#BC6 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R7F701275EABG-C#BC6 reliable?

The price and inventory of R7F701275EABG-C#BC6 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7F701275EABG-C#BC6 is usually 5 days.

3.What payment methods are accepted for R7F701275EABG-C#BC6?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7F701275EABG-C#BC6 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R7F701275EABG-C#BC6?

R7F701275EABG-C#BC6 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R7F701275EABG-C#BC6 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R7F701275EABG-C#BC6?

For technical support, including R7F701275EABG-C#BC6 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7F701275EABG-C#BC6 requirements.

6.How does Aetrix verify that R7F701275EABG-C#BC6 is sourced from the original manufacturer or authorized distributors?

All R7F701275EABG-C#BC6 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7F701275EABG-C#BC6 meets industry standards.

7.What is the process for return or replacement of R7F701275EABG-C#BC6?

All R7F701275EABG-C#BC6 units undergo pre-shipment inspection (PSI). If there is an issue with R7F701275EABG-C#BC6, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R7F701275EABG-C#BC6 part is unused and in its original packaging.

Return procedure for R7F701275EABG-C#BC6:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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