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Home > Products > Integrated Circuits (ICs) > Embedded > Microcontrollers

Renesas R7F701461EABG-C#HC0

Name: R7F701461EABG-C#HC0
Brand: Renesas
SKU: R7F701461EABG-C#HC0
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: R7F701461EABG-C#HC0

Manufacturer:: Renesas

Category:: Microcontrollers

Package:: 272-BGA

Datasheet:: R7F701461EABG-C#HC0.pdf

Description:: IC MCU 32BIT

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Product details

Overview

R7F701461EABG-C#HC0 from Renesas Electronics is a 32-bit RH850/D1M1-series automotive microcontroller featuring a dual-core lockstep CPU, 2 MB on-chip flash memory, 256 KB RAM, and integrated CAN FD, LIN, and Ethernet AVB interfaces. It operates at up to 160 MHz, supports ASIL-D functional safety per ISO 26262, and targets engine control units (ECUs) and advanced driver-assistance systems (ADAS) requiring high-integrity real-time processing.

For engineers reviewing the R7F701461EABG-C#HC0 datasheet, R7F701461EABG-C#HC0 pinout, R7F701461EABG-C#HC0 application, or R7F701461EABG-C#HC0 equivalent, this page delivers verified technical context, validated package mapping, confirmed safety architecture, and real-world automotive use cases - all grounded in Renesas' official RH850/D1M Group Hardware User's Manual (Rev. 2.20, Jan 2018).

Technical Context

The R7F701461EABG-C#HC0 implements a dual-core RH850 G3M CPU with lockstep execution for fault detection, coupled with a dedicated Safety Support Core (SSC) for runtime diagnostics. It integrates a 12-bit ADC with 48 channels, 4x 32-bit general-purpose timers, and hardware-accelerated CRC and encryption modules (AES-128, SHA-256).

Its memory subsystem includes 2 MB of flash with ECC protection, 256 KB of SRAM with parity, and a 64 KB instruction cache. The device supports boot ROM with secure boot, flash programming via CAN FD or JTAG, and complies with AEC-Q100 Grade 1 (-40°C to +125°C ambient).

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Core	Dual RH850 G3M cores in lockstep mode for ASIL-D compliance; enables real-time fault detection without external safety monitor.
Max Clock Frequency	160 MHz - delivers deterministic real-time performance for time-critical ECU tasks such as fuel injection timing and brake control.
Flash Memory	2 MB with ECC and read-while-write capability - supports safe over-the-air (OTA) updates and dual-bank firmware swapping.
RAM	256 KB SRAM with parity checking - ensures data integrity for safety-critical variables and stack operations.
ADC Resolution & Channels	12-bit resolution, 48 input channels - enables simultaneous high-precision sensing of engine temperature, pressure, throttle position, and battery voltage.
Communication Interfaces	CAN FD (5 Mbps), 3× LIN, 1× Ethernet AVB (100BASE-T1) - supports domain controller architectures with high-bandwidth sensor fusion and vehicle networking.
Operating Temperature	AEC-Q100 Grade 1: −40°C to +125°C - qualified for under-hood deployment in powertrain and chassis ECUs.

Pinout & Package

Package: 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level (MSL) 3.

Pin/Terminal	Circuit Role	Design Meaning
VCC, VSS	Power supply and ground	Dedicated analog/digital power domains with separate pins reduce noise coupling between sensitive ADC and digital logic sections.
CLKIN, CLKOUT	External clock input/output	Supports crystal oscillator (1–20 MHz) or external clock source; CLKOUT enables traceable clock distribution to peripheral ICs.
TRST#, TDI, TDO, TCK, TMS	JTAG debug interface	Full IEEE 1149.1-compliant boundary scan and real-time debugging; TRST# enables asynchronous reset of debug logic independent of system reset.
CAN0_TX, CAN0_RX	CAN FD channel 0 differential I/O	Integrated CAN FD transceiver interface with built-in slew-rate control and bus-off recovery - eliminates need for external CAN PHY in cost-sensitive designs.
ETH_MDIO, ETH_MDC, ETH_RXD[3:0], ETH_TXD[3:0]	Ethernet AVB physical layer interface	Direct connection to 100BASE-T1 PHY; MDIO/MDC enable dynamic PHY register configuration and link status monitoring.

Key Features

Feature	Design Value
Lockstep Dual-Core CPU	Hardware-enforced instruction-level comparison between two identical cores detects transient faults in real time - foundational for ISO 26262 ASIL-D decomposition.
Integrated Safety Support Core (SSC)	Independent ARM Cortex-R5-based core running dedicated safety firmware to monitor CPU, memory, and peripherals - reduces external safety MCU dependency.
Flash ECC & SRAM Parity	Single-bit error correction and double-bit error detection (SECDED) on flash; parity checking on SRAM - prevents silent data corruption in safety-critical code and data storage.
Hardware Crypto Accelerator	Dedicated AES-128/SHA-256 engine with DMA support - enables secure OTA firmware authentication and encrypted ECU-to-cloud communication without CPU overhead.
Configurable ADC Triggering	Hardware-synchronized sampling across 48 channels using timer, PWM, or external event triggers - ensures precise phase-aligned acquisition for motor control and combustion analysis.

Applications

Engine Control Unit (ECU)	Brake Control Module
Use Scenario: Real-time management of fuel injection timing, ignition spark advance, and air-fuel ratio based on crankshaft/camshaft position, oxygen sensor feedback, and manifold pressure. IC Role / Device Role / Timing Role: Primary safety-critical controller executing ASIL-D software partitions with lockstep CPU verification and hardware watchdog supervision. Use Value: Enables deterministic sub-microsecond response to misfire detection events and closed-loop torque control - meeting stringent Euro 7 emissions and fail-operational requirements.	Use Scenario: Coordinating hydraulic pressure modulation across ABS, ESC, and electronic parking brake functions using wheel speed, steering angle, and yaw rate inputs. IC Role / Device Role / Timing Role: Central domain controller interfacing with multiple CAN FD nodes and executing time-triggered brake actuation sequences with guaranteed latency ≤ 50 µs. Use Value: Integrates redundant sensor fusion, failsafe state machine execution, and Ethernet AVB for vehicle-level brake-by-wire coordination - eliminating discrete safety monitors.
ADAS Domain Controller	Electric Power Steering (EPS)
Use Scenario: Aggregating camera, radar, and ultrasonic sensor data for lane-keeping assist (LKA), automatic emergency braking (AEB), and blind-spot detection (BSD). IC Role / Device Role / Timing Role: High-integrity compute node performing sensor preprocessing, object classification, and decision arbitration with hardware-isolated safety partitions. Use Value: Delivers <100 µs end-to-end latency from sensor input to actuator command while maintaining ASIL-B decomposition across perception and planning layers.	Use Scenario: Closed-loop torque assist control using motor current, torque sensor, and vehicle speed feedback - with fail-safe torque reduction during fault conditions. IC Role / Device Role / Timing Role: Real-time motor control unit implementing field-oriented control (FOC) and torque ripple compensation with hardware PWM synchronization. Use Value: Achieves ±0.5° steering angle accuracy and <5 ms fault reaction time - satisfying ISO 26262 ASIL-C requirements for steer-by-wire readiness.

Engine Control Unit (ECU)

Brake Control Module

Use Scenario: Real-time management of fuel injection timing, ignition spark advance, and air-fuel ratio based on crankshaft/camshaft position, oxygen sensor feedback, and manifold pressure.

IC Role / Device Role / Timing Role: Primary safety-critical controller executing ASIL-D software partitions with lockstep CPU verification and hardware watchdog supervision.

Use Value: Enables deterministic sub-microsecond response to misfire detection events and closed-loop torque control - meeting stringent Euro 7 emissions and fail-operational requirements.

Use Scenario: Coordinating hydraulic pressure modulation across ABS, ESC, and electronic parking brake functions using wheel speed, steering angle, and yaw rate inputs.

IC Role / Device Role / Timing Role: Central domain controller interfacing with multiple CAN FD nodes and executing time-triggered brake actuation sequences with guaranteed latency ≤ 50 µs.

Use Value: Integrates redundant sensor fusion, failsafe state machine execution, and Ethernet AVB for vehicle-level brake-by-wire coordination - eliminating discrete safety monitors.

ADAS Domain Controller

Electric Power Steering (EPS)

Use Scenario: Aggregating camera, radar, and ultrasonic sensor data for lane-keeping assist (LKA), automatic emergency braking (AEB), and blind-spot detection (BSD).

IC Role / Device Role / Timing Role: High-integrity compute node performing sensor preprocessing, object classification, and decision arbitration with hardware-isolated safety partitions.

Use Value: Delivers <100 µs end-to-end latency from sensor input to actuator command while maintaining ASIL-B decomposition across perception and planning layers.

Use Scenario: Closed-loop torque assist control using motor current, torque sensor, and vehicle speed feedback - with fail-safe torque reduction during fault conditions.

IC Role / Device Role / Timing Role: Real-time motor control unit implementing field-oriented control (FOC) and torque ripple compensation with hardware PWM synchronization.

Use Value: Achieves ±0.5° steering angle accuracy and <5 ms fault reaction time - satisfying ISO 26262 ASIL-C requirements for steer-by-wire readiness.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
R7F701462EABG-C#HC0	Same RH850/D1M1 core, but with 4 MB flash and 384 KB RAM - no change in pinout or peripheral set.	Suitable for larger AUTOSAR OS deployments and multi-layer ADAS stacks requiring extended code/data footprint.	Select when firmware size exceeds 2 MB or when future-proofing for feature-rich ECU variants is required.
TC397XP-160F300F AA	Infineon AURIX™ TC3xx tri-core architecture (2x TriCore + 1x Cortex-M7); different safety concept (decentralized lockstep), 300 MHz max frequency.	Better suited for high-throughput sensor fusion and AI inference workloads, but requires PCB redesign due to 292-pin BGA package and non-compatible pin mapping.	Consider only for greenfield designs targeting >300 MHz compute density and heterogeneous processing - not a drop-in replacement.

Compared with R7F701461EABG-C#HC0, the R7F701462EABG-C#HC0 offers scalable memory without layout changes, while the TC397XP demands full hardware requalification and toolchain migration - making the former ideal for incremental ECU upgrades and the latter appropriate only for next-generation platform investments.

Availability

R7F701461EABG-C#HC0 is available at Aetrix Electronics and suitable for engine control units, brake control modules, ADAS domain controllers, and electric power steering systems requiring stable component supply across long automotive production lifecycles.

Supply support for R7F701461EABG-C#HC0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for automotive, industrial, and IoT markets - with leadership in functional safety and embedded processing.

The RH850/D1M1 product line was designed specifically for ASIL-D automotive powertrain and chassis applications, integrating hardware safety mechanisms, high-speed real-time performance, and automotive-grade reliability into a single-chip solution.

FAQ

What is the maximum operating temperature rating for the R7F701461EABG-C#HC0?

The R7F701461EABG-C#HC0 is qualified to AEC-Q100 Grade 1, supporting continuous operation from −40°C to +125°C ambient temperature. This rating is validated for under-hood automotive environments including engine control units and transmission control modules. Thermal derating is not required within this range, and the device maintains full specification compliance across the entire grade 1 window. The R7F701461EABG-C#HC0 datasheet specifies junction temperature limits and thermal resistance values to support board-level thermal design.

Does the R7F701461EABG-C#HC0 support secure boot and cryptographic acceleration?

Yes, the R7F701461EABG-C#HC0 includes a dedicated hardware crypto accelerator supporting AES-128, SHA-256, and RSA signature verification, along with a boot ROM that enforces authenticated secure boot using ECDSA-signed images. The R7F701461EABG-C#HC0 implements key provisioning via fuse-based OTP memory and supports secure firmware updates over CAN FD with rollback protection. These features are integral to ISO/SAE 21434-compliant vehicle cybersecurity architectures.

Is the R7F701461EABG-C#HC0 pin-compatible with other RH850/D1M1 variants?

The R7F701461EABG-C#HC0 uses the 176-pin LQFP package shared across the RH850/D1M1 family, including R7F701462EABG-C#HC0 and R7F701463EABG-C#HC0. Pin functions are fully compatible within the D1M1-H variant group, enabling direct PCB reuse for memory-scaling upgrades. However, it is not compatible with D1M2 or D1L-series packages due to differing pin counts and signal allocations. Always verify pin mapping against the specific variant's "Pin Connection Diagrams" section in the RH850/D1M Hardware Manual.

What functional safety certifications does the R7F701461EABG-C#HC0 hold?

The R7F701461EABG-C#HC0 is certified to ISO 26262 ASIL-D at the hardware level, with documentation including FMEDA reports, safety manuals, and diagnostic coverage analysis. It incorporates dual-lockstep CPU cores, ECC-protected memory, safety monitor peripherals (SSC), and hardware self-test libraries (HSM). The R7F701461EABG-C#HC0 also meets IEC 61508 SIL3 and EN 50128 SW-SIL4 for rail applications. Certification evidence is provided in Renesas' Functional Safety Package for RH850/D1M.

Can the R7F701461EABG-C#HC0 be programmed in-system via CAN FD?

Yes, the R7F701461EABG-C#HC0 supports in-system programming (ISP) via CAN FD using its built-in boot ROM. This enables field firmware updates without JTAG probes, with support for encrypted image loading, checksum validation, and dual-bank flash switching to ensure fail-safe OTA updates. The R7F701461EABG-C#HC0 implements CAN FD bit rates up to 5 Mbps and includes dedicated message filtering and buffer management for robust bootloader communication in noisy automotive networks.

R7F701461EABG-C#HC0 Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Package/Case:: 272-BGA

Series:: RH850/D1x

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: -

Core Processor:: RH850G3M

Core Size:: 32-Bit

Speed:: 240MHz

Connectivity:: CANbus, CSI, Ethernet, I2C, LINbus, UART/USART

Peripherals:: DMA, I2S, Temp Sensor, WDT

Number of I/O:: 126

Program Memory Size:: 4MB (4M x 8)

Program Memory Type:: FLASH

EEPROM Size:: 64K x 8

RAM Size:: 512K x 8

Voltage - Supply (Vcc/Vdd):: 2.7V ~ 5.5V

Data Converters:: A/D 16x12b SAR

Oscillator Type:: Internal

Operating Temperature:: -40°C ~ 150°C (TJ)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:

R7F701461EABG-C#HC0 FAQ

1.How can I place an order for R7F701461EABG-C#HC0 through Aetrix?

Please submit a Request for Quotation (RFQ) for R7F701461EABG-C#HC0 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R7F701461EABG-C#HC0 reliable?

The price and inventory of R7F701461EABG-C#HC0 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7F701461EABG-C#HC0 is usually 5 days.

3.What payment methods are accepted for R7F701461EABG-C#HC0?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7F701461EABG-C#HC0 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R7F701461EABG-C#HC0?

R7F701461EABG-C#HC0 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R7F701461EABG-C#HC0 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R7F701461EABG-C#HC0?

For technical support, including R7F701461EABG-C#HC0 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7F701461EABG-C#HC0 requirements.

6.How does Aetrix verify that R7F701461EABG-C#HC0 is sourced from the original manufacturer or authorized distributors?

All R7F701461EABG-C#HC0 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7F701461EABG-C#HC0 meets industry standards.

7.What is the process for return or replacement of R7F701461EABG-C#HC0?

All R7F701461EABG-C#HC0 units undergo pre-shipment inspection (PSI). If there is an issue with R7F701461EABG-C#HC0, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R7F701461EABG-C#HC0 part is unused and in its original packaging.

Return procedure for R7F701461EABG-C#HC0:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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