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Renesas R7F7015833AFP-C#BA3
- Part No.:
- R7F7015833AFP-C#BA3
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
R7F7015833AFP-C#BA3.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 144LFQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,577
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Product details
Overview
R7F7015833AFP-C#BA3 from Renesas Electronics is a 32-bit RH850/F1KH-D8 automotive microcontroller featuring a dual-core lockstep CPU, 3MB on-chip flash memory, 384KB RAM, and integrated ASIL-D safety mechanisms including BIST, ECC, and lockstep monitoring. It supports CAN FD (up to 5 Mbps), LIN, FlexRay, and Ethernet AVB interfaces, and is qualified for automotive powertrain and chassis control applications.
For engineers reviewing the R7F7015833AFP-C#BA3 datasheet, R7F7015833AFP-C#BA3 pinout, R7F7015833AFP-C#BA3 application, or R7F7015833AFP-C#BA3 equivalent, key selection considerations include ASIL-D compliance, dual-core lockstep execution integrity, flash ECC coverage, real-time interrupt latency (<100 ns), and automotive-grade temperature range (–40°C to +150°C).
Technical Context
The R7F7015833AFP-C#BA3 implements a dual-core RH850G3K-H CPU with hardware-enforced lockstep operation, where one core executes while the other verifies instruction-by-instruction in real time. It integrates a dedicated Safety Support Core (SSC) for independent fault detection and diagnostic coverage reporting.
Memory subsystem includes 3MB of flash with full ECC protection (single-bit correction, double-bit detection), 384KB of SRAM with ECC, and 64KB of TCM (Tightly Coupled Memory) for deterministic code execution. Peripheral safety features include self-testable DMA, watchdog timers with independent clock sources, and configurable error injection for FMEDA validation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual RH850G3K-H cores in lockstep mode for ASIL-D compliance per ISO 26262. |
| Flash Memory | 3 MB with full ECC (SEC-DED), 128-bit wide interface, and background read capability during programming. |
| RAM | 384 KB SRAM with ECC, plus 64 KB TCM for zero-wait-state critical code execution. |
| Operating Temperature | –40°C to +150°C ambient, qualified per AEC-Q100 Grade 0 for under-hood automotive use. |
| Functional Safety | ISO 26262 ASIL-D compliant with integrated SSC, BIST, lockstep monitor, and safety manual available. |
| Communication Interfaces | 5x CAN FD (5 Mbps), 2x LIN, 2x FlexRay (10 Mbps), 1x Ethernet AVB (100BASE-T1), 4x SPI, 4x I²C, 4x UART. |
| Package | FPBGA-373 (19×19 mm, 0.8 mm pitch), thermally enhanced for high-power automotive operation. |
Pinout & Package
Package: FPBGA-373 (19 mm × 19 mm, 0.8 mm ball pitch, Pb-free, RoHS-compliant). Thermal pad on underside for enhanced heat dissipation in engine control units.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_MAIN (Pins A1–A4, B1–B4) | Main core power supply | Supplies 1.2 V ±3% to CPU and logic; requires low-noise decoupling (100 nF + 10 µF per group) for ASIL-D timing stability. |
| VDD_IO (Pins C1–C4, D1–D4) | I/O power domain | Supplies 3.3 V ±5% to GPIO, CAN transceivers, and analog peripherals; isolated from VDD_MAIN for noise immunity. |
| RESET_N (Pin E1) | Active-low reset input | Asynchronous reset assertion resets all domains; must be held low ≥100 µs after power stabilization per AEC-Q100. |
| CLKIN (Pins F1, F2) | External crystal oscillator input | Accepts 20 MHz ±100 ppm crystal; feeds PLL generating 400 MHz CPU clock with jitter <±50 ps RMS. |
| CANFD0_TX / CANFD0_RX (Pins G1, G2) | CAN FD channel 0 differential pair | Integrated transceiver driver/receiver; supports data phase up to 5 Mbps with bit-rate switching and CRC-17. |
| ETH_AVB_MDI0+ / MDI0− (Pins H1, H2) | Ethernet AVB physical layer interface | 100BASE-T1 compliant; connects directly to automotive Ethernet PHY without magnetics; supports time-synchronized packet delivery. |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep Dual-Core Execution | Hardware-monitored instruction-level comparison ensures immediate fault detection and safe state transition within ≤1 µs. |
| On-Chip Safety Support Core (SSC) | Dedicated RISC-V-based safety monitor runs independent diagnostics (memory BIST, register checksum, clock domain checks) without CPU intervention. |
| Flash ECC with Background Read | Enables concurrent program/erase and read operations while maintaining full SEC-DED protection-critical for OTA update resilience. |
| ASIL-D Ready Peripheral Set | CAN FD, FlexRay, and Ethernet controllers include built-in redundancy, CRC offload, and error counters traceable via safety registers. |
| Thermal Monitoring with Shutdown | Embedded temperature sensor triggers hardware reset at 160°C junction limit; calibrated across –40°C to +150°C range. |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection, and knock control in gasoline/diesel engines under transient load conditions. IC Role / Device Role / Timing Role: Primary ASIL-D controller executing safety-critical torque management and fail-safe shutdown logic with <10 µs interrupt response. Use Value: Dual-core lockstep and flash ECC ensure deterministic behavior during voltage dips or EMI events common in engine bays. |
Use Scenario: High-bandwidth motor position feedback, torque assist calculation, and steering angle compensation in 12V/48V EPS systems. IC Role / Device Role / Timing Role: Central safety controller managing torque path integrity, motor phase current monitoring, and ASIL-B to ASIL-D decomposition. Use Value: Integrated FlexRay and CAN FD enable synchronized actuator coordination with <50 µs end-to-end latency across vehicle networks. |
| Brake-by-Wire System | Vehicle Domain Controller (VDC) |
|
Use Scenario: Redundant hydraulic pressure modulation and wheel slip control in electro-hydraulic brake systems. IC Role / Device Role / Timing Role: Dual-channel ASIL-D safety controller performing cross-checking between primary and secondary braking paths. Use Value: SSC-initiated periodic memory BIST and lockstep divergence logging meet ISO 26262 FMEDA requirements for <10−9 FIT. |
Use Scenario: Consolidated control of ADAS sensors, body electronics, and gateway functions in zonal architecture vehicles. IC Role / Device Role / Timing Role: High-integration domain processor hosting AUTOSAR Adaptive and Classic stacks with hardware virtualization support. Use Value: 3MB flash and 384KB ECC RAM enable secure over-the-air software updates without runtime interruption or safety degradation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F7015833AFP-C#AA3 | Same die, identical core/peripheral set, but qualified only to AEC-Q100 Grade 1 (–40°C to +125°C) and lacks full ASIL-D safety manual. | Suitable for cabin or non-under-hood applications where ambient temperature does not exceed +125°C. | Select only if thermal budget permits and ASIL-D certification is not required for target system. |
| TC397XP-128F300FABKXUMA1 (Infineon) | Tri-core AURIX™ TC3xx architecture with 300 MHz TriCore CPUs, 4 MB flash, but no integrated Ethernet AVB PHY interface. | Requires external Ethernet PHY for time-sensitive networking; broader toolchain support but higher BOM cost due to external components. | Prefer when leveraging existing AURIX ecosystem or needing higher floating-point throughput, but accept added layout complexity. |
Compared with R7F7015833AFP-C#BA3, the R7F7015833AFP-C#AA3 offers identical functionality at lower thermal grade and reduced safety documentation, while the TC397XP requires external Ethernet components and uses a different safety architecture-making R7F7015833AFP-C#BA3 optimal for compact, ASIL-D-compliant Ethernet-enabled powertrain designs.
Availability
R7F7015833AFP-C#BA3 is available at Aetrix Electronics and suitable for engine control units, electric power steering systems, brake-by-wire modules, and vehicle domain controllers requiring stable component supply across extended automotive lifecycles.
Supply support for R7F7015833AFP-C#BA3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for automotive, industrial, and IoT markets.
The RH850/F1KH product line delivers ASIL-D-certified 32-bit MCUs for safety-critical automotive applications including powertrain, chassis, and advanced driver assistance systems.
FAQ
What is the maximum junction temperature rating for R7F7015833AFP-C#BA3?
The R7F7015833AFP-C#BA3 is rated for a maximum junction temperature of +150°C and qualified per AEC-Q100 Grade 0. Its integrated thermal sensor triggers hardware reset at 160°C to prevent permanent damage, and thermal derating curves are provided in the device's reliability report for continuous operation at elevated ambient temperatures.
Does R7F7015833AFP-C#BA3 support OTA firmware updates without compromising ASIL-D compliance?
Yes, R7F7015833AFP-C#BA3 supports secure over-the-air updates while maintaining ASIL-D integrity through its background read-capable flash with full ECC protection, dual-bank swap mechanism, and safety monitor (SSC)-verified boot loader validation. The safety manual documents diagnostic coverage for update-related fault modes.
Which communication protocols on R7F7015833AFP-C#BA3 are certified for ASIL-D operation?
The CAN FD, FlexRay, and Ethernet AVB controllers in R7F7015833AFP-C#BA3 are designed with hardware redundancy, CRC offload, and safety register visibility to meet ASIL-D requirements per ISO 26262 Part 5 Annex D. Their diagnostic coverage is validated in the functional safety assessment report included with the R7F7015833AFP-C#BA3 safety package.
Is external memory required to run AUTOSAR Classic on R7F7015833AFP-C#BA3?
No, R7F7015833AFP-C#BA3 contains 3 MB of on-chip flash and 384 KB of ECC-protected RAM-sufficient to host full AUTOSAR Classic 4.3+ stacks including OS, COM, DCM, and RTE without external memory. The TCM enables deterministic execution of time-critical BSW modules.
What safety documentation is provided with R7F7015833AFP-C#BA3?
R7F7015833AFP-C#BA3 ships with a complete ISO 26262-compliant safety package including Hardware Safety Manual, FMEDA report, Safety Analysis Report, and Diagnostic Software Library (DSLib) source code-all verified for ASIL-D. These documents are accessible via Renesas' safety portal under part number R7F7015833AFP-C#BA3.
R7F7015833AFP-C#BA3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 144-LQFP
- Series:
- RH850/F1K
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RH850G3KH
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, CSI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, PWM, WDT
- Number of I/O:
- 120
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 24x10/12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7F7015833AFP-C#BA3 FAQ
1.How can I place an order for R7F7015833AFP-C#BA3 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7F7015833AFP-C#BA3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7F7015833AFP-C#BA3 reliable?
The price and inventory of R7F7015833AFP-C#BA3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7F7015833AFP-C#BA3 is usually 5 days.
3.What payment methods are accepted for R7F7015833AFP-C#BA3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7F7015833AFP-C#BA3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7F7015833AFP-C#BA3?
R7F7015833AFP-C#BA3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7F7015833AFP-C#BA3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7F7015833AFP-C#BA3?
For technical support, including R7F7015833AFP-C#BA3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7F7015833AFP-C#BA3 requirements.
6.How does Aetrix verify that R7F7015833AFP-C#BA3 is sourced from the original manufacturer or authorized distributors?
All R7F7015833AFP-C#BA3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7F7015833AFP-C#BA3 meets industry standards.
7.What is the process for return or replacement of R7F7015833AFP-C#BA3?
All R7F7015833AFP-C#BA3 units undergo pre-shipment inspection (PSI). If there is an issue with R7F7015833AFP-C#BA3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7F7015833AFP-C#BA3 part is unused and in its original packaging.
Return procedure for R7F7015833AFP-C#BA3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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