My Inquiry
My Account
Renesas R7F701376EAFP-C#BA2
- Part No.:
- R7F701376EAFP-C#BA2
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
R7F701376EAFP-C#BA2.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:710
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R7F701376EAFP-C#BA2 from Renesas Electronics is a 32-bit RH850/P1M-E Group automotive microcontroller featuring a dual-core lockstep CPU, 2 MB on-chip flash memory, 256 KB RAM, and integrated ASIL-B compliant safety mechanisms including PE Guard (PEG), Internal Peripheral Protection (IPG), and System Error Notification Control (SEG). It supports CAN FD, LIN, SENT, and PSI5 interfaces and is qualified for automotive powertrain and chassis control applications.
For engineers reviewing the R7F701376EAFP-C#BA2 datasheet, R7F701376EAFP-C#BA2 pinout, R7F701376EAFP-C#BA2 application, or R7F701376EAFP-C#BA2 equivalent, key selection criteria include dual-core lockstep execution integrity, ASIL-B hardware safety features, 2 MB flash with ECC, CAN FD data rate support up to 5 Mbps, and 176-pin LQFP package with automotive-grade temperature range (–40°C to +125°C).
Technical Context
The R7F701376EAFP-C#BA2 implements two tightly coupled RH850 G3M cores operating in lockstep mode with real-time comparison logic to detect transient faults. Its memory subsystem includes 2 MB of code flash with single-bit error correction and double-bit error detection (SEC-DED), plus 256 KB of SRAM with parity protection.
Peripheral integration includes 4x CAN FD controllers (ISO 11898-1:2015 compliant), 2x LIN controllers, 8x SENT receivers, 4x PSI5 receivers, and a configurable digital noise filter supporting six filter types (A–F) for robust signal acquisition in noisy automotive environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual RH850 G3M cores in lockstep configuration for ASIL-B compliance per ISO 26262. |
| Flash Memory | 2 MB on-chip code flash with SEC-DED ECC, enabling safe storage of critical firmware and calibration data. |
| RAM | 256 KB SRAM with parity checking, supporting real-time safety-critical task execution and data buffering. |
| Operating Temp | –40°C to +125°C ambient, qualified for under-hood automotive applications including engine control and transmission systems. |
| Package | 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch), RoHS-compliant and AEC-Q100 Grade 2 qualified. |
| CAN FD Support | 4 independent CAN FD controllers supporting up to 5 Mbps data phase, enabling high-bandwidth diagnostics and ECU communication. |
| Safety Features | PE Guard (PEG), IPG, SEG, and checker core - all implemented in hardware to meet ASIL-B requirements without software overhead. |
Pinout & Package
176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch), thermally enhanced with exposed thermal pad. Pin assignment follows Renesas RH850/P1M-E standard layout with dedicated power/ground pairs, differential signal routing for CAN FD, and grouped analog input channels for SENT/PSI5.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Power supply and ground | Dedicated pairs per functional domain (core, I/O, analog) minimize noise coupling and ensure stable operation across voltage domains. |
| CLKIN, CLKOUT | External clock input/output | Supports crystal oscillator (1–20 MHz) or external clock source; CLKOUT enables clock distribution to companion ICs. |
| CAN0_TX, CAN0_RX | CAN FD differential interface | High-speed transceiver pins with internal termination control and slew-rate adjustment for EMC compliance. |
| SENT0_IN, SENT1_IN | SENT protocol input | Configurable digital input pins with built-in digital noise filters (Type D) for accurate pulse-width decoding in engine sensor interfaces. |
| PSI5_0, PSI5_1 | PSI5 bus receiver inputs | Differential inputs supporting 125 kbps–1.25 Mbps PSI5 v2.1, with automatic frame synchronization and CRC validation. |
| RESET | Active-low reset input | Asynchronous reset with internal pull-up; accepts external watchdog or system controller assertion for fail-safe recovery. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep execution | Hardware-level fault detection via real-time instruction and result comparison between two identical cores, eliminating need for software-based redundancy checks. |
| ASIL-B safety mechanisms | Integrated PEG, IPG, and SEG modules provide end-to-end hardware safety coverage for CPU, memory, and peripherals without runtime software intervention. |
| Multi-protocol timing interface | Simultaneous support for CAN FD (5 Mbps), LIN (20 kbps), SENT (1–125 kbps), and PSI5 (125 kbps–1.25 Mbps) enables consolidated sensor/actuator communication in modern ECUs. |
| Configurable digital noise filtering | Six programmable filter types (A–F) with adjustable sampling clocks allow precise tuning for different signal sources (e.g., INTP, SENT, PSI5) to suppress EMI in harsh automotive environments. |
| Secure boot and flash protection | Hardware-enforced secure boot sequence with flash lock bits and region write-protection prevents unauthorized firmware modification or cloning. |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
Use Scenario: Real-time processing of crankshaft/camshaft position signals, fuel injection timing, and knock detection using SENT and PSI5 sensors. IC Role / Device Role / Timing Role: Primary safety-certified controller executing ASIL-B algorithms with lockstep CPU verification and flash ECC for firmware integrity. Use Value: Enables deterministic sub-microsecond response to combustion events while maintaining ISO 26262 compliance through hardware safety mechanisms. | Use Scenario: Closed-loop control of torque converter clutch, shift solenoids, and hydraulic pressure using CAN FD communication with engine and chassis ECUs. IC Role / Device Role / Timing Role: High-integrity motion controller managing synchronized actuation sequences with dual-core fault detection and time-triggered scheduling. Use Value: Guarantees fail-operational behavior during transient faults via lockstep mismatch detection and automatic safe-state entry within <10 µs. |
| Electric Power Steering (EPS) | Brake Control Unit (BCU) |
Use Scenario: Sensor fusion of torque, motor position, and vehicle speed signals with real-time motor current control via PWM outputs. IC Role / Device Role / Timing Role: Safety-critical actuator controller implementing ASIL-C decomposition with R7F701376EAFP-C#BA2 as ASIL-B host and external monitor. Use Value: Delivers <100 ns jitter on PWM generation and supports SENT-based torque sensor feedback with integrated digital filtering for noise immunity. | Use Scenario: Coordinating ABS, EBD, and ESC functions using multi-channel CAN FD messaging and real-time wheel speed processing from magnetic sensors. IC Role / Device Role / Timing Role: Central brake domain controller with hardware safety monitoring, redundant flash memory, and deterministic interrupt latency (<200 ns). Use Value: Achieves <5 ms end-to-end control loop timing with guaranteed worst-case execution time (WCET) analysis support via built-in performance counters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F701386EAFP-C#BA2 | Same RH850/P1M-E platform with 4 MB flash, 384 KB RAM, and identical pinout; higher memory density for complex AUTOSAR stacks. | Preferred for ECUs requiring >2 MB application code + OTA update partitioning; same safety architecture and peripheral set. | Select when firmware footprint exceeds 2 MB or dual-bank flash update capability is required. |
| SPC574S54E3 | STMicroelectronics SPC574S series; dual Power Architecture e200z4 cores, 2 MB flash, ASIL-D capable, but lacks native SENT/PSI5 support. | Requires external interface ICs for SENT/PSI5 sensor connectivity; broader toolchain support for legacy AUTOSAR projects. | Choose when ASIL-D certification is mandatory and SENT/PSI5 are not primary sensor interfaces. |
Compared with R7F701376EAFP-C#BA2, the R7F701386EAFP-C#BA2 offers scalable memory without changing PCB layout, while the SPC574S54E3 provides higher ASIL level at the cost of added BOM complexity for sensor interfacing.
Availability
R7F701376EAFP-C#BA2 is available at Aetrix Electronics and suitable for automotive powertrain control, electric power steering, and brake control systems requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 Grade 2 qualification.
Supply support for R7F701376EAFP-C#BA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for automotive, industrial, and IoT markets.
The RH850 Family targets high-reliability automotive applications, with the P1M-E Group specifically engineered for ASIL-B/C powertrain and chassis control where functional safety, real-time determinism, and multi-sensor interface integration are critical.
FAQ
What is the maximum CAN FD data rate supported by the R7F701376EAFP-C#BA2?
The R7F701376EAFP-C#BA2 supports CAN FD with a data phase rate up to 5 Mbps, compliant with ISO 11898-1:2015. This capability is implemented in all four integrated CAN FD controllers and enables high-throughput diagnostics, firmware updates, and inter-ECU communication in modern automotive networks. The R7F701376EAFP-C#BA2 achieves this with hardware bit-timing configuration and built-in transceiver drivers optimized for low-jitter signaling.
Does the R7F701376EAFP-C#BA2 include hardware safety features for ISO 26262 compliance?
Yes, the R7F701376EAFP-C#BA2 integrates multiple hardware safety mechanisms required for ASIL-B compliance per ISO 26262, including PE Guard (PEG) for core-level fault detection, Internal Peripheral Protection (IPG) for peripheral access monitoring, and System Error Notification Control (SEG) for centralized error handling. These features operate independently of software and are validated in Renesas' safety manual for the RH850/P1M-E Group. The R7F701376EAFP-C#BA2 also includes SEC-DED ECC on flash and parity on SRAM to protect memory integrity.
What sensor interface protocols does the R7F701376EAFP-C#BA2 natively support?
The R7F701376EAFP-C#BA2 natively supports SENT (Single Edge Nibble Transmission), PSI5 (Peripheral Sensor Interface 5), CAN FD, and LIN without external components. It includes eight dedicated SENT receivers with configurable digital noise filters (Type D), four PSI5 receivers supporting v2.1 at rates up to 1.25 Mbps, four CAN FD controllers, and two LIN controllers. These interfaces are mapped to specific pins with optimized electrical characteristics for automotive sensor environments. The R7F701376EAFP-C#BA2 uses these protocols to directly acquire signals from crankshaft position sensors, knock sensors, and pressure transducers.
What is the operating temperature range and package type of the R7F701376EAFP-C#BA2?
The R7F701376EAFP-C#BA2 is packaged in a 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch) with an exposed thermal pad and is rated for operation from –40°C to +125°C ambient temperature. It is AEC-Q100 Grade 2 qualified and designed for under-hood automotive applications such as engine control units and transmission control modules. The R7F701376EAFP-C#BA2's package supports automated optical inspection and reflow soldering per J-STD-020, with thermal resistance (θJA) of 32°C/W typical.
How much on-chip flash and RAM does the R7F701376EAFP-C#BA2 provide?
The R7F701376EAFP-C#BA2 integrates 2 MB of on-chip code flash memory with SEC-DED ECC and 256 KB of SRAM with parity protection. The flash supports background programming, read-while-write operation, and secure boot authentication. The RAM is partitioned into multiple banks with independent error detection and can be configured for TCM (Tightly Coupled Memory) usage to reduce latency for safety-critical routines. Both memory blocks are accessible by the dual-core CPU and DMA engines in the R7F701376EAFP-C#BA2.
R7F701376EAFP-C#BA2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-LQFP
- Series:
- RH850/P1M-E
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- G3M
- Core Size:
- 32-Bit
- Speed:
- 160MHz
- Connectivity:
- CANbus, CSI, FlexRay, LINbus, PSI5, UART/USART
- Peripherals:
- DMA, Temp Sensor, WDT
- Number of I/O:
- 50
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7F701376EAFP-C#BA2 FAQ
1.How can I place an order for R7F701376EAFP-C#BA2 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7F701376EAFP-C#BA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7F701376EAFP-C#BA2 reliable?
The price and inventory of R7F701376EAFP-C#BA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7F701376EAFP-C#BA2 is usually 5 days.
3.What payment methods are accepted for R7F701376EAFP-C#BA2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7F701376EAFP-C#BA2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7F701376EAFP-C#BA2?
R7F701376EAFP-C#BA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7F701376EAFP-C#BA2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7F701376EAFP-C#BA2?
For technical support, including R7F701376EAFP-C#BA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7F701376EAFP-C#BA2 requirements.
6.How does Aetrix verify that R7F701376EAFP-C#BA2 is sourced from the original manufacturer or authorized distributors?
All R7F701376EAFP-C#BA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7F701376EAFP-C#BA2 meets industry standards.
7.What is the process for return or replacement of R7F701376EAFP-C#BA2?
All R7F701376EAFP-C#BA2 units undergo pre-shipment inspection (PSI). If there is an issue with R7F701376EAFP-C#BA2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7F701376EAFP-C#BA2 part is unused and in its original packaging.
Return procedure for R7F701376EAFP-C#BA2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7F701376EAFP-C#BA2 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
