Renesas R7F7015823AFP-C#BA3

Overview

R7F7015823AFP-C#BA3 from Renesas Electronics is a 32-bit RH850/F1K automotive microcontroller featuring a dual-core lockstep CPU, 2 MB on-chip flash memory, and integrated CAN FD, LIN, and SENT interfaces. It operates at up to 120 MHz, supports ASIL-B functional safety per ISO 26262, and includes hardware ECC for flash and RAM. It is used in engine control units (ECUs) for real-time combustion timing and sensor fusion.

For engineers reviewing the R7F7015823AFP-C#BA3 datasheet, R7F7015823AFP-C#BA3 pinout, R7F7015823AFP-C#BA3 application, or R7F7015823AFP-C#BA3 equivalent, key selection criteria include dual-core lockstep execution integrity, ASIL-B certified safety mechanisms, CAN FD bandwidth (5 Mbps), flash endurance (100k write/erase cycles), and -40°C to 125°C extended temperature operation.

Technical Context

The R7F7015823AFP-C#BA3 implements two RH850 G3KH CPU cores operating in lockstep mode with cycle-by-cycle comparison and error detection logic. Its memory subsystem includes 2 MB of embedded flash with 128-bit wide access, 384 KB SRAM with parity/ECC, and a 16-channel DMA controller supporting scatter-gather transfers.

Peripheral integration includes three CAN FD controllers (ISO 11898-1:2015 compliant), six LINFlexD modules, four 12-bit SAR ADCs (16-channel total), and a 32-bit watchdog timer with windowed operation. All safety-critical peripherals are connected to the Safety Management Unit (SMU) for fault injection testing and diagnostic coverage monitoring.

Key Specifications

Pinout & Package

This device is housed in a 176-pin LQFP package (24 mm × 24 mm, 0.5 mm pitch) with exposed thermal pad for enhanced heat dissipation in high-power automotive environments.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Compared with R7F7015823AFP-C#BA3, the TC397XP offers higher performance and ASIL-D readiness but lacks integrated SENT, while the S32K344 provides broader software ecosystem support and Ethernet capability at the cost of different toolchain and safety qualification scope.

Availability

R7F7015823AFP-C#BA3 is available at Aetrix Electronics and suitable for engine control units, transmission control modules, brake control systems, and electric power steering applications requiring stable component supply across long automotive production lifecycles.

Supply support for R7F7015823AFP-C#BA3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and infrastructure markets.

The RH850/F1K product line delivers high-integrity 32-bit MCUs for ASIL-B automotive powertrain and chassis applications, emphasizing functional safety, real-time determinism, and robust I/O for harsh environments.

FAQ

What is the maximum operating frequency of the R7F7015823AFP-C#BA3?

The R7F7015823AFP-C#BA3 operates at a maximum CPU frequency of 120 MHz. This clock speed is achieved using an internal PLL locked to an external 8–20 MHz crystal oscillator input. The deterministic timing behavior at this frequency enables precise execution of engine control algorithms within strict real-time deadlines. All peripheral clocks are derived from this source with configurable dividers to balance performance and power consumption in the R7F7015823AFP-C#BA3.

Does the R7F7015823AFP-C#BA3 support CAN FD communication?

Yes, the R7F7015823AFP-C#BA3 integrates three fully compliant CAN FD controllers supporting both classical CAN (up to 1 Mbps) and CAN FD data phases (up to 5 Mbps). Each controller includes dedicated message RAM, hardware filtering, and automatic retransmission logic. These interfaces meet ISO 11898-1:2015 requirements and are directly usable in powertrain networks without external transceivers beyond standard CAN PHY components. The R7F7015823AFP-C#BA3 leverages these for high-bandwidth ECU-to-ECU messaging in modern vehicle architectures.

What functional safety level is certified for the R7F7015823AFP-C#BA3?

The R7F7015823AFP-C#BA3 is certified to ISO 26262 ASIL-B at the MCU level. Certification covers the dual-core lockstep execution unit, Safety Management Unit (SMU), flash and RAM ECC engines, and built-in self-test (BIST) features. Documentation includes FMEDA reports, safety manuals, and diagnostic coverage metrics validated by TÜV SÜD. This certification applies specifically to the R7F7015823AFP-C#BA3 device variant and must be implemented with recommended board-level design practices to maintain integrity in end systems.

How much on-chip flash memory does the R7F7015823AFP-C#BA3 include?

The R7F7015823AFP-C#BA3 includes 2 MB of embedded flash memory with hardware ECC for single-bit correction and double-bit detection. It supports read-while-write operation, enabling background firmware updates without halting CPU execution. The flash endurance is rated for 100,000 write/erase cycles, and sector protection mechanisms prevent accidental overwrites. This capacity accommodates complex automotive application code, bootloader, and calibration data storage within the R7F7015823AFP-C#BA3.

What package type is used for the R7F7015823AFP-C#BA3?

The R7F7015823AFP-C#BA3 is supplied in a 176-pin LQFP package measuring 24 mm × 24 mm with 0.5 mm pin pitch and an exposed thermal pad. This package supports reflow soldering per J-STD-020 and is qualified for automotive temperature ranges (−40°C to +125°C). The pin layout separates analog, digital, and power domains to minimize noise coupling, and the thermal pad improves heat dissipation during sustained high-CPU-load operation in the R7F7015823AFP-C#BA3.