My Inquiry
My Account
Renesas R7F7015873AFP-C#BA3
- Part No.:
- R7F7015873AFP-C#BA3
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 176-LQFP
- Datasheet:
-
R7F7015873AFP-C#BA3.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 176LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,596
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
R7F7015873AFP-C#BA3 from Renesas Electronics is a 32-bit RH850/F1K automotive-grade microcontroller featuring a dual-core lockstep CPU, 3MB on-chip flash memory, 384KB RAM, and integrated ASIL-B compliant safety mechanisms including ECC for memory, BIST, and lockstep monitoring. It supports CAN FD, LIN, and Ethernet AVB interfaces and is designed for body control modules, gateway ECUs, and chassis domain controllers requiring functional safety compliance.
For engineers reviewing the R7F7015873AFP-C#BA3 datasheet, R7F7015873AFP-C#BA3 pinout, R7F7015873AFP-C#BA3 application, or R7F7015873AFP-C#BA3 equivalent, key selection considerations include its dual-core lockstep architecture, ASIL-B certification evidence in hardware, 3MB flash with background programming support, CAN FD transceiver integration, and 176-pin LQFP package with dedicated safety monitor pins.
Technical Context
The R7F7015873AFP-C#BA3 implements two synchronized RH850 CPU cores operating in lockstep mode with real-time comparison logic to detect transient faults. It integrates a dedicated Safety Support Core (SSC) that independently monitors CPU execution, memory integrity via ECC, and peripheral operation through built-in self-test (BIST) sequences.
Hardware safety features include lockstep error detection with automatic fail-safe output assertion, memory protection units (MPU) with configurable regions, and a dedicated safety watchdog timer (SWDT) with independent clock source. The device meets ISO 26262 ASIL-B requirements at the hardware level per Renesas' certified safety manual.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Dual-core RH850 V3H lockstep configuration with real-time instruction comparison and fault reporting |
| Flash Memory | 3MB on-chip flash with ECC, background programming, and read-while-write capability for seamless firmware updates |
| RAM | 384KB SRAM with ECC protection and parity checking for safety-critical data storage |
| Package | 176-pin LQFP (24mm × 24mm, 0.5mm pitch) with dedicated safety monitor pins and thermal pad |
| Functional Safety | Hardware-level ASIL-B compliance per ISO 26262:2018 Part 5, supported by lockstep, ECC, BIST, and SSC |
| Communication Interfaces | 4× CAN FD channels (with integrated transceivers), 2× LIN, 1× Ethernet AVB (100BASE-T1), and 2× FlexRay |
| Operating Voltage | 3.0V to 5.5V supply range enabling direct connection to automotive battery rails without external regulators |
Pinout & Package
Package: 176-pin LQFP (24mm × 24mm, 0.5mm pitch) with exposed thermal pad (EP) for enhanced thermal dissipation in automotive under-hood environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Main power supply input | Accepts 3.0–5.5V automotive battery rail; multiple pins distributed for low-impedance power delivery |
| VSS | Ground reference | Dedicated analog/digital ground pins with separate routing paths to minimize noise coupling |
| RESET | Asynchronous reset input | Active-low signal initiating full system reset; monitored by Safety Support Core for fault recovery |
| CLKIN | External crystal oscillator input | Supports 4–20MHz crystal for main system clock; used with on-chip PLL for 200MHz core operation |
| SAFE_MON | Safety monitor output | Open-drain fail-safe signal asserted during lockstep mismatch or BIST failure to trigger external safety shutdown |
| EP | Exposed thermal pad | Internally connected to VSS; must be soldered to PCB ground plane for thermal management and EMI reduction |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep execution | Real-time instruction-by-instruction comparison between two identical CPU cores with automatic fault flagging |
| On-chip safety support core (SSC) | Dedicated hardware block performing independent memory BIST, clock monitoring, and lockstep status validation |
| ECC-protected memory subsystem | Single-bit error correction and double-bit error detection across all 3MB flash and 384KB RAM |
| Integrated CAN FD transceivers | Four fully compliant CAN FD physical layers with bit-rate switching up to 5Mbps and built-in fault protection |
| ASIL-B hardware certification | Pre-certified hardware safety elements meeting ISO 26262 Part 5 requirements without customer-level FMEDA derivation |
Applications
| Body Control Module (BCM) | Automotive Gateway ECU |
|---|---|
|
Use Scenario: Centralized control of lighting, door locks, window lifts, and wipers in modern vehicles. IC Role / Device Role / Timing Role: Primary application MCU managing I/O expansion, LIN slave coordination, and CAN message routing. Use Value: Lockstep CPU and ECC RAM ensure reliable operation during voltage transients common in 12V automotive systems. |
Use Scenario: Aggregation and translation of messages between high-speed CAN FD, LIN, and Ethernet AVB domains. IC Role / Device Role / Timing Role: Real-time protocol bridge with deterministic latency and safety-monitored message filtering. Use Value: Integrated CAN FD transceivers and Ethernet MAC reduce external component count while maintaining ASIL-B compliance. |
| Chassis Domain Controller | Electric Power Steering (EPS) Support Unit |
|
Use Scenario: Coordination of brake-by-wire, suspension damping, and steering assist functions in zonal architectures. IC Role / Device Role / Timing Role: Safety-monitoring co-processor validating sensor fusion outputs and actuator commands. Use Value: SSC and lockstep enable runtime fault detection with sub-millisecond response for fail-operational behavior. |
Use Scenario: Redundant torque monitoring and motor phase current supervision in EPS systems. IC Role / Device Role / Timing Role: Secondary safety controller cross-checking primary EPS MCU outputs via SPI and CAN FD. Use Value: Dedicated SAFE_MON pin provides hardware-level fail-safe signaling to motor driver ICs without software intervention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F7015833AFP-C#BA3 | Same RH850/F1K family, 2MB flash, 256KB RAM, identical pinout and safety architecture | Lower memory capacity suits cost-sensitive BCMs with reduced feature sets | Select when application firmware size remains under 2MB and BOM cost optimization is prioritized |
| TC377TP-128F300N-DC | AURIX™ TC3xx tri-core architecture with lockstep, 4MB flash, but different safety compiler toolchain and debug interface | Requires adaptation of AUTOSAR stack and safety analysis documentation due to distinct hardware abstraction layer | Choose when existing AURIX ecosystem integration or higher compute throughput for sensor fusion is required |
Compared with R7F7015873AFP-C#BA3, the R7F7015833AFP-C#BA3 offers identical safety architecture and pin compatibility at lower memory density, while the TC377TP requires full toolchain migration but delivers higher multi-core throughput for complex ADAS-adjacent tasks.
Availability
R7F7015873AFP-C#BA3 is available at Aetrix Electronics and suitable for automotive body control modules, gateway ECUs, and chassis domain controllers requiring stable component supply and long-term lifecycle assurance.
Supply support for R7F7015873AFP-C#BA3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for automotive, industrial, and IoT markets.
The RH850/F1K product line delivers ASIL-B certified 32-bit MCUs with lockstep CPUs and integrated safety hardware for automotive body, gateway, and chassis applications where functional safety and long-term reliability are mandatory.
FAQ
What is the maximum operating frequency of the R7F7015873AFP-C#BA3?
The R7F7015873AFP-C#BA3 operates at a maximum CPU frequency of 200 MHz, achieved via an on-chip PLL that multiplies an external 4–20 MHz crystal input. This frequency is sustained across the full automotive temperature range (−40°C to +125°C) and supports deterministic real-time execution for safety-critical tasks.
Does the R7F7015873AFP-C#BA3 include hardware-based functional safety features?
Yes, the R7F7015873AFP-C#BA3 integrates multiple hardware safety features including dual-core lockstep CPU comparison logic, ECC for flash and RAM, built-in self-test (BIST) for memory and peripherals, and a dedicated Safety Support Core (SSC). These elements collectively satisfy ISO 26262 ASIL-B hardware requirements without requiring external safety monitors.
What communication interfaces are integrated into the R7F7015873AFP-C#BA3?
The R7F7015873AFP-C#BA3 integrates four CAN FD controllers with physical layer transceivers, two LIN controllers, one Ethernet AVB (100BASE-T1) MAC, two FlexRay controllers, and multiple SPI/I²C/UART peripherals. All CAN FD channels support bit-rate switching up to 5 Mbps and are accessible via dedicated pins with configurable termination.
Is the R7F7015873AFP-C#BA3 pin-compatible with other RH850/F1K variants?
The R7F7015873AFP-C#BA3 uses a 176-pin LQFP package shared across several RH850/F1K members, including the R7F7015833AFP-C#BA3. Pin functions and electrical characteristics are identical for common peripherals, enabling drop-in replacement where memory and peripheral requirements align - verified in Renesas' RH850/F1K Hardware Manual Rev.1.10.
What development tools support the R7F7015873AFP-C#BA3?
The R7F7015873AFP-C#BA3 is supported by Renesas' e² studio IDE, CS+ for CC compiler, and the RH850/F1K Starter Kit (R0K57F1K0020BR0). Debugging uses JTAG/SWD via the integrated debug interface, and safety analysis tools include the Renesas Functional Safety Development Kit (FS-DK) with pre-certified safety libraries for R7F7015873AFP-C#BA3.
R7F7015873AFP-C#BA3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 176-LQFP
- Series:
- RH850/F1x
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- RH850G3KH
- Core Size:
- 32-Bit
- Speed:
- 120MHz
- Connectivity:
- CANbus, CSI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, PWM, WDT
- Number of I/O:
- 150
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 28x10b, 32x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7F7015873AFP-C#BA3 FAQ
1.How can I place an order for R7F7015873AFP-C#BA3 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7F7015873AFP-C#BA3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7F7015873AFP-C#BA3 reliable?
The price and inventory of R7F7015873AFP-C#BA3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7F7015873AFP-C#BA3 is usually 5 days.
3.What payment methods are accepted for R7F7015873AFP-C#BA3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7F7015873AFP-C#BA3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7F7015873AFP-C#BA3?
R7F7015873AFP-C#BA3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7F7015873AFP-C#BA3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7F7015873AFP-C#BA3?
For technical support, including R7F7015873AFP-C#BA3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7F7015873AFP-C#BA3 requirements.
6.How does Aetrix verify that R7F7015873AFP-C#BA3 is sourced from the original manufacturer or authorized distributors?
All R7F7015873AFP-C#BA3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7F7015873AFP-C#BA3 meets industry standards.
7.What is the process for return or replacement of R7F7015873AFP-C#BA3?
All R7F7015873AFP-C#BA3 units undergo pre-shipment inspection (PSI). If there is an issue with R7F7015873AFP-C#BA3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7F7015873AFP-C#BA3 part is unused and in its original packaging.
Return procedure for R7F7015873AFP-C#BA3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
R7F7015873AFP-C#BA3 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
