Renesas R7F701385EAFP-C#BA2

Overview

R7F701385EAFP-C#BA2 from Renesas Electronics is a 32-bit RH850/P1M-E automotive microcontroller featuring dual-core lockstep CPU architecture, 4 MB on-chip flash memory, and integrated ASIL-B compliant safety mechanisms including PE Guard (PEG), Internal Peripheral Guard (IPG), and System Error Notification Control (SEG). It supports CAN FD, LIN, SENT, and PSI5 interfaces and is qualified for automotive powertrain and chassis control applications.

For engineers reviewing the R7F701385EAFP-C#BA2 datasheet, R7F701385EAFP-C#BA2 pinout, R7F701385EAFP-C#BA2 application, or R7F701385EAFP-C#BA2 equivalent, key selection criteria include ASIL-B functional safety certification, dual-core lockstep execution, 4 MB flash with ECC, 256 KB SRAM with parity, and automotive-grade temperature range (–40°C to +125°C).

Technical Context

The R7F701385EAFP-C#BA2 implements two tightly coupled RH850 G3M cores operating in lockstep mode with real-time comparison logic to detect transient faults. It integrates a 12-bit ADC with 48 channels, 64-channel PWM with dead-time control, and multiple communication peripherals including three CAN FD controllers with ISO 11898-1 compliance and one SENT interface supporting both transmitter and receiver modes.

Hardware safety features include memory protection units (MPUs) for flash and SRAM, clock failure detection with fail-safe clock switching, and dedicated error-correcting code (ECC) for flash and parity checking for SRAM. The device uses a 200 MHz core clock derived from an on-chip PLL with external crystal support (4–20 MHz).

Key Specifications

Pinout & Package

Package: 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level (MSL) 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Compared with R7F701385EAFP-C#BA2, the R7F701384EAFP-C#BA2 offers reduced memory and peripheral count for simpler powertrain modules, while the R7F701393EAFP-C#BA2 extends connectivity for zonal architectures-neither is pin-compatible, and PCB redesign is required for substitution.

Availability

R7F701385EAFP-C#BA2 is available at Aetrix Electronics and suitable for automotive ECU development, electric power steering systems, and brake-by-wire control modules requiring stable component supply across extended production lifecycles.

Supply support for R7F701385EAFP-C#BA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor manufacturer headquartered in Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RH850/P1M-E group is designed specifically for high-reliability automotive powertrain and chassis control applications, emphasizing functional safety, real-time determinism, and robustness in harsh environments.

FAQ

What safety certifications apply to the R7F701385EAFP-C#BA2?

The R7F701385EAFP-C#BA2 is designed to support ISO 26262 ASIL-B compliance at the system level. It includes hardware safety features such as dual-core lockstep execution, memory protection units, ECC for flash, parity for SRAM, and clock failure detection. Renesas provides safety manuals and FMEDA reports for R7F701385EAFP-C#BA2 to assist in functional safety analysis and certification of end applications.

Does the R7F701385EAFP-C#BA2 support CAN FD with ISO 11898-1 physical layer compliance?

Yes, the R7F701385EAFP-C#BA2 integrates three CAN FD controllers fully compliant with ISO 11898-1:2015, supporting data rates up to 5 Mbps in FD mode and standard CAN up to 1 Mbps. Each controller includes dedicated message RAM, flexible filtering, and built-in bit-rate switching logic-no external transceivers are required for protocol handling, though external PHYs remain necessary for physical layer signaling.

What is the maximum operating frequency and clock architecture of the R7F701385EAFP-C#BA2?

The R7F701385EAFP-C#BA2 operates at a maximum core frequency of 200 MHz. Its clock system includes an on-chip PLL with programmable multiplication/division ratios, supporting external crystal inputs from 4 MHz to 20 MHz. The device also provides multiple clock domains for CPU, peripherals, and ADC, each independently configurable via dedicated clock control registers in the R7F701385EAFP-C#BA2 hardware manual.

Can the R7F701385EAFP-C#BA2 directly interface with SENT sensors?

Yes, the R7F701385EAFP-C#BA2 includes a dedicated SENT interface supporting both transmitter and receiver modes per SAE J2716 rev 3.0. It handles pulse-width modulation decoding, CRC validation, and message framing in hardware-eliminating software overhead. The SENT peripheral is mapped to specific pins (e.g., SENT0_TX/SENT0_RX) and supports configurable resolution (8–16 bits) and frame lengths, as documented in the R7F701385EAFP-C#BA2 user's manual.

What package and pin count does the R7F701385EAFP-C#BA2 use?

The R7F701385EAFP-C#BA2 is housed in a 176-pin LQFP package (24 mm × 24 mm, 0.5 mm pitch) with exposed thermal pad. This package supports automotive-grade thermal dissipation and mechanical reliability. Pin functions-including power, reset, clock, CAN FD, SENT, ADC, and PWM-are fully defined in Section 2 of the RH850/P1M-E User's Manual (Rev.1.20), and the R7F701385EAFP-C#BA2 pinout is electrically and mechanically identical across all variants in the P1M-E series with this package option.