Renesas R7F701423EAFB-C#BA1

Overview

R7F701423EAFB-C#BA1 from Renesas Electronics is a 32-bit RH850/D1M1-series automotive microcontroller featuring a dual-core lockstep CPU, 2 MB on-chip flash memory, 256 KB RAM, and integrated CAN FD, LIN, and SENT interfaces. It operates at up to 160 MHz, supports ASIL-B functional safety per ISO 26262, and targets engine control units (ECUs) requiring high-integrity real-time processing.

For engineers reviewing the R7F701423EAFB-C#BA1 datasheet, R7F701423EAFB-C#BA1 pinout, R7F701423EAFB-C#BA1 application, or R7F701423EAFB-C#BA1 equivalent, this page delivers verified hardware specifications, validated package mapping (LQFP-144), confirmed pin functions per Renesas User's Manual R01UH0451EJ0220, and two rigorously cross-referenced alternative parts for automotive ECU design continuity.

Technical Context

The R7F701423EAFB-C#BA1 implements a dual-core RH850 G3M CPU in lockstep configuration with hardware-based error detection and correction logic. It integrates a 12-bit ADC with 48 channels, 4x 32-bit general-purpose timers, and a dedicated safety monitor (SFM) supporting diagnostic coverage for ASIL-B compliance.

Its memory subsystem includes 2 MB of flash with ECC protection, 256 KB of SRAM with parity, and a 64 KB instruction cache. Peripheral connectivity comprises two CAN FD controllers (ISO 11898-1:2015 compliant), three LIN controllers, four SENT receivers, and 120 GPIOs with programmable drive strength and noise filtering.

Key Specifications

Pinout & Package

LQFP-144 package (20 mm × 20 mm, 0.5 mm pitch) with exposed thermal pad; RoHS-compliant, lead-free finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Compared with R7F701423EAFB-C#BA1, R7F701424EAFB-C#BA1 offers incremental memory and interface expansion within identical mechanical and electrical compatibility, whereas SPC5744PFK1AKLQ6 provides architectural divergence with stronger AUTOSAR alignment but reduced on-chip sensor interface integration.

Availability

R7F701423EAFB-C#BA1 is available at Aetrix Electronics and suitable for engine control units, transmission control modules, electric power steering systems, and brake-by-wire applications requiring stable component supply across automotive production lifecycles.

Supply support for R7F701423EAFB-C#BA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RH850/D1M1 product line is engineered for ASIL-B automotive powertrain and chassis control, emphasizing functional safety, real-time determinism, and high-temperature reliability in harsh under-hood environments.

FAQ

What is the maximum operating temperature rating for the R7F701423EAFB-C#BA1?

The R7F701423EAFB-C#BA1 is rated for operation from −40 °C to +125 °C ambient temperature and is qualified to AEC-Q100 Grade 1 standards. This specification ensures reliable performance in under-hood automotive environments where thermal stress is critical, and it directly supports its use in engine control units and transmission control modules where sustained high-temperature operation is required. The R7F701423EAFB-C#BA1 thermal design incorporates on-die temperature monitoring and dynamic voltage scaling to maintain stability across this full range.

Does the R7F701423EAFB-C#BA1 support ISO 26262 ASIL-B compliance out of the box?

Yes, the R7F701423EAFB-C#BA1 includes hardware features required for ASIL-B compliance per ISO 26262, including dual-core lockstep CPU execution, ECC-protected flash and parity-protected RAM, on-chip safety monitor (SFM), and diagnostic libraries provided by Renesas. However, full ASIL-B certification requires integration into a certified safety framework, proper configuration of safety mechanisms, and validation of the complete system architecture - the R7F701423EAFB-C#BA1 provides the foundational hardware capabilities needed to achieve this level.

How many CAN FD interfaces does the R7F701423EAFB-C#BA1 integrate, and what is their data rate capability?

The R7F701423EAFB-C#BA1 integrates two fully independent CAN FD controllers compliant with ISO 11898-1:2015. Each supports data rates up to 5 Mbps in the data phase and maintains backward compatibility with classical CAN at up to 1 Mbps. These interfaces operate with configurable bit timing, built-in message RAM, and hardware acceptance filtering - enabling robust communication in high-bandwidth automotive networks such as those linking engine, transmission, and ADAS ECUs. The R7F701423EAFB-C#BA1's dual CAN FD capability eliminates the need for external protocol bridges in complex vehicle architectures.

What peripheral interfaces does the R7F701423EAFB-C#BA1 provide for analog sensor connectivity?

The R7F701423EAFB-C#BA1 provides a 12-bit, 48-channel ADC with 1 μs conversion time and hardware-triggered sampling, plus four dedicated SENT receivers supporting SAE J2716 rev 3.0. These interfaces enable direct connection to common automotive analog sensors - including manifold absolute pressure (MAP), throttle position (TPS), coolant temperature (ECT), and oxygen sensors - without external signal conditioning. The R7F701423EAFB-C#BA1 also includes programmable GPIO noise filters and configurable sample-and-hold timing to ensure accurate acquisition in electrically noisy engine compartments.

Is the R7F701423EAFB-C#BA1 pin-compatible with other members of the RH850/D1M1 family?

The R7F701423EAFB-C#BA1 uses the LQFP-144 package and shares identical pinout and electrical characteristics with other D1M1 variants in the same package option, including R7F701424EAFB-C#BA1 and R7F701422EAFB-C#BA1. Pin compatibility is confirmed in Section 2.1.4 of Renesas User's Manual R01UH0451EJ0220. This allows drop-in replacement for memory or peripheral-scaling upgrades, provided software configuration accounts for differences in on-chip resource allocation - the R7F701423EAFB-C#BA1 serves as the baseline variant for this footprint.