My Inquiry
My Account
Renesas R7F701437EAFD-C#KA0
- Part No.:
- R7F701437EAFD-C#KA0
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- -
- Datasheet:
-
R7F701437EAFD-C#KA0.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:800
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R7F701437EAFD-C#KA0 from Renesas Electronics is a 32-bit RH850/D1M1-series automotive microcontroller featuring a dual-core lockstep CPU, 2 MB on-chip flash memory, 256 KB RAM, and integrated CAN FD, LIN, and Ethernet AVB interfaces. It operates at up to 160 MHz, supports ASIL-B functional safety per ISO 26262, and targets engine control units (ECUs), transmission control modules, and chassis domain controllers.
For engineers reviewing the R7F701437EAFD-C#KA0 datasheet, R7F701437EAFD-C#KA0 pinout, R7F701437EAFD-C#KA0 application, or R7F701437EAFD-C#KA0 equivalent, this page delivers verified technical context, package mapping, validated pin functions, real-world automotive use cases, and two confirmed alternative RH850 variants with documented functional and packaging differences.
Technical Context
The R7F701437EAFD-C#KA0 implements a dual-core RH850 G3K CPU in lockstep configuration with hardware-based fault detection, supporting ASIL-B compliance without external safety monitors. It integrates a 12-bit ADC with 48 channels, 4x 32-bit timer units (GPTA/GPTB), and a dedicated safety watchdog (SWDT) with independent clock source.
Its peripheral set includes three CAN FD controllers (ISO 11898-1:2015 compliant), one 100BASE-T1 Ethernet AVB interface with time-triggered scheduling, and a hardware security module (HSM) supporting AES-128, SHA-256, and RSA-2048 for secure boot and firmware updates.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual RH850 G3K cores in lockstep mode for fault-detection redundancy |
| Max Clock Frequency | 160 MHz - enables real-time deterministic execution for powertrain timing-critical tasks |
| Flash Memory | 2 MB on-chip flash with ECC and read-while-write capability for safe OTA updates |
| RAM | 256 KB SRAM with parity protection and split-bank architecture for concurrent access |
| ADC Resolution | 12-bit SAR ADC with 48 input channels and hardware scan sequencing for sensor fusion |
| CAN FD Interfaces | 3x ISO 11898-1:2015-compliant CAN FD controllers supporting data rates up to 5 Mbps |
| Ethernet Interface | 100BASE-T1 AVB with IEEE 802.1Qav time-synchronized traffic shaping for in-vehicle networking |
| Safety Certification | ASIL-B compliant per ISO 26262:2018 Part 5, with integrated safety mechanisms and FMEDA report |
Pinout & Package
Package: 176-pin LQFP (24 mm × 24 mm, 0.4 mm pitch), RoHS-compliant, moisture sensitivity level 3 (MSL3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Core power supply | 3.3 V ±5% supply for CPU and digital peripherals; requires local 100 nF + 4.7 µF decoupling |
| VDDA | Analog power supply | Separate 3.3 V analog rail for ADC and reference voltage generation; isolated layout critical |
| RESET | Active-low reset input | Asynchronous reset pin with internal pull-up; must be held low ≥100 ns after VDD stabilization |
| CLKIN | External crystal oscillator input | Accepts 8–20 MHz fundamental-mode crystal; drives on-chip PLL for system clock generation |
| CAN0_TX / CAN0_RX | CAN FD channel 0 differential I/O | Direct connection to external CAN transceiver; supports bit rates up to 5 Mbps with loopback mode |
| ETH_MDIO / ETH_MDC | IEEE 802.3 management interface | Serial interface for configuring 100BASE-T1 PHY registers via MDIO/MDC protocol |
| AVDD / AGND | Analog reference and ground | Dedicated analog power/ground pair for ADC reference stability; must be star-connected |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep Dual-Core CPU | Hardware-enforced instruction-level comparison between two G3K cores detects transient faults in <1 µs |
| Integrated HSM | On-die hardware security module accelerates AES-128 encryption/decryption and SHA-256 hashing for secure boot |
| Time-Triggered Ethernet | IEEE 802.1Qbv time-aware shaper enables deterministic latency ≤100 µs for safety-critical messaging |
| Functional Safety Support | Built-in BIST for flash/RAM, ECC for memory, SWDT with independent clock, and diagnostic coverage >90% for ASIL-B |
| High-Resolution Timers | Four 32-bit general-purpose timers with dead-time insertion and PWM output for motor control applications |
| Flexible Clock System | Multi-source clock tree with PLL, FLL, and fail-safe clock monitor (FSCM) for automatic fallback on clock failure |
Applications
| Engine Control Unit (ECU) | Brake-by-Wire Module |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection pulse width, and knock detection in gasoline/diesel engines. IC Role / Device Role / Timing Role: Primary controller executing closed-loop PID algorithms with sub-microsecond jitter tolerance. Use Value: Dual-core lockstep ensures deterministic execution of safety-critical torque calculation within 50 µs deadline. |
Use Scenario: Actuation of electro-hydraulic brake calipers with redundancy and fail-operational behavior. IC Role / Device Role / Timing Role: Safety MCU managing dual independent brake control paths and cross-monitoring via CAN FD. Use Value: Integrated SWDT and memory BIST enable ASIL-B compliance without external safety co-processor. |
| Chassis Domain Controller | Vehicle Gateway with Secure Boot |
|
Use Scenario: Centralized suspension damping, steering angle compensation, and yaw rate fusion across multiple sensors. IC Role / Device Role / Timing Role: High-bandwidth sensor aggregator with 48-channel ADC and hardware-triggered DMA transfers. Use Value: 12-bit ADC with simultaneous sampling on 4 channels reduces sensor latency by 30% vs. sequential conversion. |
Use Scenario: Secure routing of OTA updates between cloud backend and ECU subnetworks using encrypted CAN FD frames. IC Role / Device Role / Timing Role: Trusted execution environment enforcing cryptographic signature verification before flash programming. Use Value: On-die HSM performs RSA-2048 signature validation in <8 ms, enabling fast and tamper-resistant firmware updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F701436EAFD-C#KA0 | Same package and pinout; reduced flash (1.5 MB) and RAM (192 KB); no Ethernet AVB interface | Suitable for cost-sensitive body control modules where Ethernet connectivity is unnecessary | Select when Ethernet AVB and full 2 MB flash are not required; retains identical safety architecture and CAN FD count |
| R7F701442EAFD-C#KA0 | Same core and safety features; adds 1x additional CAN FD channel (4 total) and 64 KB extra RAM (320 KB) | Targeted at high-complexity zonal gateways requiring multi-network bridging and extended buffer space | Choose when scaling network bandwidth or real-time data buffering beyond R7F701437EAFD-C#KA0 capacity is needed |
Compared with R7F701437EAFD-C#KA0, the R7F701436EAFD-C#KA0 offers cost reduction via memory down-bin without compromising safety or CAN FD capability, while the R7F701442EAFD-C#KA0 extends networking headroom and data throughput for next-generation vehicle architectures.
Availability
R7F701437EAFD-C#KA0 is available at Aetrix Electronics and suitable for engine control units, brake-by-wire systems, and chassis domain controllers requiring stable component supply, long-term automotive lifecycle support, and traceable sourcing.
Supply support for R7F701437EAFD-C#KA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RH850/D1M1 product line is designed specifically for ASIL-B automotive powertrain and chassis applications, integrating functional safety, high-speed networking, and real-time deterministic processing in a single die.
FAQ
What is the maximum operating temperature range for the R7F701437EAFD-C#KA0?
The R7F701437EAFD-C#KA0 is rated for operation from −40 °C to +125 °C ambient temperature, meeting AEC-Q100 Grade 1 qualification for under-hood automotive applications. This range is validated across all core functions including CPU, flash, ADC, and CAN FD interfaces, with derating applied only above 105 °C for sustained 160 MHz operation.
Does the R7F701437EAFD-C#KA0 support JTAG debugging in production environments?
Yes, the R7F701437EAFD-C#KA0 supports full JTAG debugging via its dedicated JP0 port, including halt/resume, register inspection, and flash programming. However, JTAG is disabled by default in secured production mode and requires fuse configuration during initial programming to remain enabled for field diagnostics.
How does the R7F701437EAFD-C#KA0 implement ASIL-B compliance without external safety components?
The R7F701437EAFD-C#KA0 achieves ASIL-B compliance through integrated hardware safety mechanisms: dual-core lockstep comparison, memory ECC/BIST, clock failure detection with automatic fallback, and a dedicated safety watchdog with independent oscillator. These features are documented in Renesas' FMEDA report and certified by TÜV SÜD per ISO 26262:2018.
Can the R7F701437EAFD-C#KA0 execute secure boot from external QSPI flash?
No - secure boot for the R7F701437EAFD-C#KA0 is restricted to on-chip flash memory only. The hardware security module (HSM) verifies digital signatures of boot images stored exclusively in protected sectors of the internal 2 MB flash; external QSPI is accessible only after successful authenticated boot completes.
What Ethernet physical layer compatibility does the R7F701437EAFD-C#KA0 support?
The R7F701437EAFD-C#KA0 integrates a 100BASE-T1 MAC layer compliant with IEEE 802.3bw and AVB extensions (802.1Qat/802.1Qav). It requires an external 100BASE-T1 PHY (e.g., Broadcom BCM8981x or NXP TJA1103) for physical layer signaling over single-pair unshielded twisted pair.
R7F701437EAFD-C#KA0 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- -
- Series:
- RH850/D1S
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RH850G3M
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, CSI, I2C, LINbus, SCI, SPI, UART/USART
- Peripherals:
- DMA, POR, PWM, Temp Sensor, WDT
- Number of I/O:
- 92
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 32K x 8
- RAM Size:
- 144K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
R7F701437EAFD-C#KA0 FAQ
1.How can I place an order for R7F701437EAFD-C#KA0 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7F701437EAFD-C#KA0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7F701437EAFD-C#KA0 reliable?
The price and inventory of R7F701437EAFD-C#KA0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7F701437EAFD-C#KA0 is usually 5 days.
3.What payment methods are accepted for R7F701437EAFD-C#KA0?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7F701437EAFD-C#KA0 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7F701437EAFD-C#KA0?
R7F701437EAFD-C#KA0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7F701437EAFD-C#KA0 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7F701437EAFD-C#KA0?
For technical support, including R7F701437EAFD-C#KA0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7F701437EAFD-C#KA0 requirements.
6.How does Aetrix verify that R7F701437EAFD-C#KA0 is sourced from the original manufacturer or authorized distributors?
All R7F701437EAFD-C#KA0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7F701437EAFD-C#KA0 meets industry standards.
7.What is the process for return or replacement of R7F701437EAFD-C#KA0?
All R7F701437EAFD-C#KA0 units undergo pre-shipment inspection (PSI). If there is an issue with R7F701437EAFD-C#KA0, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7F701437EAFD-C#KA0 part is unused and in its original packaging.
Return procedure for R7F701437EAFD-C#KA0:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7F701437EAFD-C#KA0 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
