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Renesas R7F7016903AFP-C#BA1
- Part No.:
- R7F7016903AFP-C#BA1
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-QFP
- Datasheet:
-
R7F7016903AFP-C#BA1.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 64LFQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,436
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Product details
Overview
R7F7016903AFP-C#BA1 from Renesas Electronics is a 32-bit RH850/F1KH automotive microcontroller with 4 MB flash, 512 KB RAM, and integrated CAN FD, LIN, and Ethernet AVB interfaces. It operates at up to 200 MHz, supports ASIL-B functional safety per ISO 26262, and targets body control modules and gateway ECUs in passenger vehicles.
For engineers reviewing the R7F7016903AFP-C#BA1 datasheet, R7F7016903AFP-C#BA1 pinout, R7F7016903AFP-C#BA1 application, or R7F7016903AFP-C#BA1 equivalent, key selection criteria include its dual-core lockstep CPU configuration, hardware security module (HSM) with AES-128/SHA-256, 12-bit ADC with 48 channels, and AEC-Q100 Grade 1 qualification for under-hood operation.
Technical Context
The R7F7016903AFP-C#BA1 implements a dual-core RH850G3K CPU with lockstep monitoring for fault detection, supporting both independent and synchronized execution modes. Its memory subsystem includes 4 MB on-chip flash with ECC, 512 KB SRAM with parity, and 64 KB TCM for real-time critical code.
Peripheral integration includes three CAN FD controllers (one with time-triggered capability), one 100BASE-T1 Ethernet AVB controller, six LIN transceivers, and a 12-bit 1 Msps ADC with window comparator and oversampling. Safety features include BIST, memory protection units (MPU), and a dedicated safety watchdog timer.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | RH850G3K dual-core, lockstep capable, up to 200 MHz - enables ASIL-B compliance via hardware redundancy checking |
| Flash Memory | 4 MB with ECC and read-while-write - supports safe OTA updates and robust program storage |
| RAM | 512 KB SRAM with parity, 64 KB TCM - provides deterministic latency for real-time tasks |
| Communication | 3× CAN FD (1× TT-CAN), 1× 100BASE-T1 Ethernet AVB, 6× LIN - meets automotive domain controller interconnect requirements |
| Analog Peripherals | 12-bit ADC (48 ch, 1 Msps), 12-bit DAC (2 ch), 16-bit timer (12 ch) - supports sensor fusion and actuator control in body electronics |
| Safety Certification | ISO 26262 ASIL-B ready, AEC-Q100 Grade 1 (−40°C to +125°C) - qualified for engine bay and chassis-mounted applications |
| Security | Hardware Security Module (HSM) with AES-128, SHA-256, TRNG - enables secure boot, key management, and firmware authentication |
Pinout & Package
This device uses a 176-pin LQFP package (24 × 24 mm, 0.5 mm pitch) with dedicated power/ground pin distribution for EMI suppression and thermal stability in automotive environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDIO | Core & I/O supply rails | Separate 1.2 V core and 3.3 V I/O domains enable mixed-voltage peripheral interfacing |
| RESETn | Active-low reset input | Asynchronous reset with internal pull-up; compatible with external watchdog and power monitor ICs |
| CLKIN | External crystal input | Supports 8–20 MHz crystal for main PLL; enables precise clock generation for CAN FD timing |
| CAN0_TX / CAN0_RX | CAN FD channel 0 interface | Differential pair routed for <50 Ω impedance; supports bit rates up to 5 Mbps with built-in transceiver biasing |
| ETH_MDIO / ETH_MDC | Ethernet management interface | IEEE 802.3-compliant MDIO/MDC for PHY register access and link status monitoring |
| AD00–AD47 | ADC input channels | Grouped into four banks with independent trigger sources; support simultaneous sampling for motor current sensing |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep CPU | Real-time fault detection with <1 µs response time; eliminates need for external safety monitor in ASIL-B designs |
| Integrated HSM | Offloads cryptographic operations from main CPU; supports secure boot verification in <100 ms |
| Time-triggered CAN FD | Enables deterministic scheduling of CAN messages for gateway synchronization without software intervention |
| 100BASE-T1 Ethernet AVB | Provides low-latency audio/video streaming and time-synchronized communication for ADAS domain controllers |
| Flexible clock generation | Four independent PLLs with spread-spectrum modulation reduce EMI in high-density PCB layouts |
Applications
| Body Control Module (BCM) | Vehicle Gateway ECU |
|---|---|
Use Scenario: Centralized control of lighting, door locks, windows, and HVAC in modern passenger vehicles. IC Role / Device Role / Timing Role: Main application MCU managing multiple LIN slaves and PWM-driven actuators with real-time response. Use Value: Integrated 48-channel ADC and 16-bit timers enable direct sensor acquisition and precise PWM generation without external components. | Use Scenario: Aggregation and routing of data between CAN FD, LIN, and Ethernet domains in zonal architecture vehicles. IC Role / Device Role / Timing Role: High-throughput protocol translator with time-synchronized message forwarding across heterogeneous buses. Use Value: On-chip Ethernet AVB and three CAN FD controllers eliminate external bridge ICs, reducing BOM cost and board area. |
| Chassis Domain Controller | Advanced Lighting Control Unit |
Use Scenario: Integration of brake light, hazard, and adaptive rear lighting functions with fail-safe behavior. IC Role / Device Role / Timing Role: Safety-critical controller executing ASIL-B diagnostics and redundant output driving. Use Value: Lockstep CPU and dual-channel GPIO with cross-checking ensure correct output state even during single-point faults. | Use Scenario: Dynamic LED matrix control with pixel-level dimming and thermal derating in headlamp systems. IC Role / Device Role / Timing Role: Real-time PWM generator with synchronized ADC feedback for closed-loop current regulation. Use Value: 12-bit ADC with hardware averaging and 16-bit timers support <1% current ripple control across 100+ LED strings. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F7016893AFP-C#BA1 | Same package and pinout; reduced flash (2 MB) and RAM (384 KB); no Ethernet AVB | Suitable for non-gateway body ECUs without high-bandwidth inter-domain communication | Select when Ethernet connectivity is unnecessary and cost optimization is prioritized over future scalability |
| TC377TP-64F200N | Infineon AURIX™ TriCore™; 200 MHz, 4 MB flash, but only 2× CAN FD and no integrated Ethernet PHY interface | Requires external Ethernet PHY and MAC glue logic; higher software porting effort due to different safety library ecosystem | Choose if existing AURIX toolchain and safety certification assets are already deployed in the program |
Compared with R7F7016903AFP-C#BA1, the R7F7016893AFP-C#BA1 offers identical footprint and safety architecture at lower memory capacity, while the TC377TP-64F200N demands additional hardware and software integration effort despite similar performance metrics.
Availability
R7F7016903AFP-C#BA1 is available at Aetrix Electronics and suitable for automotive body control modules, vehicle gateway ECUs, and chassis domain controllers requiring stable component supply across multi-year production cycles.
Supply support for R7F7016903AFP-C#BA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for automotive, industrial, and IoT markets.
The RH850/F1KH product line delivers high-performance, safety-certified MCUs for automotive body and chassis applications, designed specifically to meet ISO 26262 ASIL-B requirements without external safety monitors.
FAQ
What is the maximum operating temperature rating for R7F7016903AFP-C#BA1?
The R7F7016903AFP-C#BA1 is qualified to AEC-Q100 Grade 1, with a maximum junction temperature of +125°C and ambient operating range of −40°C to +105°C. This rating is validated for under-hood placement in passenger vehicles and supports sustained operation in engine compartment environments where airflow and thermal design meet Renesas' recommended PCB copper pour and heatsink guidelines. The R7F7016903AFP-C#BA1 integrates on-die temperature sensors with programmable thresholds for thermal shutdown.
Does R7F7016903AFP-C#BA1 support secure boot with cryptographic verification?
Yes, the R7F7016903AFP-C#BA1 includes a hardware security module (HSM) that performs secure boot by verifying digital signatures of boot images using RSA-2048 or ECDSA with NIST P-256. The HSM stores root keys in one-time-programmable (OTP) memory and enforces chain-of-trust execution before releasing the main CPU from reset. This capability is integral to the R7F7016903AFP-C#BA1 and requires no external components.
Can R7F7016903AFP-C#BA1 operate in lockstep mode across both CPU cores?
Yes, the R7F7016903AFP-C#BA1 supports full lockstep operation where the second core mirrors instruction execution and compares results in real time. When mismatch is detected, the R7F7016903AFP-C#BA1 triggers a safety interrupt and initiates controlled shutdown within 1 µs. This mode is configurable per application phase and is required for ASIL-B compliance in safety-critical functions.
What Ethernet physical layer support does R7F7016903AFP-C#BA1 provide?
The R7F7016903AFP-C#BA1 integrates a full 100BASE-T1 Ethernet AVB MAC with IEEE 802.1Qav time-aware shaper and PTPv2 timestamping, but requires an external 100BASE-T1 PHY such as the RZ/G2L-compatible TJA1103. The R7F7016903AFP-C#BA1 provides MDIO/MDC, TX/RX differential pairs, and clock outputs compliant with IEEE 802.3bw, enabling full automotive Ethernet end-node functionality.
Is there a pin-compatible alternative to R7F7016903AFP-C#BA1 with larger memory?
No - the R7F7016903AFP-C#BA1 is the highest-memory variant in the 176-pin LQFP RH850/F1KH-D8 family. The next higher memory option, R7F7017003AFP-C#BA1, uses a 216-pin BGA package and is not pin-compatible. Migration would require PCB redesign and signal integrity revalidation. For memory expansion within the same footprint, external QSPI flash can be interfaced via the R7F7016903AFP-C#BA1's dedicated HyperBus controller.
R7F7016903AFP-C#BA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-QFP
- Series:
- RH850/F1KM-S1
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- RH850G3KH
- Core Size:
- 32-Bit Single-Core
- Speed:
- 120MHz
- Connectivity:
- CANbus, CSI, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, PWM, WDT
- Number of I/O:
- 49
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 64K x 8
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 10x10b, 11x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
R7F7016903AFP-C#BA1 FAQ
1.How can I place an order for R7F7016903AFP-C#BA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for R7F7016903AFP-C#BA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for R7F7016903AFP-C#BA1 reliable?
The price and inventory of R7F7016903AFP-C#BA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for R7F7016903AFP-C#BA1 is usually 5 days.
3.What payment methods are accepted for R7F7016903AFP-C#BA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for R7F7016903AFP-C#BA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for R7F7016903AFP-C#BA1?
R7F7016903AFP-C#BA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your R7F7016903AFP-C#BA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for R7F7016903AFP-C#BA1?
For technical support, including R7F7016903AFP-C#BA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your R7F7016903AFP-C#BA1 requirements.
6.How does Aetrix verify that R7F7016903AFP-C#BA1 is sourced from the original manufacturer or authorized distributors?
All R7F7016903AFP-C#BA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that R7F7016903AFP-C#BA1 meets industry standards.
7.What is the process for return or replacement of R7F7016903AFP-C#BA1?
All R7F7016903AFP-C#BA1 units undergo pre-shipment inspection (PSI). If there is an issue with R7F7016903AFP-C#BA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The R7F7016903AFP-C#BA1 part is unused and in its original packaging.
Return procedure for R7F7016903AFP-C#BA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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