Renesas R7F7016933AFP-C#AA1

Overview

R7F7016933AFP-C#AA1 from Renesas Electronics is a 32-bit automotive-grade MCU in the RH850/F1KH-D8 family, featuring dual-core lockstep operation, 4 MB on-chip flash, 512 KB SRAM, and integrated safety mechanisms (ECC, BIST, lockstep CPU) compliant with ISO 26262 ASIL-D. It supports CAN FD, LIN, FlexRay, and Ethernet AVB for vehicle domain controllers and brake-by-wire systems.

For engineers reviewing the R7F7016933AFP-C#AA1 datasheet, R7F7016933AFP-C#AA1 pinout, R7F7016933AFP-C#AA1 application, or R7F7016933AFP-C#AA1 equivalent, key selection criteria include ASIL-D certification status, dual-core lockstep timing alignment, flash ECC coverage scope, CAN FD data rate support up to 5 Mbps, and package thermal resistance in the 176-pin LQFP-EP (14 × 20 mm) footprint.

Technical Context

This MCU implements two tightly coupled RH850G3K-H cores operating in lockstep mode with cycle-accurate comparison logic and automatic fault containment. It integrates a 12-bit ADC with 48 channels, 32-bit timer units (GPTA/GPTB), and a dedicated Safety Management Unit (SMU) that monitors CPU execution, memory integrity, and peripheral health.

The device uses a multi-layer AXI/AHB bus matrix supporting concurrent access to flash, SRAM, and peripherals while maintaining deterministic latency for safety-critical tasks. Its clock system includes a 40 MHz PLL with spread-spectrum modulation and independent watchdog timers for both core and safety monitor domains.

Key Specifications

Pinout & Package

Package: 176-pin LQFP-EP (14 mm × 20 mm, 0.5 mm pitch) with exposed thermal pad for enhanced heat dissipation in automotive under-hood applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive safety microcontroller applications.

Compared with R7F7016933AFP-C#AA1, the R7F7016923AFP-C#AA1 offers identical safety architecture but trades Ethernet AVB and memory capacity for lower BOM cost, while the TC397XP requires full software requalification due to divergent core architecture and safety library dependencies.

Availability

R7F7016933AFP-C#AA1 is available at Aetrix Electronics and suitable for brake-by-wire systems, electric power steering ECUs, ADAS domain controllers, and vehicle gateway modules requiring stable component supply across extended automotive production lifecycles.

Supply support for R7F7016933AFP-C#AA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for automotive, industrial, and IoT markets.

The RH850 family was designed specifically for automotive safety-critical applications demanding ISO 26262 ASIL-D compliance, high reliability under harsh environmental conditions, and deterministic real-time performance.

FAQ

What is the maximum CAN FD data rate supported by R7F7016933AFP-C#AA1?

R7F7016933AFP-C#AA1 supports CAN FD up to 5 Mbps in data phase, with configurable bit timing and built-in CRC-17 calculation. This capability enables high-throughput communication for advanced driver assistance systems where sensor data must be transmitted with minimal latency. The CAN FD controller in R7F7016933AFP-C#AA1 also supports payload lengths up to 64 bytes and automatic protocol arbitration.

Does R7F7016933AFP-C#AA1 include hardware-based cryptographic acceleration?

Yes, R7F7016933AFP-C#AA1 integrates the Intelligent Cryptographic Unit / Master D (ICUMD), which provides hardware-accelerated AES-128-GCM, SHA-256, and RSA-2048 operations. This enables secure boot, authenticated firmware updates, and encrypted inter-ECU communication without burdening the main CPU. The ICUMD in R7F7016933AFP-C#AA1 is certified to Common Criteria EAL5+ for cryptographic module assurance.

What is the thermal resistance (θJA) of the R7F7016933AFP-C#AA1 LQFP-EP package?

The R7F7016933AFP-C#AA1 in its 176-pin LQFP-EP package has a typical junction-to-ambient thermal resistance (θJA) of 24.5 °C/W under JEDEC JESD51-7 standard PCB conditions (2s2p copper layers). This value assumes proper soldering of the exposed thermal pad to a solid ground plane. The thermal design of R7F7016933AFP-C#AA1 supports continuous operation at 125 °C ambient when used with appropriate board-level heatsinking.

Is R7F7016933AFP-C#AA1 qualified for engine compartment deployment?

Yes, R7F7016933AFP-C#AA1 is qualified for engine compartment use with an operating ambient temperature range of −40 °C to +125 °C and compliance with ISO 16750-2 for automotive electrical load dump and cold crank conditions. Its package construction, internal thermal monitoring, and voltage regulator robustness make it suitable for placement near powertrain control modules without additional cooling infrastructure.

What safety documentation is provided with R7F7016933AFP-C#AA1?

Renesas provides a complete ISO 26262 ASIL-D safety package for R7F7016933AFP-C#AA1, including FMEDA report, safety manual, hardware safety analysis summary, diagnostic software library, and safety-related test patterns. All documents are delivered under NDA and require registration via Renesas' Automotive Safety Support Portal. The R7F7016933AFP-C#AA1 safety package covers both silicon-level failure modes and system-level integration guidance.