Renesas R7F701386EAFP-C#BA2

Overview

R7F701386EAFP-C#BA2 from Renesas Electronics is a 32-bit RH850/P1M-E automotive microcontroller featuring a dual-core lockstep CPU, 4 MB on-chip flash memory, 512 KB SRAM, and integrated ASIL-B compliant safety mechanisms including ECC for memory, error detection logic, and lockstep monitoring. It supports CAN FD, LIN, SENT, and PSI5 interfaces and targets engine control units (ECUs) requiring functional safety compliance.

For engineers reviewing the R7F701386EAFP-C#BA2 datasheet, R7F701386EAFP-C#BA2 pinout, R7F701386EAFP-C#BA2 application, or R7F701386EAFP-C#BA2 equivalent, key selection criteria include ASIL-B hardware safety certification, dual-core lockstep execution integrity, flash ECC coverage, real-time interrupt latency under 100 ns, and automotive-grade temperature range (–40°C to +125°C).

Technical Context

The R7F701386EAFP-C#BA2 implements a dual-core RH850 G3M CPU in lockstep configuration with cycle-by-cycle comparison and automatic fault containment. It integrates a 4-channel DMAC with scatter-gather support, 12-bit ADC with 32-channel multiplexing and conversion time ≤1.1 μs, and a 32-bit multi-function timer (MTU3) supporting PWM generation with dead-time insertion and complementary output.

Safety architecture includes a dedicated Safety Support Core (SSC), memory built-in self-test (MBIST), peripheral gate test (PGT), and configurable error injection for ISO 26262 FMEDA validation. The device operates from a single 5 V supply with internal voltage regulation and supports boot ROM-based secure firmware update via CAN FD.

Key Specifications

Pinout & Package

The R7F701386EAFP-C#BA2 is housed in a 256-pin LQFP package (24 mm × 24 mm, 0.5 mm pitch) with exposed thermal pad, designed for automotive PCB assembly and conduction cooling. Pin assignment follows Renesas' RH850/P1M-E standard layout with dedicated power/ground pairs, differential clock inputs, and function-mapped I/O banks aligned to peripheral clusters.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Compared with R7F701386EAFP-C#BA2, the R7F701384EAFP-C#BA2 offers identical safety architecture and pin compatibility at lower memory density, while the SPC574S54E3 provides comparable memory but requires additional software validation effort to meet ASIL-B requirements due to absence of hardware lockstep.

Availability

R7F701386EAFP-C#BA2 is available at Aetrix Electronics and suitable for engine control units, transmission control modules, electric power steering systems, and brake control units requiring stable component supply and long-term automotive lifecycle support.

Supply support for R7F701386EAFP-C#BA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for automotive, industrial, and IoT markets.

The RH850 family targets automotive functional safety applications, with the P1M-E group specifically engineered for ASIL-B/C powertrain and chassis control systems requiring hardware lockstep, memory ECC, and ISO 26262-compliant safety mechanisms.

FAQ

What is the maximum operating frequency of the R7F701386EAFP-C#BA2?

The R7F701386EAFP-C#BA2 operates at a maximum CPU frequency of 200 MHz with its dual RH850 G3M cores. This frequency is achieved using an internal PLL fed by an external 4–20 MHz crystal or clock source. The device maintains timing integrity under automotive temperature and voltage variations, with guaranteed performance across –40°C to +125°C and 4.5–5.5 V supply range. All peripheral clocks derive from this core clock with programmable dividers.

Does the R7F701386EAFP-C#BA2 support ISO 26262 ASIL-B certification out of the box?

Yes, the R7F701386EAFP-C#BA2 is designed to support ISO 26262 ASIL-B compliance through integrated hardware safety features including dual-core lockstep execution, flash and SRAM ECC, memory BIST, peripheral gate test, and a dedicated Safety Support Core. Renesas provides certified safety manuals, FMEDA reports, and diagnostic software libraries for R7F701386EAFP-C#BA2 to accelerate ASIL-B system certification - though final certification remains the responsibility of the end-system integrator.

What communication interfaces are integrated into the R7F701386EAFP-C#BA2?

The R7F701386EAFP-C#BA2 integrates four CAN FD controllers (supporting up to 5 Mbps), two LIN controllers, four SENT receivers, two PSI5 receivers, and optional FlexRay controller support. All interfaces feature hardware CRC generation/validation, configurable bit timing, and dedicated DMA channels. The CAN FD modules support both classic and FD frames with flexible data field lengths up to 64 bytes, enabling high-bandwidth ECU-to-ECU communication in modern vehicle networks.

How is functional safety implemented in the R7F701386EAFP-C#BA2's memory subsystem?

The R7F701386EAFP-C#BA2 implements functional safety in its memory subsystem via ECC protection across all 4 MB of on-chip flash and 512 KB of SRAM, with single-bit correction and double-bit detection. It also includes hardware memory BIST for periodic or on-demand testing, and lockstep address/data bus checking between CPU cores. Flash programming uses a protected boot ROM with secure signature verification, and SRAM initialization includes parity scrubbing during startup to detect latent faults before application execution begins.

What is the ADC performance specification for the R7F701386EAFP-C#BA2?

The R7F701386EAFP-C#BA2 features a 12-bit successive approximation register (SAR) ADC with 32 input channels, ±1 LSB integral nonlinearity, and a maximum conversion time of 1.1 μs. It supports simultaneous sampling across multiple channels, hardware-triggered conversions synchronized to PWM events, and configurable oversampling ratios up to 64× for enhanced resolution. The ADC operates across the full –40°C to +125°C temperature range with calibrated offset/gain compensation stored in on-chip flash.