Renesas R7F7016514ABG-C#HC1

Overview

R7F7016514ABG-C#HC1 from Renesas Electronics is a 32-bit RH850/F1K automotive-grade microcontroller featuring a dual-core lockstep CPU, 2 MB on-chip flash memory, 256 KB RAM, and integrated CAN FD, LIN, and SENT interfaces. It operates at up to 160 MHz, supports ASIL-D functional safety per ISO 26262, and targets engine control units (ECUs) requiring high-integrity real-time processing.

For engineers reviewing the R7F7016514ABG-C#HC1 datasheet, R7F7016514ABG-C#HC1 pinout, R7F7016514ABG-C#HC1 application, or R7F7016514ABG-C#HC1 equivalent, key selection criteria include dual-core lockstep execution, ASIL-D certification evidence, CAN FD timing compliance, flash write endurance (100k cycles), and package thermal resistance (θ_JA = 32°C/W in 176-pin LQFP).

Technical Context

The R7F7016514ABG-C#HC1 implements two synchronized RH850 G3KH CPU cores executing identical instructions with cycle-by-cycle comparison for fault detection. Its memory subsystem includes 2 MB of ECC-protected flash with background read while programming (BRWP) and 256 KB of SRAM with parity protection.

Peripheral integration includes three CAN FD controllers (ISO 11898-1:2015 compliant), four LIN controllers, eight 12-bit ADC units with simultaneous sampling, and a hardware safety monitor (HSM) supporting FMEDA and diagnostic coverage reporting per ISO 26262 Part 5 Annex D.

Key Specifications

Pinout & Package

Package: 176-pin LQFP (24 mm × 24 mm, 0.4 mm pitch), moisture sensitivity level (MSL) 3, lead-free and RoHS compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Compared with R7F7016514ABG-C#HC1, the R7F7016524ABG-C#HC1 offers expanded I/O for sensor-rich ECUs without altering PCB layout, while the SPC574S40E1 delivers higher computational throughput for complex chassis control but lacks native SENT support-requiring external signal conditioning.

Availability

R7F7016514ABG-C#HC1 is available at Aetrix Electronics and suitable for engine control units, transmission control modules, and brake control units requiring stable component supply across automotive production lifecycles.

Supply support for R7F7016514ABG-C#HC1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RH850/F1K product line delivers ASIL-D-certifiable MCUs for powertrain and chassis control, engineered to meet stringent automotive functional safety and real-time performance requirements.

FAQ

What is the maximum operating frequency of the R7F7016514ABG-C#HC1?

The R7F7016514ABG-C#HC1 operates at a maximum CPU frequency of 160 MHz. This clock speed is achieved via an on-chip PLL that multiplies an external 8–20 MHz crystal input. The 160 MHz execution rate enables deterministic loop execution for time-critical automotive functions such as fuel injection timing and anti-lock braking control within the R7F7016514ABG-C#HC1's dual-core lockstep architecture.

Does the R7F7016514ABG-C#HC1 support CAN FD, and what data rates are achievable?

Yes, the R7F7016514ABG-C#HC1 integrates three fully compliant CAN FD controllers supporting ISO 11898-1:2015. Each channel achieves up to 1 Mbps in arbitration phase and 5 Mbps in data phase. These capabilities allow the R7F7016514ABG-C#HC1 to handle high-bandwidth ECU communication, including firmware updates and sensor fusion data, while maintaining backward compatibility with classical CAN networks.

What safety certifications does the R7F7016514ABG-C#HC1 support out of the box?

The R7F7016514ABG-C#HC1 is designed to support ASIL-D compliance per ISO 26262. It includes hardware features essential for certification: dual-core lockstep execution, ECC-protected flash and parity-protected RAM, a dedicated Hardware Safety Monitor (HSM), and comprehensive diagnostic libraries. Renesas provides FMEDA reports, safety manuals, and HAL drivers-all validated for use with the R7F7016514ABG-C#HC1-to accelerate functional safety integration.

How much on-chip flash and RAM does the R7F7016514ABG-C#HC1 include?

The R7F7016514ABG-C#HC1 includes 2 MB of on-chip flash memory with error-correcting code (ECC) and 256 KB of SRAM with parity protection. The flash supports background read while programming (BRWP), enabling seamless firmware updates without halting CPU operation. Both memory blocks are safety-hardened to meet ASIL-D requirements, and their capacities are fixed for this specific variant-R7F7016514ABG-C#HC1-not configurable via software.

What package type and pin count does the R7F7016514ABG-C#HC1 use?

The R7F7016514ABG-C#HC1 uses a 176-pin LQFP package measuring 24 mm × 24 mm with 0.4 mm pitch. It is lead-free and RoHS compliant, rated MSL3, and thermally characterized with θ_JA = 32°C/W. This package is shared across the RH850/F1K family and supports standard SMT assembly processes. Pin assignments-including VDD, VDDIO, RESET, CLKIN, CAN FD, SENT, and ADC channels-are documented in the RH850/F1K Hardware User's Manual for the R7F7016514ABG-C#HC1.