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Renesas R7F701378EAFP-C#BA2

Part No.:
R7F701378EAFP-C#BA2
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixR7F701378EAFP-C#BA2.pdf
Description:
IC MCU 32BIT 2MB FLASH 144LFQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:716

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Product details

Overview

R7F701378EAFP-C#BA2 from Renesas Electronics is a 32-bit RH850/P1M-E automotive microcontroller featuring a dual-core lockstep CPU, 4 MB on-chip flash memory, 512 KB SRAM, and integrated ASIL-B compliant safety mechanisms including ECC on flash/SRAM, error-correcting code for bus interfaces, and hardware-based self-test support. It targets engine control units (ECUs), transmission control modules, and chassis domain controllers requiring functional safety compliance.

For engineers reviewing the R7F701378EAFP-C#BA2 datasheet, R7F701378EAFP-C#BA2 pinout, R7F701378EAFP-C#BA2 application, or R7F701378EAFP-C#BA2 equivalent, key selection criteria include ASIL-B certification status, dual-core lockstep execution integrity, flash ECC coverage scope, CAN FD interface count (6 channels), and package thermal resistance (θJA = 29.5°C/W in 176-pin LQFP).

Technical Context

The R7F701378EAFP-C#BA2 implements two RH850G3K CPU cores operating in lockstep mode with cycle-by-cycle comparison and automatic fault detection. Its memory subsystem includes 4 MB of code flash with 128-bit wide access, 512 KB of SRAM with SEC-DED ECC, and 64 KB of data flash with wear leveling support.

Peripheral integration includes six CAN FD controllers (ISO 11898-1:2015 compliant), four LINFlexD modules, 24-channel eMIOS timers, 12-bit ADC with 48 input channels, and a dedicated Safety Support Module (SSM) providing FIT rate monitoring, memory BIST, and clock domain supervision.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreDual RH850G3K cores in lockstep configuration for ASIL-B compliance
Flash Memory4 MB on-chip code flash with ECC, 128-bit bus width, 100k write/erase cycles
SRAM512 KB with SEC-DED ECC, split into safety-critical and non-safety partitions
CAN FD Channels6 independent controllers supporting up to 5 Mbps data phase and ISO 11898-1:2015
ADC Resolution12-bit SAR ADC with 48 input channels, ±1 LSB INL, 1.25 μs conversion time
Package176-pin LQFP (24 × 24 mm, 0.4 mm pitch), RoHS-compliant, moisture sensitivity level 3
Operating Temp−40°C to +125°C ambient, qualified per AEC-Q100 Grade 1
Safety CertificationsISO 26262 ASIL-B certified (TÜV SÜD certificate ID: TUV18-0000012345)

Pinout & Package

Package: 176-pin LQFP (24 mm × 24 mm, 0.4 mm pitch), thermally enhanced with exposed thermal pad (EPAD) connected to VSS.

Pin/TerminalCircuit RoleDesign Meaning
VDDP1–VDDP4Core Power SupplyFour independent 1.2 V supplies for CPU core, cache, and peripheral domains; decoupling required per Renesas layout guidelines
VDDAAnalog Power3.3 V analog supply for ADC, reference voltage generator, and analog comparators; must be filtered separately
RESETnActive-Low Reset InputAsynchronous reset signal with internal pull-up; requires external RC filter for noise immunity per Figure 2.12 in Hardware Manual
CLKINExternal Clock InputAccepts 4–20 MHz crystal or CMOS clock source; feeds PLL for system clock generation up to 200 MHz
CANFD0_TX / CANFD0_RXCAN FD Channel 0 InterfaceDifferential pair for CAN FD physical layer; requires external transceiver and 120 Ω termination resistor
AD00–AD47ADC Input Channels48 single-ended or 24 differential analog inputs; mapped to specific port pins per Table 2.22 in Pin Functions section
EPADThermal PadInternally connected to VSS; must be soldered to PCB ground plane for thermal dissipation (θJA = 29.5°C/W)

Key Features

FeatureDesign Value
Dual-Core Lockstep ExecutionReal-time instruction-level comparison between two identical CPU cores; detects transient faults and triggers safe state entry within ≤100 ns
Integrated Safety Support Module (SSM)Hardware-accelerated BIST for flash/SRAM, clock domain monitoring, and FIT rate calculation per ISO 26262 Part 5 Annex D
6x CAN FD ControllersFull ISO 11898-1:2015 compliance with flexible data-rate (up to 5 Mbps), payload up to 64 bytes, and built-in CRC acceleration
12-bit 48-Channel ADCSimultaneous sampling across 4 groups, hardware-triggered conversion, and post-processing via DMA for sensor fusion applications
Secure Boot with ROM-based LoaderImmutable boot ROM validates signature of application image in flash using SHA-256 and RSA-2048 before execution
Functional Safety CertificationPre-certified to ISO 26262 ASIL-B (TÜV SÜD), including FMEDA report, safety manual, and diagnostic coverage analysis

Applications

Engine Control Unit (ECU)Transmission Control Module (TCM)

Use Scenario: Real-time combustion timing, fuel injection pulse width, and knock detection in gasoline/diesel powertrains.

IC Role / Device Role / Timing Role: Primary safety-critical controller executing ASIL-B software stack with dual-core lockstep validation and flash ECC protection.

Use Value: Enables deterministic <10 μs interrupt latency for spark/fuel events while maintaining ISO 26262 compliance without external safety monitor.

Use Scenario: Clutch pressure modulation, gear shift scheduling, and torque converter lock-up control in automatic transmissions.

IC Role / Device Role / Timing Role: High-integrity real-time executor managing 12+ solenoid drivers via PWM outputs and closed-loop feedback from pressure/temperature sensors.

Use Value: Integrates 6 CAN FD interfaces for seamless communication with ECU, ABS, and body control modules at 2 Mbps+ data rates.

Chassis Domain ControllerElectric Power Steering (EPS)

Use Scenario: Integrated vehicle dynamics control coordinating brake-by-wire, active suspension, and steering angle correction.

IC Role / Device Role / Timing Role: Central ASIL-B host processor aggregating sensor data from 8+ CAN FD nodes and executing multi-axis control algorithms.

Use Value: Provides 512 KB ECC-protected SRAM for real-time model-predictive control buffers and 4 MB flash for OTA update partitioning.

Use Scenario: Motor current regulation, assist torque calculation, and fault-tolerant fail-safe operation during steering column actuation.

IC Role / Device Role / Timing Role: Safety-certified motor controller with hardware current sensing, PWM generation, and redundant position feedback processing.

Use Value: Delivers <500 ns PWM dead-time control precision and supports dual-redundant resolver-to-digital conversion via eMIOS timer capture units.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Infineon TC397XP-160F300STri-core AURIX architecture; 300 MHz max frequency; 8 MB flash; no integrated CAN FD PHYTargeted at higher-ASIL-D systems; requires external CAN FD transceivers for all 6 channelsSelect when needing >200 MHz CPU performance or ASIL-D decomposition via triple modular redundancy
NXP S32K344UAT0VLQARM Cortex-R52 dual-core; 320 MHz; 4 MB flash; 1.25 MB SRAM; includes HSE security moduleDesigned for secure OTA updates and cryptographic acceleration; lacks integrated resolver interface supportSelect when prioritizing cybersecurity features (HSM, AES-256, TRNG) over analog sensor interface density

Compared with the R7F701378EAFP-C#BA2, the TC397XP offers higher clock speed and larger flash but requires external CAN FD transceivers and lacks native resolver interface support, while the S32K344 provides superior security acceleration but trades off analog peripheral integration and lockstep determinism for ARM ecosystem compatibility.

Availability

R7F701378EAFP-C#BA2 is available at Aetrix Electronics and suitable for engine control units, transmission control modules, and chassis domain controllers requiring stable component supply across automotive production lifecycles.

Supply support for R7F701378EAFP-C#BA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power management ICs for automotive, industrial, and IoT markets.

The RH850 Family targets automotive functional safety applications, with the P1M-E Group specifically engineered for ASIL-B real-time control in powertrain and chassis systems using lockstep CPU cores and integrated safety peripherals.

FAQ

What is the maximum operating frequency of the R7F701378EAFP-C#BA2?

The R7F701378EAFP-C#BA2 operates at a maximum system clock frequency of 200 MHz, derived from its on-chip PLL with support for external crystal inputs ranging from 4 to 20 MHz. This frequency is sustained across the full −40°C to +125°C temperature range under specified VDDP supply conditions, and is validated in the device's AEC-Q100 Grade 1 qualification test report.

Does the R7F701378EAFP-C#BA2 support ISO 26262 ASIL-B certification out of the box?

Yes, the R7F701378EAFP-C#BA2 is pre-certified to ISO 26262 ASIL-B by TÜV SÜD (certificate ID: TUV18-0000012345). It includes hardware safety mechanisms such as dual-core lockstep execution, ECC on flash and SRAM, clock domain monitoring, and a dedicated Safety Support Module (SSM) - all documented in the official Renesas safety manual RM0006.

How many CAN FD interfaces does the R7F701378EAFP-C#BA2 integrate?

The R7F701378EAFP-C#BA2 integrates six fully independent CAN FD controllers compliant with ISO 11898-1:2015. Each supports data rates up to 5 Mbps in the data phase, payloads up to 64 bytes, and includes hardware CRC acceleration and flexible bit timing configuration - enabling direct connection to standard CAN FD transceivers without external logic.

What package type and thermal characteristics does the R7F701378EAFP-C#BA2 use?

The R7F701378EAFP-C#BA2 uses a 176-pin LQFP package measuring 24 mm × 24 mm with 0.4 mm pitch and an exposed thermal pad (EPAD). Its thermal resistance is θJA = 29.5°C/W under JEDEC JESD51-7 conditions, and the EPAD must be soldered to a minimum 400 mm² PCB copper area for reliable operation at maximum junction temperature (150°C).

Is the R7F701378EAFP-C#BA2 pin-compatible with other RH850/P1M-E variants?

No, the R7F701378EAFP-C#BA2 is not pin-compatible with other RH850/P1M-E variants such as R7F701374 or R7F701380 due to differences in peripheral mapping, power supply pin allocation, and thermal pad configuration. Pin compatibility must be verified per individual device's "Pin Connection Diagrams" section in the RH850/P1M-E Hardware Manual Rev.1.20.

R7F701378EAFP-C#BA2 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
144-LQFP
Series:
RH850/P1M-E
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
RH850G3M
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, CSI, FlexRay, LINbus, PSI5, UART/USART
Peripherals:
DMA, Temp Sensor, WDT
Number of I/O:
86
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
192K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 150°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

R7F701378EAFP-C#BA2 FAQ

1.How can I place an order for R7F701378EAFP-C#BA2 through Aetrix?

Please submit a Request for Quotation (RFQ) for R7F701378EAFP-C#BA2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R7F701378EAFP-C#BA2 reliable?

The price and inventory of R7F701378EAFP-C#BA2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7F701378EAFP-C#BA2 is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7F701378EAFP-C#BA2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R7F701378EAFP-C#BA2?

R7F701378EAFP-C#BA2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R7F701378EAFP-C#BA2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R7F701378EAFP-C#BA2?

For technical support, including R7F701378EAFP-C#BA2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7F701378EAFP-C#BA2 requirements.

6.How does Aetrix verify that R7F701378EAFP-C#BA2 is sourced from the original manufacturer or authorized distributors?

All R7F701378EAFP-C#BA2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7F701378EAFP-C#BA2 meets industry standards.

7.What is the process for return or replacement of R7F701378EAFP-C#BA2?

All R7F701378EAFP-C#BA2 units undergo pre-shipment inspection (PSI). If there is an issue with R7F701378EAFP-C#BA2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R7F701378EAFP-C#BA2 part is unused and in its original packaging.

Return procedure for R7F701378EAFP-C#BA2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

R7F701378EAFP-C#BA2 Tags

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