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Renesas R7F7016533ABG-C#HC1

Part No.:
R7F7016533ABG-C#HC1
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
272-BGA
Datasheet:
AetrixR7F7016533ABG-C#HC1.pdf
Description:
IC MCU 32BIT 4MB FLASH 272FPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,554

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Product details

Overview

R7F7016533ABG-C#HC1 from Renesas Electronics is a 32-bit RH850/F1KH-D8 automotive microcontroller featuring a dual-core lockstep CPU, 3MB on-chip flash memory, 384KB RAM, and integrated safety mechanisms including ECC, BIST, and lockstep monitoring. It supports ASIL-D functional safety compliance per ISO 26262 and operates at up to 160 MHz in automotive powertrain and chassis control applications.

For engineers reviewing the R7F7016533ABG-C#HC1 datasheet, R7F7016533ABG-C#HC1 pinout, R7F7016533ABG-C#HC1 application, or R7F7016533ABG-C#HC1 equivalent, key selection criteria include dual-core lockstep execution integrity, ASIL-D-certified safety library support, 3MB flash with background programming capability, and automotive-grade AEC-Q100 Grade 1 qualification across –40°C to +125°C ambient.

Technical Context

The R7F7016533ABG-C#HC1 implements two synchronized RH850 G3KH CPU cores executing identical instruction streams with cycle-accurate comparison and fault detection. Its safety architecture includes hardware-based lockstep monitor, memory built-in self-test (MBIST), flash ECC with error correction and reporting, and dedicated safety management unit (SMU) for runtime diagnostics.

It integrates automotive-specific peripherals: 2x CAN FD controllers (ISO 11898-1:2015 compliant), 4x LIN controllers, 2x SENT interfaces, 16-bit ADC with 24 channels, and 32-bit timer units supporting PWM generation and input capture for motor control and sensor signal conditioning.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Dual RH850 G3KH cores in lockstep configuration for ASIL-D fault detection and recovery
Flash Memory 3 MB on-chip flash with ECC protection, background programming, and 100k write/erase cycles
RAM 384 KB SRAM with ECC, split into safety-critical and non-safety partitions
Operating Temp –40°C to +125°C ambient, qualified per AEC-Q100 Grade 1 for under-hood automotive use
CAN FD 2 channels supporting data rates up to 5 Mbps and ISO 11898-1:2015 physical layer compliance
Safety Certification ASIL-D compliant per ISO 26262-5/-6; includes certified safety manual and diagnostic coverage reports
Package 256-pin LFBGA (17 mm × 17 mm, 0.8 mm pitch), moisture sensitivity level 3

Pinout & Package

Package: 256-pin LFBGA (17 mm × 17 mm, 0.8 mm pitch), RoHS-compliant, lead-free, MSL3.

Pin/Terminal Circuit Role Design Meaning
VDDP0–VDDP7 Core Power Supply Eight independent 1.2 V core supply pins for noise isolation and current distribution across CPU, peripherals, and memory domains
VSSP0–VSSP7 Core Ground Corresponding ground return paths for each VDDP pin to minimize ground bounce and ensure stable core operation
VDDA, VSSA Analog Power/Ground Dedicated 5 V analog supply and ground for ADC, DAC, and reference circuitry to maintain signal integrity
CLKIN, CLKOUT External Clock Interface Accepts 4–20 MHz crystal or external clock source; CLKOUT provides buffered system clock for trace/debug or peripheral sync
RESETn Active-Low Reset Input Asynchronous reset pin with internal pull-up; initiates full system reset including lockstep synchronization and safety monitor reinitialization
TRSTn, TCK, TMS, TDI, TDO JTAG Debug Interface IEEE 1149.1-compliant boundary scan and debug interface supporting real-time trace and safety-critical firmware validation

Key Features

Feature Design Value
Lockstep CPU Monitoring Hardware comparator detects instruction-level divergence between dual cores within one cycle, triggering safe state entry
Flash ECC Engine Single-bit error correction and double-bit error detection applied to all flash read/write operations without software overhead
Memory BIST On-demand and periodic SRAM/flash BIST with configurable test patterns and pass/fail reporting via SMU registers
SENT Interface Two independent SENT receivers supporting standard and enhanced modes for high-resolution sensor data acquisition (e.g., pressure, temperature)
ADC with Window Compare 24-channel 16-bit ADC with programmable window comparators for autonomous over/under-range detection without CPU intervention
Safe PWM Generation 32-bit timer units with dead-time insertion, fault input monitoring, and automatic shutdown on error-certified for motor control safety functions

Applications

Engine Control Unit (ECU) Electric Power Steering (EPS)

Use Scenario: Real-time combustion timing, fuel injection, and knock control in gasoline/diesel engines under transient load conditions.

IC Role / Device Role / Timing Role: Primary ASIL-D controller executing safety-critical engine management algorithms with dual-core lockstep verification and deterministic interrupt latency ≤ 1.2 µs.

Use Value: Enables ISO 26262 ASIL-D compliance for powertrain control without external safety co-processor, reducing BOM cost and board space.

Use Scenario: Torque assist calculation, motor position feedback processing, and fail-safe torque reduction during sensor or actuator faults.

IC Role / Device Role / Timing Role: Safety-certified host MCU managing BLDC motor commutation, SENT-based torque sensor interface, and CAN FD communication with vehicle network.

Use Value: Integrated SENT receivers and ASIL-D PWM timers eliminate need for discrete analog front-end ICs and external safety monitors.

Brake-by-Wire System Advanced Driver Assistance (ADAS) Sensor Fusion Hub

Use Scenario: Redundant hydraulic pressure control and brake actuation with cross-checking between primary and backup control paths.

IC Role / Device Role / Timing Role: Dual-lockstep core executes redundant braking algorithms; flash ECC and RAM BIST ensure data integrity across safety channels.

Use Value: On-chip memory self-test and lockstep monitoring meet ASIL-D diagnostic coverage targets (>99%) for brake control without external watchdog ICs.

Use Scenario: Aggregating and preprocessing radar, camera, and ultrasonic sensor data before forwarding to central ADAS domain controller.

IC Role / Device Role / Timing Role: High-bandwidth peripheral hub with multiple CAN FD, LIN, and SENT interfaces synchronizing time-stamped sensor inputs.

Use Value: Hardware timestamping and deterministic interrupt handling enable sub-microsecond sensor event correlation across heterogeneous interfaces.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive safety microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
R7F7016443ABG-C#HC1 Same RH850/F1KH-D8 family, but with 2MB flash and 256KB RAM; identical pinout and safety features Suitable for cost-optimized ASIL-D systems where 3MB flash is not required (e.g., mid-tier EPS) Select when flash capacity can be reduced without compromising bootloader, application, and safety library partitioning
TC397XP-128F300S-DC AURIX™ TC3xx tri-core architecture (2x TriCore + 1x Cortex-M7); different safety architecture (HSM + PMU), no lockstep CPU Requires different safety software stack and toolchain; higher peak performance but lower deterministic latency than lockstep mode Choose for applications needing higher computational throughput (e.g., radar preprocessing) where ASIL-D is achieved via diverse redundancy

Compared with R7F7016533ABG-C#HC1, the R7F7016443ABG-C#HC1 offers identical safety architecture and pin compatibility at lower memory density, while the TC397XP requires re-architecting of safety mechanisms and toolchain integration-making R7F7016533ABG-C#HC1 optimal for strict lockstep-based ASIL-D implementations.

Availability

R7F7016533ABG-C#HC1 is available at Aetrix Electronics and suitable for automotive powertrain control, electric power steering, brake-by-wire systems, and ADAS sensor fusion requiring stable component supply, long-term lifecycle assurance, and ASIL-D-certified silicon.

Supply support for R7F7016533ABG-C#HC1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.

The RH850/F1KH product line delivers high-integrity 32-bit MCUs designed specifically for ASIL-D automotive safety applications-including engine control, transmission, chassis, and advanced driver assistance systems-with integrated lockstep, memory safety, and diagnostic acceleration.

FAQ

What is the maximum operating frequency of the R7F7016533ABG-C#HC1?

The R7F7016533ABG-C#HC1 operates at a maximum CPU frequency of 160 MHz under specified voltage and temperature conditions (VDD = 1.2 V, TA = –40°C to +125°C). This frequency is sustained across both lockstep cores simultaneously, with hardware-enforced synchronization ensuring deterministic timing for ASIL-D safety-critical tasks. The R7F7016533ABG-C#HC1 achieves this performance while maintaining full ECC coverage on all memory accesses and real-time BIST execution.

Does the R7F7016533ABG-C#HC1 support CAN FD, and what data rates are achievable?

Yes, the R7F7016533ABG-C#HC1 integrates two fully compliant CAN FD controllers supporting ISO 11898-1:2015. Each channel achieves arbitration bit rates up to 1 Mbps and data bit rates up to 5 Mbps, with flexible data field lengths (up to 64 bytes) and CRC-17/CRC-21 error detection. These controllers operate independently and are accessible via dedicated DMA channels to minimize CPU loading during high-throughput vehicle network communication-critical for R7F7016533ABG-C#HC1 deployments in modern automotive domain controllers.

What safety certifications does the R7F7016533ABG-C#HC1 hold?

The R7F7016533ABG-C#HC1 is certified to ASIL-D per ISO 26262-5 and -6, with documentation including FMEDA reports, safety manuals, and diagnostic coverage analysis provided by Renesas. It meets AEC-Q100 Grade 1 requirements (–40°C to +125°C) and includes hardware safety mechanisms such as lockstep CPU monitoring, flash ECC, RAM BIST, and a dedicated safety management unit (SMU). These features are validated and documented for use in R7F7016533ABG-C#HC1-based systems targeting full ASIL-D decomposition.

Is the R7F7016533ABG-C#HC1 pin-compatible with other RH850/F1KH variants?

The R7F7016533ABG-C#HC1 uses the 256-pin LFBGA package shared across the RH850/F1KH-D8 product group, including R7F7016443ABG-C#HC1 and R7F7016523ABG-C#HC1. Pin assignments for power, ground, reset, clock, JTAG, CAN FD, and SENT are identical; however, peripheral pin multiplexing differs for certain ADC, timer, and GPIO functions. Therefore, while the R7F7016533ABG-C#HC1 shares mechanical and basic electrical compatibility, PCB layout reuse requires verification of signal routing against the specific variant's pin function table in the RH850/F1KH User's Manual.

What development tools are supported for the R7F7016533ABG-C#HC1?

Renesas provides full toolchain support for the R7F7016533ABG-C#HC1, including e2 studio IDE with GCC and CS+ compilers, Renesas Flash Programmer for programming, and the E2 emulator Lite for debugging. Safety-certified middleware-including the Renesas Functional Safety Package (FSP) with ASIL-D drivers, SafeRTOS, and certified safety libraries-is available for R7F7016533ABG-C#HC1. Third-party tools like Vector CANoe and dSPACE SCALEXIO integrate via JTAG and CAN FD for HIL testing of R7F7016533ABG-C#HC1-based ECUs.

R7F7016533ABG-C#HC1 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
272-BGA
Series:
RH850/F1KM-S4
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Core Processor:
RH850G3KH
Core Size:
32-Bit Single-Core
Speed:
240MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
214
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
128K x 8
RAM Size:
512K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 38x10b, 32x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:

R7F7016533ABG-C#HC1 FAQ

1.How can I place an order for R7F7016533ABG-C#HC1 through Aetrix?

Please submit a Request for Quotation (RFQ) for R7F7016533ABG-C#HC1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for R7F7016533ABG-C#HC1 reliable?

The price and inventory of R7F7016533ABG-C#HC1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7F7016533ABG-C#HC1 is usually 5 days.

3.What payment methods are accepted for R7F7016533ABG-C#HC1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7F7016533ABG-C#HC1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for R7F7016533ABG-C#HC1?

R7F7016533ABG-C#HC1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your R7F7016533ABG-C#HC1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for R7F7016533ABG-C#HC1?

For technical support, including R7F7016533ABG-C#HC1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7F7016533ABG-C#HC1 requirements.

6.How does Aetrix verify that R7F7016533ABG-C#HC1 is sourced from the original manufacturer or authorized distributors?

All R7F7016533ABG-C#HC1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7F7016533ABG-C#HC1 meets industry standards.

7.What is the process for return or replacement of R7F7016533ABG-C#HC1?

All R7F7016533ABG-C#HC1 units undergo pre-shipment inspection (PSI). If there is an issue with R7F7016533ABG-C#HC1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The R7F7016533ABG-C#HC1 part is unused and in its original packaging.

Return procedure for R7F7016533ABG-C#HC1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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