Renesas R7F7016533ABG-C#HC1
- Part No.:
- R7F7016533ABG-C#HC1
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 272-BGA
- Datasheet:
-
R7F7016533ABG-C#HC1.pdf
- Description:
- IC MCU 32BIT 4MB FLASH 272FPBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
R7F7016533ABG-C#HC1 from Renesas Electronics is a 32-bit RH850/F1KH-D8 automotive microcontroller featuring a dual-core lockstep CPU, 3MB on-chip flash memory, 384KB RAM, and integrated safety mechanisms including ECC, BIST, and lockstep monitoring. It supports ASIL-D functional safety compliance per ISO 26262 and operates at up to 160 MHz in automotive powertrain and chassis control applications.
For engineers reviewing the R7F7016533ABG-C#HC1 datasheet, R7F7016533ABG-C#HC1 pinout, R7F7016533ABG-C#HC1 application, or R7F7016533ABG-C#HC1 equivalent, key selection criteria include dual-core lockstep execution integrity, ASIL-D-certified safety library support, 3MB flash with background programming capability, and automotive-grade AEC-Q100 Grade 1 qualification across –40°C to +125°C ambient.
Technical Context
The R7F7016533ABG-C#HC1 implements two synchronized RH850 G3KH CPU cores executing identical instruction streams with cycle-accurate comparison and fault detection. Its safety architecture includes hardware-based lockstep monitor, memory built-in self-test (MBIST), flash ECC with error correction and reporting, and dedicated safety management unit (SMU) for runtime diagnostics.
It integrates automotive-specific peripherals: 2x CAN FD controllers (ISO 11898-1:2015 compliant), 4x LIN controllers, 2x SENT interfaces, 16-bit ADC with 24 channels, and 32-bit timer units supporting PWM generation and input capture for motor control and sensor signal conditioning.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual RH850 G3KH cores in lockstep configuration for ASIL-D fault detection and recovery |
| Flash Memory | 3 MB on-chip flash with ECC protection, background programming, and 100k write/erase cycles |
| RAM | 384 KB SRAM with ECC, split into safety-critical and non-safety partitions |
| Operating Temp | –40°C to +125°C ambient, qualified per AEC-Q100 Grade 1 for under-hood automotive use |
| CAN FD | 2 channels supporting data rates up to 5 Mbps and ISO 11898-1:2015 physical layer compliance |
| Safety Certification | ASIL-D compliant per ISO 26262-5/-6; includes certified safety manual and diagnostic coverage reports |
| Package | 256-pin LFBGA (17 mm × 17 mm, 0.8 mm pitch), moisture sensitivity level 3 |
Pinout & Package
Package: 256-pin LFBGA (17 mm × 17 mm, 0.8 mm pitch), RoHS-compliant, lead-free, MSL3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDP0–VDDP7 | Core Power Supply | Eight independent 1.2 V core supply pins for noise isolation and current distribution across CPU, peripherals, and memory domains |
| VSSP0–VSSP7 | Core Ground | Corresponding ground return paths for each VDDP pin to minimize ground bounce and ensure stable core operation |
| VDDA, VSSA | Analog Power/Ground | Dedicated 5 V analog supply and ground for ADC, DAC, and reference circuitry to maintain signal integrity |
| CLKIN, CLKOUT | External Clock Interface | Accepts 4–20 MHz crystal or external clock source; CLKOUT provides buffered system clock for trace/debug or peripheral sync |
| RESETn | Active-Low Reset Input | Asynchronous reset pin with internal pull-up; initiates full system reset including lockstep synchronization and safety monitor reinitialization |
| TRSTn, TCK, TMS, TDI, TDO | JTAG Debug Interface | IEEE 1149.1-compliant boundary scan and debug interface supporting real-time trace and safety-critical firmware validation |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep CPU Monitoring | Hardware comparator detects instruction-level divergence between dual cores within one cycle, triggering safe state entry |
| Flash ECC Engine | Single-bit error correction and double-bit error detection applied to all flash read/write operations without software overhead |
| Memory BIST | On-demand and periodic SRAM/flash BIST with configurable test patterns and pass/fail reporting via SMU registers |
| SENT Interface | Two independent SENT receivers supporting standard and enhanced modes for high-resolution sensor data acquisition (e.g., pressure, temperature) |
| ADC with Window Compare | 24-channel 16-bit ADC with programmable window comparators for autonomous over/under-range detection without CPU intervention |
| Safe PWM Generation | 32-bit timer units with dead-time insertion, fault input monitoring, and automatic shutdown on error-certified for motor control safety functions |
Applications
| Engine Control Unit (ECU) | Electric Power Steering (EPS) |
|---|---|
|
Use Scenario: Real-time combustion timing, fuel injection, and knock control in gasoline/diesel engines under transient load conditions. IC Role / Device Role / Timing Role: Primary ASIL-D controller executing safety-critical engine management algorithms with dual-core lockstep verification and deterministic interrupt latency ≤ 1.2 µs. Use Value: Enables ISO 26262 ASIL-D compliance for powertrain control without external safety co-processor, reducing BOM cost and board space. |
Use Scenario: Torque assist calculation, motor position feedback processing, and fail-safe torque reduction during sensor or actuator faults. IC Role / Device Role / Timing Role: Safety-certified host MCU managing BLDC motor commutation, SENT-based torque sensor interface, and CAN FD communication with vehicle network. Use Value: Integrated SENT receivers and ASIL-D PWM timers eliminate need for discrete analog front-end ICs and external safety monitors. |
| Brake-by-Wire System | Advanced Driver Assistance (ADAS) Sensor Fusion Hub |
|
Use Scenario: Redundant hydraulic pressure control and brake actuation with cross-checking between primary and backup control paths. IC Role / Device Role / Timing Role: Dual-lockstep core executes redundant braking algorithms; flash ECC and RAM BIST ensure data integrity across safety channels. Use Value: On-chip memory self-test and lockstep monitoring meet ASIL-D diagnostic coverage targets (>99%) for brake control without external watchdog ICs. |
Use Scenario: Aggregating and preprocessing radar, camera, and ultrasonic sensor data before forwarding to central ADAS domain controller. IC Role / Device Role / Timing Role: High-bandwidth peripheral hub with multiple CAN FD, LIN, and SENT interfaces synchronizing time-stamped sensor inputs. Use Value: Hardware timestamping and deterministic interrupt handling enable sub-microsecond sensor event correlation across heterogeneous interfaces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive safety microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F7016443ABG-C#HC1 | Same RH850/F1KH-D8 family, but with 2MB flash and 256KB RAM; identical pinout and safety features | Suitable for cost-optimized ASIL-D systems where 3MB flash is not required (e.g., mid-tier EPS) | Select when flash capacity can be reduced without compromising bootloader, application, and safety library partitioning |
| TC397XP-128F300S-DC | AURIX™ TC3xx tri-core architecture (2x TriCore + 1x Cortex-M7); different safety architecture (HSM + PMU), no lockstep CPU | Requires different safety software stack and toolchain; higher peak performance but lower deterministic latency than lockstep mode | Choose for applications needing higher computational throughput (e.g., radar preprocessing) where ASIL-D is achieved via diverse redundancy |
Compared with R7F7016533ABG-C#HC1, the R7F7016443ABG-C#HC1 offers identical safety architecture and pin compatibility at lower memory density, while the TC397XP requires re-architecting of safety mechanisms and toolchain integration-making R7F7016533ABG-C#HC1 optimal for strict lockstep-based ASIL-D implementations.
Availability
R7F7016533ABG-C#HC1 is available at Aetrix Electronics and suitable for automotive powertrain control, electric power steering, brake-by-wire systems, and ADAS sensor fusion requiring stable component supply, long-term lifecycle assurance, and ASIL-D-certified silicon.
Supply support for R7F7016533ABG-C#HC1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The RH850/F1KH product line delivers high-integrity 32-bit MCUs designed specifically for ASIL-D automotive safety applications-including engine control, transmission, chassis, and advanced driver assistance systems-with integrated lockstep, memory safety, and diagnostic acceleration.
FAQ
What is the maximum operating frequency of the R7F7016533ABG-C#HC1?
The R7F7016533ABG-C#HC1 operates at a maximum CPU frequency of 160 MHz under specified voltage and temperature conditions (VDD = 1.2 V, TA = –40°C to +125°C). This frequency is sustained across both lockstep cores simultaneously, with hardware-enforced synchronization ensuring deterministic timing for ASIL-D safety-critical tasks. The R7F7016533ABG-C#HC1 achieves this performance while maintaining full ECC coverage on all memory accesses and real-time BIST execution.
Does the R7F7016533ABG-C#HC1 support CAN FD, and what data rates are achievable?
Yes, the R7F7016533ABG-C#HC1 integrates two fully compliant CAN FD controllers supporting ISO 11898-1:2015. Each channel achieves arbitration bit rates up to 1 Mbps and data bit rates up to 5 Mbps, with flexible data field lengths (up to 64 bytes) and CRC-17/CRC-21 error detection. These controllers operate independently and are accessible via dedicated DMA channels to minimize CPU loading during high-throughput vehicle network communication-critical for R7F7016533ABG-C#HC1 deployments in modern automotive domain controllers.
What safety certifications does the R7F7016533ABG-C#HC1 hold?
The R7F7016533ABG-C#HC1 is certified to ASIL-D per ISO 26262-5 and -6, with documentation including FMEDA reports, safety manuals, and diagnostic coverage analysis provided by Renesas. It meets AEC-Q100 Grade 1 requirements (–40°C to +125°C) and includes hardware safety mechanisms such as lockstep CPU monitoring, flash ECC, RAM BIST, and a dedicated safety management unit (SMU). These features are validated and documented for use in R7F7016533ABG-C#HC1-based systems targeting full ASIL-D decomposition.
Is the R7F7016533ABG-C#HC1 pin-compatible with other RH850/F1KH variants?
The R7F7016533ABG-C#HC1 uses the 256-pin LFBGA package shared across the RH850/F1KH-D8 product group, including R7F7016443ABG-C#HC1 and R7F7016523ABG-C#HC1. Pin assignments for power, ground, reset, clock, JTAG, CAN FD, and SENT are identical; however, peripheral pin multiplexing differs for certain ADC, timer, and GPIO functions. Therefore, while the R7F7016533ABG-C#HC1 shares mechanical and basic electrical compatibility, PCB layout reuse requires verification of signal routing against the specific variant's pin function table in the RH850/F1KH User's Manual.
What development tools are supported for the R7F7016533ABG-C#HC1?
Renesas provides full toolchain support for the R7F7016533ABG-C#HC1, including e2 studio IDE with GCC and CS+ compilers, Renesas Flash Programmer for programming, and the E2 emulator Lite for debugging. Safety-certified middleware-including the Renesas Functional Safety Package (FSP) with ASIL-D drivers, SafeRTOS, and certified safety libraries-is available for R7F7016533ABG-C#HC1. Third-party tools like Vector CANoe and dSPACE SCALEXIO integrate via JTAG and CAN FD for HIL testing of R7F7016533ABG-C#HC1-based ECUs.
R7F7016533ABG-C#HC1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 272-BGA
- Series:
- RH850/F1KM-S4
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RH850G3KH
- Core Size:
- 32-Bit Single-Core
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, PWM, WDT
- Number of I/O:
- 214
- Program Memory Size:
- 4MB (4M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 128K x 8
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 38x10b, 32x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7F7016533ABG-C#HC1 FAQ
1.How can I place an order for R7F7016533ABG-C#HC1 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7F7016533ABG-C#HC1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7F7016533ABG-C#HC1 reliable?
The price and inventory of R7F7016533ABG-C#HC1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7F7016533ABG-C#HC1 is usually 5 days.
3.What payment methods are accepted for R7F7016533ABG-C#HC1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7F7016533ABG-C#HC1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7F7016533ABG-C#HC1?
R7F7016533ABG-C#HC1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7F7016533ABG-C#HC1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7F7016533ABG-C#HC1?
For technical support, including R7F7016533ABG-C#HC1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7F7016533ABG-C#HC1 requirements.
6.How does Aetrix verify that R7F7016533ABG-C#HC1 is sourced from the original manufacturer or authorized distributors?
All R7F7016533ABG-C#HC1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7F7016533ABG-C#HC1 meets industry standards.
7.What is the process for return or replacement of R7F7016533ABG-C#HC1?
All R7F7016533ABG-C#HC1 units undergo pre-shipment inspection (PSI). If there is an issue with R7F7016533ABG-C#HC1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7F7016533ABG-C#HC1 part is unused and in its original packaging.
Return procedure for R7F7016533ABG-C#HC1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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