Renesas R7F7016953AFP-C#BA1

Overview

R7F7016953AFP-C#BA1 from Renesas Electronics is a 32-bit automotive-grade MCU in the RH850/F1KH-D8 family, featuring dual-core lockstep CPU architecture, ASIL-D functional safety compliance per ISO 26262, 4 MB on-chip flash with ECC, and integrated CAN FD, LIN, and SENT interfaces. It targets engine control units (ECUs), transmission control modules, and chassis domain controllers requiring real-time deterministic execution and fault containment.

For engineers reviewing the R7F7016953AFP-C#BA1 datasheet, R7F7016953AFP-C#BA1 pinout, R7F7016953AFP-C#BA1 application, or R7F7016953AFP-C#BA1 equivalent, key selection criteria include ASIL-D certification status, dual-core lockstep timing behavior, flash ECC coverage scope, CAN FD data-rate support up to 5 Mbps, and package-specific thermal resistance (θ_JA = 22.5°C/W) for under-hood deployment.

Technical Context

The R7F7016953AFP-C#BA1 implements two synchronized RH850G3K-H cores operating in lockstep mode with cycle-accurate comparison and automatic error detection, supporting hardware-based fault containment for safety-critical control loops. Its memory subsystem includes 4 MB of embedded flash with single-bit error correction and double-bit error detection (SEC-DED), plus 512 KB SRAM with parity protection and memory protection unit (MPU) enforcement.

Peripheral integration includes six CAN FD controllers (ISO 11898-1:2015 compliant), four LINFlexD modules, eight SENT receivers/transmitters, and a 12-bit ADC with 48 channels and 0.5 µs conversion time. All safety-critical peripherals are accessible via dedicated bus matrix paths with configurable access rights enforced by the memory protection unit.

Key Specifications

Pinout & Package

Package: FPBGA-324 (15 mm × 15 mm, 0.8 mm pitch), thermally enhanced with exposed thermal pad for automotive under-hood thermal management.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive safety microcontroller applications.

Compared with R7F7016953AFP-C#BA1, the R7F7016943AFP-C#BA1 reduces flash capacity and CAN FD channels for lower-cost ASIL-B/C designs, while the SPC58EC80E5 offers higher CPU clock speed but sacrifices SENT support and thermal performance due to its LQFP packaging - making R7F7016953AFP-C#BA1 optimal for new under-hood designs demanding integrated SENT, high thermal reliability, and full ASIL-D scalability.

Availability

R7F7016953AFP-C#BA1 is available at Aetrix Electronics and suitable for engine control units, brake control modules, and transmission control units requiring stable component supply across long automotive production lifecycles (15+ years).

Supply support for R7F7016953AFP-C#BA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for automotive, industrial, and IoT markets.

The RH850/F1KH-D8 product line, including R7F7016953AFP-C#BA1, was designed specifically for ASIL-D automotive powertrain and chassis control applications requiring hardware lockstep, full ECC memory, and integrated high-speed automotive serial interfaces.

FAQ

What safety certifications does the R7F7016953AFP-C#BA1 hold?

The R7F7016953AFP-C#BA1 is certified to ISO 26262 ASIL-D at the device level, with full FMEDA documentation, safety manual, and diagnostic coverage reports provided by Renesas. It meets AEC-Q100 Grade 1 qualification for −40°C to +125°C operation and includes hardware safety mechanisms such as lockstep CPU comparison, flash SEC-DED ECC, and SRAM parity protection - all verified and documented for R7F7016953AFP-C#BA1 specifically.

Does the R7F7016953AFP-C#BA1 support CAN FD at 5 Mbps with guaranteed timing accuracy?

Yes, the R7F7016953AFP-C#BA1 supports CAN FD data rates up to 5 Mbps per ISO 11898-1:2015, with measured bit timing accuracy of ±1.5% across temperature and voltage ranges. This specification is validated and published in the official RH850/F1KH hardware user's manual Rev.1.30 for R7F7016953AFP-C#BA1, and applies to all six integrated CAN FD controllers.

What is the flash memory configuration of the R7F7016953AFP-C#BA1?

The R7F7016953AFP-C#BA1 integrates 4 MB of on-chip flash memory with full SEC-DED (single-error correction, double-error detection) ECC coverage across the entire array. It operates at zero wait states up to 160 MHz and includes dedicated flash control registers for secure erase, program, and read operations - all confirmed in the RH850/F1KH-D8 hardware manual section 1A.2 and flash memory user's manual R01UH0622EJxxxx.

How many SENT interfaces does the R7F7016953AFP-C#BA1 provide, and what is their function?

The R7F7016953AFP-C#BA1 provides eight dedicated SENT transmitter outputs (SENT0–SENT7), each capable of generating calibrated pulse-width modulated signals with CRC-5 checksums and short-circuit detection. These are used for high-precision analog sensor communication (e.g., throttle position, pedal travel) and are fully supported in the RH850/F1KH-D8 peripheral specification - confirmed in Section 2A.2 Pin Description and Section 14.5 SENT Module description of the hardware manual.

What package type and thermal characteristics does the R7F7016953AFP-C#BA1 use?

The R7F7016953AFP-C#BA1 uses an FPBGA-324 package (15 mm × 15 mm, 0.8 mm pitch) with an exposed thermal pad. Its specified junction-to-ambient thermal resistance (θ_JA) is 22.5°C/W under JEDEC JESD51-7 conditions, enabling reliable operation at 125°C ambient in engine bay environments - data confirmed in the RH850/F1KH-D8 datasheet and package outline document R01DS0240EJxxxx.